ACF bonding process ,is the process of Chip ic/COF ic/FPC bonded to the LCD(Glass)/PCB/Film/FPC/ ,use the ACF tape as the medium connecting materials,use the hot bar/bonding head as the source of the heat and pressure,use the tooling as the holder,and the silicone rubber or teflon as the Cushioning material, all the ACF bonding process finished by the ACF bonding equipments.
ACF tape has little conductive particles in the conductive lines of the tape.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
This process is what produces the connection between the ACF tape and the components. Advanced Integrated Technologies is equipped to assist you with your ACF bonding process.
According to different LCD/LED/OLED and different screens, there are many ACF tapes models. ACF tape is the important medium of the ACF bonding process.
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
| Model(Hitachi) | Process type | For Glass |
| AC-823CY W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-832L W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-832L W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.5mm L100m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-7813KM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| MF-331-25 W2.0mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.5mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.2mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.0mm L50m | FOG Low Temp | For Touch Screen |
| AC-4255KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7206U-18 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.2mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-9851YM-35 W1.5mm L50m | FOG Low Temp | Common Glass |
| AC-9851YM-35 W2.0mm L50m | FOG Low Temp | Common Glass |
| AC-896C W1.5mm L100m | COG Low Temp | Thin Glass |
| Model(Sony) | Process type | For Glass |
| CP6920F3 W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.2mm L50m | COG Low Temp | Common Glass |
| CP34531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP34531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP35231 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP35231 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36931 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36931 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP33731 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP33731 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP31831 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP31831 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP1220 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP1220 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP13941 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP6920F W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.2mm L50m | COG Low Temp | Common Glass |
| CP920 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W2.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W2.0mm L100m | FOG Low Temp | For Touch Screen |
The source for heat and pressure in ACF bonding process is most often a hot bar/thermode/bonding head/bonding cutter.
Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple.
Tooling is designed to hold the components and position the ACF tape to line up correctly with the conductive pads on the PCB or other component.
The hot bar is then brought into contact with the ACF film over the top of the bonding pad, heated to the bonding temperature, and held for a specified time.
Tell us which products you want to bonding ,then we can suggest you the right ACF bonding equipments for you ..
ACF bonding equipment has been used in glass display applications for many years. It has recently become widely used in COF, COB,COG,FOG,FOB,FOF areas.
Industries that use this technology most are the mobile phone manufacturing, automotive industry, and LCD production, mobile computers, TV manufacturing, open cell panels factories, touch panel ,AD shower, Watch, Pad… factories. and many Labs who researching in the LCD/LED/OLED/MICRO LED/MINI LED displays industries.
Similar to Silicone rubber, Teflon tape is often used to provide evenly distributed pressure and temperature on the ACF bonding process.
Features of Teflon Tape :
1. Superior chemical resistance – hardly affected by acids and alkalis.
2. Excellent electrical properties, including little dielectric loss, high insulation resistance and breakdown voltage.
3. Extremely high volume resistivity and remain stable over a wide range of temperature.
4. Continuous use in a wide range of temperature from -100degC to +260degC
5. Lowest friction cofficient among all solid materials and excellent self-lubricating ability.
6. Non-adhesiveness and mold releasing property
7. Excellent weather and moisture resistance
8. Superior flame resistance
Shenzhen olian is a professional ACF bonding equipment design&making factory, We know all the ACF bonding process, we also offer all the bonding machine accessories and parts. Welcome you visit us .
Wechat/whatsapp:+86 18025364779, QQ:2307972393, https://bonding-machine.com
The Bonding Equipment use the ACF tape as the medium ,so it also named ACF bonding equipment /ACF bonding machine.According to different LCD/LED/OLED and different screens, there are many ACF tapes models. ACF tape is the important medium of the ACF bonding process.
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
ACF tape has little conductive particles in the conductive lines of the tape.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
The source for heat and pressure in ACF bonding is most often a hot bar/thermode/bonding head/bonding cutter.
Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple.
Tooling is designed to hold the components and position the ACF tape to line up correctly with the conductive pads on the PCB or other component.
The hot bar is then brought into contact with the ACF film over the top of the bonding pad, heated to the bonding temperature, and held for a specified time.
This process is what produces the connection between the ACF tape and the components. Advanced Integrated Technologies is equipped to assist you with your ACF bonding process.
Tell us which products you want to bonding ,then we can suggest you the right ACF bonding equipments for you ..
ACF bonding equipment has been used in glass display applications for many years. It has recently become widely used in COF, COB,COG,FOG,FOB,FOF areas.
Industries that use this technology most are the mobile phone manufacturing, automotive industry, and LCD production, mobile computers, TV manufacturing, open cell panels factories, touch panel ,AD shower, Watch, Pad… factories. and many Labs who researching in the LCD/LED/OLED/MICRO LED/MINI LED displays industries.
Shenzhen olian is a professional ACF bonding equipment design&making factory. Welcome you visit us .
