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ACF machine

ACF Machine

ACF machine ,it may press the IC/FPC/COF onto the Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time. also some machine use the Solder paste as the medium.

bonding machine

It has pulse heat bonding machine and constant temperature bonding machine.

The machine may consist of HD Digital Microscope, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process.

The Machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED,OLED, TV/television, Laptop, Pad, Cell phone, Watch, Touch Panel, Ad Player, and all the flat and edge screens.It is the widely used machine in the LCD/LED/OLED, LCM/open cell/panel/screen/display produce factories and repairing service shops all over the world.

What is ACF bonding?

During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.

ACF machine Applications

ACF machine has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.

– TAB Bonding (TCP-PCB / TCP-LCD)

– COG Bonding (IC-LCD)

– COB Bonding (IC-PCB)

– COF Bonding (COF-LCD/PCB)

– FOG Bonding(FPC-LCD)

– FOB Bonding(FPC-PCB)

– FOF Bonding(FPC-FPC)

– Plasma Display (FPC-PDP)

– Flip Chip Package

– ……

Features

  • Heat cure
  • Fast bonding time
  • High adhesion to plastic PET,COF & FPC, substrate
  • Excellent thermal stability
  • Good contact resistance for reliability
  • Good corrosion resistance
  • Excellent chemical resistance
  • Good for wide bonding temperature range
  • Replaces solder for lead-free solution

Because of many advantages and features ,the machine is becoming more and more popular and useful.

Shenzhen Olian-ACF Machine Factory

深圳欧联,专业生产脉冲热压机,恒温热压机,FPC/FOG/FOB/FOF邦定机热压机,ACF贴附机,IC/CHIP/COG/COF预压机,COG/COF本压机,COF裁切机,液晶电视维修设备OLB/TAB/PCB/TCP,显微镜,等离子清洗机,COF冲切机,液晶屏生产维修耗材机器零配件等一站式服务。

一,ACF Bonding Machine 热压机(邦定机)

1.热压机介绍:

热压机是一种将两个预先上好助焊剂镀锡(ACF导电胶)的零件加热到足以使焊锡(ACF导电胶)熔化、流动的温度,固化后,在零件与焊锡(ACF导电胶)之间形成一个永久的电气机械连接设备。应不同产品,升温速度可供挑选。热压头确保温度平均,升温快速及使用寿命特长。压头特别采用水平可调设计,以确保组件受压平均。 温度数控化,清楚精密。备有数字式压力计,可预设压力范围。

热压机又称为邦定机 。根据热压的媒介不同,可以分为锡焊,ACF(异向导电胶带),ACP(异向导电胶水),TBF(热熔胶膜)。适用于FPC(柔性线路板),HSC(斑马纸),TAB与LCD及PCB的连接。 由于消费类电子产品中PCB或FPC的Pitch趋于细小化,传统锡焊工艺已经难以满足极细热压的要求。ACF制程已逐步被手机设计商所应用。

2.热压机 特点:

1、使用脉冲加热技术,温度控制精确,温度采样频率为0.1s。恒温加热方式,开机升温到预设温度后,温度恒定。2、单工作平台,旋转工作平台,左右移动式平台等多样化的工作模式。3、多段升温控制。4、实时温度曲线显示。5、硅胶带索引机构。6、CCD视觉系统,提供精确对位。7、大容量程序预存。8、触控操作界面,程序密码保护。

3.热压机 分类:

恒温热压机、脉冲热压机、双工位热压机、双压头脉冲热压机、台式热压机,立式热压机等

4.热压机  使用领域:

1.手机厂商,2电视机厂商,3.触摸屏厂商,4.电脑,5.LCD/LED/OLED等显示屏生产维修厂商 , 5.打印机 , 6.薄膜开关等

Bonding machine
Bonding machine

二,恒温热压机 (ACF Constant Temperature Bonding machine)

1.恒温热压机介绍

恒温热压机是热压机的一种,能够以恒温的状态一直工作,是用于液晶面板组装工艺中最为广泛的一种设备。

其主要功能是对液晶面板上ITO与ACF、FPC之间进行一种机械电子连接。随着这几年国内LCD行业的迅速发展,与其相关的设备产业也同样发展迅速,目前恒温热压机主要生产厂家聚集在深圳宝安。 恒温热压机属于电子制造设备的分支半导体设备,因此设备的精密度要求较高,一般都配备了视觉系统,设备设计一般禁止产生油污等污染空气的成分,所以一般配件使用气缸,精密线性滑轨等,而提供气源的空气机则选用无油空气机。一则有利于设备的寿命,二则对不会对工作的环境产生很大的油污粒子。

2.恒温热压机结构组成

恒温热压机一般由热压组件、微调夹具、视觉系统等部分组成。

3.恒温热压机产品分类

恒温热压机按安装方式可分为立式恒温热压机、台式恒温热压机。按热压头部件可分为单头恒温热压机,双头恒温热压机,三头恒温热压机,多头恒温热压机。按其使用功能可分为简易恒温热压机和多功能恒温热压机。按视觉对位可分为上对位恒温热压机,下对位恒温热压机,上下对位恒温热压机。按平台是否可移动,可分为固定式平台热压机,前后平台移动式热压机,旋转平台热压机,等等

4.恒温热压机的使用条件

恒温热压机的正常使用必须满足如下条件,机器所处位置的电源电压波动小,环境温度低于30摄氏度,相对湿度小于80%。机器的位置应远离振源、应避免阳光直接照射和热辐射的影响,避免潮湿和气流的影响。如机床器近有振源,则机床四周应设置防振沟。否则将直接影响机器的加工精度及稳定性,将使电子元件接触不良,发生故障,影响机器的可靠性。以附近无振源的万级无尘室为最佳。

FOG/FOB/FOF bonding machine
FOG/FOB/FOF bonding machine

三, ACF Pulse Heat Bonding Machine 脉冲热压机

1.脉冲热压机 (ACF Pulse Heat Bonding machine) 介绍

ACF Pulse Heat Bonding Machine, it use the pulse transformer to give a large current and low voltage to give high heat to the press head to bonding the COF/FPC on to the glass/PCB/FPC..

脉冲热压机利用变压器产生一个低电压的大电流,通过焊接头令其迅速发热。脉冲电流就是指电流的ON及OFF频率比例,此脉冲比例越大,电流输出越大,焊接头升温越快。脉冲热压机将工件置于夹具(如有需要,可启动真空将其固定)。将夹具送至焊接头下,按双开始键,焊接头下压着工件(开始加热),温度按输入参数迅速上升及准确恒温,可设多个温度(此时焊锡回流),吹气冷却(焊锡凝固),焊接头上升(完成)。目前手机电视等液晶屏的邦定大部分都是使用ACF胶带。

2.脉冲热压机 (ACF Pulse Heat Bonding machine) 工作原理

脉冲热压机通过在热压头上加载一定的脉冲电压,热压头发热,将与此相连接的物体升温,当温度升到焊锡熔点后(即升到事先设定的温度后),将与此相连的物体间锡(ACF导电粒子)熔融并将其连接在一起. 一般的脉冲热压机使用温度闭环的控制。

3.脉冲热压机 (ACF Pulse Heat Bonding machine) 工作特点

脉冲热压机主要应用在不能使用正常SMT+回流炉进行焊接的器件进行焊接操作,而使用烙铁进行焊接时容易出现焊接外观不一致、不平整