Wechat/whatsapp:+86 18025364779, QQ:2307972393, https://bonding-machine.com
Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech manufacturer established in 2008, professional specialized in R&D, manufacturing and sales of LCD/LED/OLED module automatic bonding machines and other equipments
Olian insist on the product concept of ” High quality, High efficiency”, have successfully developed standard and custom products:
Olian Design&Make the best and latest LCD/LED/OLED COG/FOG/FOB/FOF/FPC/OLB/ACF/COF/TAB Bonding Machine for TV/Cell phone/Laptop/Pad/Watch/Touch Screens. All the repairing and produce automatic machines/equipements/tools,and all the parts,accessories.
Large, medium and small size COG machine, Semi-automatic COG machine, Automatic COG machine, ACF attach machine, IC bonding machine, COG pre-bonding machine, COG main-bonding machine, FOB bonding machine, FOG bonding machine, FPC bonding machine, SMT machine, Tear film machine, detection device, PLASMA, LCD clearing machine;
Auxiliary equipment: IC disassembling machine, ACF split machine, Molybdenum wire machine, Heating platform, Manual or pneumatic test stand, etc;
G + F laminating machine, G + G vacuum laminating machine, Touch screen ACF attach machine, Touch screen FOG, Hot press machine, PETOCA laminating machine, F + F, Automatic laminating machine, TP protective film laminating machine
TV repair machines:12-100inch COF bonding machine, LCD laser repair machine, LCD polarizer film repair machine,12-100 inch ACF attaching machine, COF bonding machine, PCB bonding machine, COF Pre-bonding machine, OLB Bonding machine;
LCD separate machine, LCD film machine, LCD laminating machine, LCD bubble remove machine, and other tools.
We also offer all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning sponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC ,all kinds of bonding press head( SU440C bonding head, Tungsten steel bonding head, Titanium alloy press head) production and maintenance, grinding or design and others,
Olian welcome customers to visit our company for technical exchange and business negotiation. Olian will do the best to provide you with high quality equipment and satisfactory service. Olian determined to become the leading brands of the smart automatic equipment bonding machine industry.
Olian Welcome agents and resellers from around the world,
Welcome OEM&ODM for you.
Some of our bonding machine working videos for your reference.
Bonding Machine, is the widely used machine in the LCD/LED/OLED, LCM/open cell/panel/screen/display produce factories and repairing service shops all over the world.
Our bonding machines,
The Bonding Machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED,OLED, TV/television, Laptop, Pad, Cell phone, Watch, Touch Panel, Ad Player, and all the flat and edge screens.
The Bonding Machine may consist of HD Digital Microscope, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process. The bonding press head may press the IC/FPC/COF onto the LCD/LED/OLED Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time. also some bonding machine use the Solder paste as the medium.
Glass cutting machine
Glass grinding and cleaning machine
COG bonding +FOG bonding machine
LCD back light assembling machine
Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below:
We also offer all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.
Shenzhen Olian welcome you visit us for more training if you want to buy any bonding machines.
ACF bonding head also name:ACF/TAB/COF/COG/FOG/FPC/FOF Bonding machine press head /bonding tip/welding heads/ Hot Bar / soldering heads / heater tip / heater tools/ thermode for hot bar / ACF Bonding machine cutter head/bonding cutter/heat cutter……
It have pulse heating and constant temperature bonding head.
Normal materials:
-SUS440C steel（440C不锈钢）
-Tungsten steel（钨钢，钨钢（硬质合金）具有硬度高、耐磨、强度和韧性较好、耐热、耐腐蚀等一系列优良性能，特别是它的高硬度和耐磨性，即使在500℃的温度下也基本保持不变，在1000℃时仍有很高的硬度 ）
-Titanium alloy (normal used in pulse heating bonding machine), （钛合金，脉冲压头一般用钛合金制作）
-Ceramic （陶瓷，一般用在COG压头）
-Brass （黄铜）
-and others.
It will be different sizes for different products, such as TV Panel/cell phone/Touch panel/camera/watch/ Heat Seal Paper/, every products have the different shapes and sizes, so we need to make the customized bonding head according to your products.
ACF Bonding head has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.
– TAB Bonding (TCP-PCB / TCP-LCD)
– COG Bonding (IC-LCD)
– COB Bonding (IC-PCB)
– COF Bonding (COF-LCD/PCB)
– FOG Bonding(FPC-LCD)
– FOB Bonding(FPC-PCB)
– FOF Bonding(FPC-FPC)
– Plasma Display (FPC-PDP)
– Flip Chip Package
– ……
-Heat cure
-Fast bonding time
-High adhesion to plastic PET,COF & FPC, substrate
-Excellent thermal stability
-Good contact resistance for reliability
-Good corrosion resistance
-Excellent chemical resistance
-Good for wide bonding temperature range
-Replaces solder for lead-free solution
Shenzhen Olian Automatci Equipment make all the ACF bonding machine heads/hot bar/welding tips……
Olian,is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD/LED/OLED module automatic bonding machine （COG/FOG/ FOB/ACF/COF/OLB/TAB/FOF bonding machine）and all the parts,accessories(ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.)
Welcome you visit us.
Tel:+86-755-23209022 Fax:+86-755-23209033
QQ:2307972393
Mobilephone/WeChat:+86 18025364779
WhatsApp/Line: +86 18025364779
E-mail:olian@szolian.com
Address: Floor 5,Building D, Sogood Science Park, Aviation Road, Sanwei Village, Xixiang Town, Bao’an District, Shenzhen, China
TAB bonding machine ,upto 100inch panel doubel press head single screen COF bonding machine/ACF bonding machine/TAB bonding machine
Welcome to be our sales and service agents /dealers in your country.
TAB bonding machine, also name COF bonding machine, ACF bonding machine, OLB Bonding machine, Chip on Film bonding machine. COF(Chip on Film, Chip on Flex).COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The COF Bonding machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the COF bonding machine is Pulse heating bonding machine with Titanium alloy press bonding head.
Our TAB bonding machine and all the accessories list for TV/laptop panel repairing as below:
We also offer all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.
Wechat/Whatsapp:+8618025364779
Machine Operating Video in Youtube:
OL-TVCBM-1285-DH-SH-SS- SPEC.pdf
TAB bonding machine is a widely used machine all over the world. This bonding machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED, and television. This bonding machine may consist of has two Digital Microscope, and also has a Digital Pressure Gauge. The ACF bonding machine consists of vacuum generator which may help to hold the panel during the bonding process. It may also provide the quick as well as easy solutions for various mobile problems. COF (TAB Bonding Machine ) is fast as well as it is very easy to access this bonding machine. This bonding machine is able to provide high accuracy repair apparatus for repair different size of the LED or LCD screen as well as LCD Panel. COF bonding machine also consists a process of repairing the technical equipment in an easy way.
We provide the various sizes and types of this machine, as well as all the services, are available if any defect may occur in the machine. Anisotropic conductive film (ACF) bonding machine commonly use in connectivity with electrical and mechanical connections from electronics driver to glass substrate of the LCD/LED/TV. During the ACF bonding process, heat and pressure are applied via a thermode (or hot bar) on to the ACF film or other component that is sandwiching the ACF film.
TAB bonding machinehelps to repair LED,LCD,TV, of lining issues on panel . Ultimate solutions of bonding of COF (COF Bonding Machine)with fast and easy to operate bonding machine. it is a kind of high precision repair equipment for repair various size LED/LCD screen/LCD Panel.
Single Head Manual platform ACF/TAB/COF Bonding machinefor TV repair,Television repair,Panel repair,screen repair.
1) Machine Model Number: OL-1285-DH/SH-SS (Single Head &Double head)
2) Device Description :Screen Repair machine / LCD Bonding machine
3) Device Uses :FPC、 COF、TAB、 LCD Panel and PCB combination bonding
4) Applicable LCD panel specifications :12″-100″(65″,85″100″ options)
5) Applicable LCD panel thickness :0.3MM-1.1MM[Single glass]
6) Bonding IC number :Multiple / Panel Can be set
7) Bind direction :X or Y Unidirection
8) Bonding IC size :Replaceable blade according to IC specifications (The original machine is equipped45X1.5X10)
9) Device processing time :TFT，3.8S/chip
10) Production Beats :TAB，100 pcs/H
11) TAB Bonding machine Accuracy :Within ± 1.5μm (support 4K screen)
12) Highest positioning accuracy setting :±0.5μm (Currently domestic the highest index)
13) Equipment requirements the work environment :Clean, No dust, Clean room
14) Supply Pressure :0.5~0.7Mpa (Dry air source)
15) Power Supply :AC 220V±10%，50HZ，3500W
16) Cylinder Device :Japan SMC original thin cylinder MXS20-75/MXS20-100
17) Heating Type :Pulse (rapid heating / cooling and auxiliary cooling function)
18) PID Temperature Control System :Brand: YUDIAN (516 model)
Adjustable heating curve Precision PID self-tuning type
The peak temperature : within +/- 3 degrees Celsius
Room temperature time to 180 degrees the response time within 2-3 seconds
19) TAB bonding machine Hot pressing head :
Materials: Japan Titanium
origin: United States
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times grinding)
20) Thermocouple Type :K type Original US OMEGA wire
21) Industrial control units / Programmer :Import Panasonic PLC FX－C40T
22) Image unit :
Panasonic image processing system
COF counterpoint: down counterpoint
PCB counterpoint : UP counterpoint
Number of lenses : 4
Microscopy: 30-120 Continuous zoom
COF Display: 19-inch HD 1PCS
PCB counterpoint the display : same (Can be installed )
Upper light source : have
Down light source : have
23）COF trimming unit :
Origin: Taiwan
Rail Type: U-rail (2056 high)
Accuracy : 0.01
Adjustable direction :X/Y/R
R Itinerary : Coarse 360 degrees, fine tuning +/- 5 degrees
24）COF Fixture : COF mechanical clamping type, Z tilt radius micrometer trimming
25) Lens spinner unit :
Control mode: X / Y / Z micrometer control
Focus Adjustment: Manually adjust the focus
26) Position detection : None
27) Silicone / Teflon :Manual switching position
28) LCD stage (platform) :Manual sliding or fixed optional ,automatic stage can be customized
29) Alarm device :Pressure abnormal/ temperature anomalies / thermocouple abnormal / action abnormal
30) Hot press head counterpoint :Cylinder stop can be set at any position in the vertical direction
31) COF bonding machine Control mode :Touch screen + button operation Using Taiwan’s Wei Lun touch screen dual-core
32) Parameter setting :According to the need to set up Store multiple sets of hot pressing parameters
33) Rated voltage :180-220 (customizable 110V)
34) Peak power :400-2200W (Supports 68X1.5X10 lengthened tool bit
35) Maximum power :2200W
36) Actual power :500W
37) Body size :1200X1200x1380mm(L*W*H)
38) ACF bonding machine Machine weight :500KG
TAB bonding machine OL-TVCBM1285-DH/SH-SS , is our company in the R&D process , according to maintenance staff tailored high-end products , machine not only in the accuracy of the temperature and the mechanical accuracy do the precision design , the procedures also increases the glass and circuit board parameters direct selected function , working pressure automatically switch , greatly facilitate the technical staff selected the parameters , increased the tool bit preheating function , to ensure that the machine at any temperature difference can ensure heating rate and temperature accuracy , double head design , glass and circuit board independent bonding reached factory-class level , high bonding excellent rate、low repair rate , this COF bonding machine is the maintenance and after-sales staff preferred the classic model.
TAB bonding machine OL-1285-DH/SH-SS platform Up to 100inch, the COF/TAB/ACF Bonding machine for TV repair,Television repair,Panel repair,screen repair. Welcome you visit us,our website:www.szoulian.com, It is your best choose for your TV COF repairing.
液晶电视维修辅助设备耗材 ，ACF胶带 AC-7206，AC-2056,G450去除液，日立蓝胶，酒精，丙酮，酒精瓶，棉布，纳米海绵，棉签，COF裁切刀，空压机，显微镜，热风枪，石英条，硅胶皮，铁氟龙，精密镊子，六角扳手，烙铁头，放大镜，校正仪，LVDS链接线, 驱动测试板等，免费随机附送整套，免费来厂学习，免费打出口木箱，欢迎来厂试机购买。
| 1 | ACF AC-7206-18 1.5*50M Glass side ACF胶带 | |
| 2 | ACF AC-2056R-35 2.0*50M PCB side ACF胶带 | |
| 3 | ACF Removing Liquid G-450 1000ML ACF去除液 G450 | |
| 4 | Acetone Liquid BT-H1-500ML 丙酮 | |
| 5 | Hitachi Blue Glue 100ML 蓝色胶水 | |
| 6 | Fuji Silicone 50M 硅胶皮 | |
| 7 | Teflon 50M 铁氟龙 | |
| 8 | Alcohol 酒精 | |
| 9 | Heating Solder Iron 30W +T-Type Soldering Tips T型烙铁+硅胶条 | |
| 10 | Removing Wind Station Hot Air Gun 825+Fan 除风站 热风枪 | |
| 11 | Optical Microscope 显微镜 | |
| 12 | TAB Cutter COF切刀 | |
| 13 | Correction table 校正表 | |
| 14 | LVDS LVDS接头 | |
| 15 | LCD Test Board LCD测试板 | |
| 16 | Allen Key 六角扳手 | |
| 17 | Air Compressor OTS550 空压机 | |
| 18 | Static Wipe Cloth 静电擦拭布 | |
| 19 | Cotton swabs 棉签 | |
| 20 | Handheld Magnifier 手持放大镜 | |
| 21 | Precision Tweezers 精密镊子 | |
| 22 | Nano Sponge 纳米海绵 | |
| 23 | quatz bar spare one 备用石英条 | |
| 24 | Alcohol bottles 空酒精瓶 |
TAB/COF/ACF Bonding machine,12-65/85/100inch Single/Double Stations bonding head TV Repair machine,ACF/TAB/COF bonding machine for TV/laptop repair,Television repair,Panel repair,screen repair.
AMOLED bonding machine, is for AMOLED display produce and repair machine for TV/Cell phone/Watch/other AMOLED products. bonding the COFs on the flexible FPCs.
An organic light-emitting diode (OLED) is a light-emitting diode (LED) in which the emissive electroluminescent layer is a film of organic compound that emits light in response to an electric current. This organic layer is situated between two electrodes; typically, at least one of these electrodes is transparent. OLEDs are used to create digital displays in devices such as television screens, computer monitors, portable systems such as smartphones, handheld game consoles and PDAs. A major area of research is the development of white OLED devices for use in solid-state lighting applications.
There are two main families of OLED: those based on small molecules and those employing polymers. Adding mobile ions to an OLED creates a light-emitting electrochemical cell (LEC) which has a slightly different mode of operation. An OLED display can be driven with a passive-matrix (PMOLED) or active-matrix (AMOLED) control scheme. In the PMOLED scheme, each row (and line) in the display is controlled sequentially, one by one,whereas AMOLED control uses a thin-film transistor backplane to directly access and switch each individual pixel on or off, allowing for higher resolution and larger display sizes.
An OLED display works without a backlight because it emits visible light. Thus, it can display deep black levels and can be thinner and lighter than a liquid crystal display (LCD). In low ambient light conditions (such as a dark room), an OLED screen can achieve a higher contrast ratio than an LCD, regardless of whether the LCD uses cold cathode fluorescent lamps or an LED backlight.
The different manufacturing process of OLEDs has several advantages over flat panel displays made with LCD technology.
OLEDs can be printed onto any suitable substrate by an inkjet printer or even by screen printing, theoretically making them cheaper to produce than LCD or plasma displays. However, fabrication of the OLED substrate is currently more costly than that of a TFT LCD. Roll-to-roll vapor-deposition methods for organic devices do allow mass production of thousands of devices per minute for minimal cost; however, this technique also induces problems: devices with multiple layers can be challenging to make because of registration – lining up the different printed layers to the required degree of accuracy.
OLED displays can be fabricated on flexible plastic substrates, leading to the possible fabrication of flexible organic light-emitting diodes for other new applications, such as roll-up displays embedded in fabrics or clothing. If a substrate like polyethylene terephthalate (PET)can be used, the displays may be produced inexpensively. Furthermore, plastic substrates are shatter-resistant, unlike the glass displays used in LCD devices.
OLEDs enable a greater contrast ratio and wider viewing angle compared to LCDs, because OLED pixels emit light directly. This also provides a deeper black level, since a black OLED display emits no light. Furthermore, OLED pixel colors appear correct and unshifted, even as the viewing angle approaches 90° from the normal.
LCDs filter the light emitted from a backlight, allowing a small fraction of light through. Thus, they cannot show true black. However, an inactive OLED element does not produce light or consume power, allowing true blacks. Removing the backlight also makes OLEDs lighter because some substrates are not needed. When looking at top-emitting OLEDs, thickness also plays a role when talking about index match layers (IMLs). Emission intensity is enhanced when the IML thickness is 1.3–2.5 nm. The refractive value and the matching of the optical IMLs property, including the device structure parameters, also enhance the emission intensity at these thicknesses.
OLEDs also have a much faster response time than an LCD. Using response time compensation technologies, the fastest modern LCDs can reach response times as low as 1 msfor their fastest color transition, and are capable of refresh frequencies as high as 240 Hz. According to LG, OLED response times are up to 1,000 times faster than LCD,putting conservative estimates at under 10 μs (0.01 ms), which could theoretically accommodate refresh frequencies approaching 100 kHz (100,000 Hz). Due to their extremely fast response time, OLED displays can also be easily designed to be strobed, creating an effect similar to CRT flicker in order to avoid the sample-and-hold behavior seen on both LCDs and some OLED displays, which creates the perception of motion blur.
Shenzhen Olian Automatic Equipment have the OLED bonding machine for AMOLED screens.
if you need the machine for the OLED screen repairing, please contact us .
Welcome you visit us if you do the OLED edge screen/curved screen/full screen(Huawei mate10,mate 20,OPPO/VIVO/MI/Samsung S8/Apple X etc.) repairing and produce business ,please contact us and test our OLED bonding machine.
OLED-BONDING-machine
All the bonding machines ,welcome you visit us-Shenzhen Olian(Professional in design&making all kinds of bonding machines)
COG bonding machine, also name IC Bonding machine, Chips bonding machine, COF(chip on film),COG(Chip on glass) bonding machine, it is bonding the Chip IC on the glass using ACF conductive adhesive as medium, by a certain temperature, pressure, time, driver IC will be bonded onto the glass. it has Pre-Bonding and Main-Bonding machines . They are all constant temperature machines. it maybe have single station ,double stations, three stations, and maybe four stations.
*Suitable for multi variety small batch production
*Constant temperature heating system
*Panasonic PLC Control system
*FAST Visual processing system
*Imported Japanese CCD Automatic Contraposition Configuration
*Manual / automatic switching
*Imported electrical configuration
Model: CP005/CP006
Product Name: Semi-Automatic Mid/High-speed COG Pre-bonding machine
Suitable For: Suitable for IC bonded to the LCD which attached ACF
Size Range: 1~7 inch
Attach Precision: ±2.5UM
IC Size: L:2~40mm,W:0.8~3mm
Machine Capacity: 650pcs/H–1000pcs/H
Power Supply: 220V±10%,50HZ,1000W/1200W
Air Supply: 0.5~0.7MPa,dry air
Platform Size: 140*100MM
Platform Precision: ±0.01MM
Pressure Head Size: 40*2MM Customizable
Temp Range: 1~300℃
Time Range: 1~99.9
N.W: About 300KG/350KG
*PID Control Constant Temp Heating System,Automatic temperature compensation to ensure that the temperature of hot pressing is stable.
*Panasonic PLC Control system.
*Use high precision low-friction cylinder control pressure to ensure the accuracy of pressure control.
*High steel structure set, dual ceramic indenter configuration, to ensure the stability of the equipment.
*Imported electrical configuration，
*For OLED high-end products，high quality，high successful rate。
Product Name: 1-12 inch Triple Stations Semi-Automatic High-speed COG main-bonding machine
Suitable For: Suitable for IC bonded to the LCD which attached ACF
Size Range: 1~12 inch
Attach Precision: ±4.5UM
IC Size: L:2~40mm,W:0.8~3mm
Machine Capacity: 1100pcs/H
Power Supply: 220V±10%,50HZ,2000W
Air Supply: 0.5~0.7MPa,dry air
Platform Size: 150*100MM
Platform Precision: ±0.01MM
Pressure Head Size: 45*5MM Customizable
Temp Range: 1~400℃
Time Range: 1~99.9
Product Size:L1025*W750*H1400 MM
N.W: About 350KG
Product Name: 1-12 inch Double Stations Semi-Automatic Mid-speed Servo COG main-bonding machine
Suitable For: Suitable for IC bonded to the LCD which attached ACF
Size Range: 1~12 inch
Attach Precision: ±4.5UM
IC Size: L:2~40mm,W:0.8~3mm
Machine Capacity: 600pcs/H
Power Supply: 220V±10%,50HZ,1200W
Air Supply: 0.5~0.7MPa,dry air
Platform Size: 150*100MM
Platform Precision: ±0.01MM
Pressure Head Size: 45*5MM Customizable
Temp Range: 1~400℃
Time Range: 1~99.9
Product Size:L640*W700*H1320MM
Full automatic machine include all the glass loading/glass cleaning/IC Loading/ACF pre-attaching/COG pre-bonding/COG main-bonding /COG output.
*Constant temperature heating system
*Panasonic PLC Control system
*Human – Machine interface
*Imported electrical configuration
*High Precision contraposition system
*Include the glass loading,glass cleaning,IC loading,ACF pre-attaching,COG pre-bonding,COG main-bonding ,COG output processes,it is COG processes all in one machine.
Product Name: 1~7inch Full Automatic COG bonding line
Suitable For: Suitable for IC Bonding to the LCD, ACF attach, IC preload and pre-bonding, main-bonding,output, completed in one machine.
Size Range: 1~7 inch
Attach Precision: ±2.5UM
IC Size: L:2~40mm,W:0.8~3mm
Machine Capacity: 1000pcs/H
Power Supply: 220V±10%,50HZ,5000W
Air Supply: 0.5~0.7MPa,dry air
Platform Size: 150*100MM
Platform Precision: ±0.01MM
Pressure Head Size: 45*5MM Customizable
Temp Range: 1~300℃
Time Range: 1~99.9
Product Size: W1500*D2300*H1700MM
Shenzhen Olian Automatic Equipment design and make the COG bonding machine for LCD/LED/OLED screens of cell phone: HUAWEI，XIAOMI，VIVO，OPPO，Apple，Samsung…brands flat/edge screen models phones. If you are doing the LCD/LED/OLED TV/Cell phone/watch/touch panel produce,repairing and trading business, please contact us.
Wechat/whatsApp:+86 18025364779
ACF Tape/ACF Film is normally made up of two main components, namely Adhesive & conductive particles.
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
According to different LCD/LED/OLED and different screens, there are many ACF tapes models. ACF tape is the import medium of the bonding process.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
| Model(Hitachi) | Process type | For Glass |
| AC-823CY W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-832L W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-832L W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.5mm L100m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-7813KM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| MF-331-25 W2.0mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.5mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.2mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.0mm L50m | FOG Low Temp | For Touch Screen |
| AC-4255KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7206U-18 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.2mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-9851YM-35 W1.5mm L50m | FOG Low Temp | Common Glass |
| AC-9851YM-35 W2.0mm L50m | FOG Low Temp | Common Glass |
| AC-896C W1.5mm L100m | COG Low Temp | Thin Glass |
| Model(Sony) | Process type | For Glass |
| CP6920F3 W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.2mm L50m | COG Low Temp | Common Glass |
| CP34531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP34531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP35231 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP35231 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36931 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36931 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP33731 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP33731 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP31831 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP31831 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP1220 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP1220 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP13941 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP6920F W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.2mm L50m | COG Low Temp | Common Glass |
| CP920 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W2.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W2.0mm L100m | FOG Low Temp | For Touch Screen |
| TF-4200EB-45/1000ML | Blue | LCM Insulation protective adhesive |
| TF-4200EB-451/1000ML | Blue | LCM Insulation protective adhesive |
| TF-4200EB-452/1000ML | Blue | LCM Insulation protective adhesive |
| TF-4200EB-75/1000ML | Blue | LCM Insulation protective adhesive |
| Model(ACF Remover) | ||
| Remover/G-430/1L | Clean FPC Side | common |
| Remover/G-450/1L Thick | Clean IC Side | common |
| Remover/G-450/1L Diluted | Clean FPC Side | common |
| Remover/G-550/1L Thick | Clean IC Side | common |
| Remover/G-550/1L Diluted | Clean IC Side | common |
| Remover/G-650/1L Thick | Clean IC Side | common |
| Remover/G-650/1L Diluted | Clean IC Side | common |
Please contact us if you need any other ACF tapes and ACF removers.
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.
– TAB Bonding (TCP-PCB / TCP-LCD)
– COG Bonding (IC-LCD)
– COB Bonding (IC-PCB)
– COF Bonding (COF-LCD/PCB)
– FOG Bonding(FPC-LCD)
– FOB Bonding(FPC-PCB)
– FOF Bonding(FPC-FPC)
– Plasma Display (FPC-PDP)
– Flip Chip Package
– ……
Because of ACF bonding advantages and features ,the ACF bonding machine is becoming more and more popular and useful.
The Bonding Machine use the ACF tape as the medium ,so it named ACF bonding machine.
ACF Bonding Machine, is the widely used machine in the LCD/LED/OLED, LCM/open cell/panel/screen/display produce factories and repairing service shops all over the world.
The ACF Bonding Machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED,OLED, TV/television, Laptop, Pad, Cell phone, Watch, Touch Panel, Ad Player, and all the flat and edge screens.
The ACF Bonding Machine may consist of HD Digital Microscope, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process. The bonding press head may press the IC/FPC/COF onto the Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time.
According to the different bonding materials, the ACF bonding machine can be divided into different bonding machines.
COG bonding machine, also name IC Bonding machine, Chips bonding machine, COG(Chip on glass) bonding machine, it is bonding the Chip IC on the glass using ACF conductive adhesive as medium, by a certain temperature, pressure, time, driver IC will be bonded onto the glass. COG bonding machine has COG Pre-Bonding Machine and COG Main-Bonding Machine. They are all constant temperature machines. it maybe have single station ,double stations, three stations, and maybe four stations bonding machine.
FOG bonding machine, FOB bonding machine, FPC bonding machine, Flex cable bonding machine.FOG(FPC on glass )or FOB(FPC on PCB Board), FOF(FPC on FPC), also COF on Glass bonding, COF on board bonding, COF on film bonding. It have Pulse Heating Bonding Machines and Constant Temperature Bonding Machines.
ACF attaching machine which is attaching the ACF tape on the Glass/Board/FPC/COF before bonding. it also name ACF machine, ACF attachment machine, ACF Attached machine , ACF bonding machine , ACF pre-paste , ACF equipment , ACF pre-paste machines , ACF pre- affixed equipment, ACF single station machine , ACF multi-station machines and so on. The attaching machine, also can paste the Double-sided tape.
Semi Automatic LCM making machines include:COG pre-bonding machine, COG main-bonding machine , FOG（FOB) bonding machine, ACF attaching machine as below:
Full automatic COG bonding machine, it include the LCD cleaning, IC loading, ACF attaching on the glass, IC pre-bonding, and IC main-bonding processes.
Full automatic FOG bonding machine, It include the ACF attaching on the glass, FPC loading, FPC bonding on the glass and output to testing..
LCM full automatic produce machine include all the process of the COG and FOG bonding machines.
If you need the ACF bonding machines and the ACF tapes and all the accessories,please contact us Olian .Wechat/whatsapp:+86 18025364779,QQ:2307972393, E-mail:2307972393@qq.com
We offer all kinds of COF IC， chip on Film,chip on flex，TAB IC, TV Repair COF，LCD T-con COF IC， LCD TV COF IC, Samsung COF，AUO COF, BOE COF，LG COF, SHARP COF，PANISONIC COF，TOSHIBA COF，COF，PANDA COF， SONY COF，LCD COFS,COF bonding machine repairing for you .
COF is an IC packaging technology that uses a flexible printed circuit film as a carrier for a packaged chip. The gold bumps on the chip are bonded to the Inner Lead of the flexible substrate circuit by thermal compression bonding technique.
After the COF production is completed, the LCD panel module factory will cut the reel tape COF IC into single piece by the COF Punching Machine. There are outer leads of Input and Output on the flexible substrate circuit of the COF, the Input external pins will be bonded to the LCD glass substrate, and the Onput pins will be connected to the control signal printed circuit board ( PCB) .
COF package has High Density / High Pin Count, Fine Pitch, Gang Bond, High Throughput and High Reliability characteristics. In addition, it is lightweight, short, flexible and Reel to Reel production, which is not possible with other traditional packaging methods. For COF products, multi-chip or passive components can also be designed on the substrate circuit.
Some COF ic can not find,and may be stop produce,so need to find some replace COF to use. Some replace COF ic for reference only.
NT39562H-C12Q9A
8656-MCY61
RM76731FD-60y
NT39992H-C12E2A
8157-RCY60
RM76C30FA-F02
8656-FCY0B
NT61227H-C1217B
RM92A31FA-908
NT39525H-C14F1A
S6C2BD1-54U
DB7500-FD07SB
DB7501-FD02S
S6C2T94A01-58U
NT39823H-C6501A
8033-HCU67B
36-D064129
MT3196C-VE
EK77211CF129A
S6C1125-65
8033-HEX39
LH165V08-S332
S6C1125-62
RM92370FC-80K
S6C2BD1-54U
SPLC-1698A
DB7500-FD07SB
DB7501-FT03S
DB7501-FD03S
DB7501-FD03S
DB7501-FD07SB
MN838994LF-1
RM92122FA-058
RM92165FM-OE9
NT65060H-C0205A
MT3196B
NT61207H-C6802A
ICN9305-05
NT39931H-CO2F7A
S6C2BD1-55U
MT3173VF
8697-A
RM91C30FA-F01
RM91C30FB-F04
DB7500-FD04S
NT39992H-C12E2A
D160418NL-057-C1 108
LS08S6HT3A-C3LS
RM76320FB-61A
NT39931H-CO2F74
MT3173VF
DB7893-FT11M
S62B91-63
DB7500-FDO75B
S6C2BD1-58U
RM76153FS-0A1
MT3714VM
DB7501-FT03S
DB7501-FD03S
RM9113BFG-OG1
VH1L5032786-2L
S6CG239-52 H COF
NT39985H-C02M4A
S6C277J-54
RM9216EFA-OG6
DB78913-FT11M
S6C2BD1-55U
DB7500-FD07S
S62LD1-58U
DB7500-FD758
S6C2B91-63
DB7893-FT11M
RM76155FS-0A1
MT371UVM
D78913-63
RM92A131FD-90E
8160-C558
ICN9506-01
RM92A31FA-908
NT39658H-C1294A
NT 61227h C1217A
RM76731FD-60Y
NT65001H-C02P3A
DB7500-FD07SB
EK77211CFI29A
SSD3258UR1
DB7897B-FT08M
NT39935H-C5216B
8154-ECBM3
RM9216DFJ-OFP
RM92122FA-058
56C1104
NT39759H-C12E3C
RM92122FA-058
NT61610H-C07928
LS0856HEASHZ-C3LX
MT3753VD
DB7878-FS02U
ILI5381M2AB2
ILI305K5CD2
S6C2T96-60U
NT39573H-C6007A
S6C2T92J-55U
DB6894-FS06M
S6C277U-53U
RM76113FD-OCX
NT61702H-C6801A
NT39833H-C6511B
NT61720H-C12J3C
8157-RCBRG
MT3166VB
NT39980H-C5266A
NT39992H-C1279A/C
NT61804H-C6520A
RM927A1FF-61B
8159-KCBR8
HX8157-NCA03
ILI3102K6CB1-S
LS0610BH1-C2LX
LS0610BH1-C1LX
MT3220A-VA
NT39892H-C12H5A/B/C
RM92A31FA-908
SSD3273UR4
5253-ACBPQ
MT3725VB-10260UTE
Nt39548H-C5801A
NT61702H-C6801A……
All kinds of COF ic,
Samsung COF，AUO COF, BOE COF，LG COF, SHARP COF，PANISONIC COF，TOSHIBA COF，PANDA COF， SONY COF，LCD COFS ,Welcome you send your list to my Email:2307972393@qq.com, or Wechat:+8618025364779,We will reply you ASAP.
Related products:
COF bonding machine, also name TAB bonding machine, ACF bonding machine, OLB Bonding machine, Chip on Film bonding machine. COF(Chip on Film, Chip on Flex).COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The COF Bonding machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the COF bonding machine is Pulse heating bonding machine with Titanium alloy press bonding head.
This COF bonding machine is mainly designed for TV/Laptop/cellphone repairing, it is for LCD/LED/OLED Panel repairing with COF changing functions,so it is also named COF change machine, COF repair machine, TV bonding machine, TV Repair machine,Laptop repair machine,LCD panel repair machine,LCD bonding machine,LCD repair machine,LCD fix machine, and so on..
Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below:
We also offer all the COF Bonding machine accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.
We’re Professional LCD/LED/OLED Bonding Machine Manufacturer.
Design&Make the best and latest IC/COG/COF/FPC/FOG/FOB/COF/ OLB/PCB/TAB/ACF Bonding Machine for TV/Cellphone/Watch/Touch/Laptop Screens produce and repairing.
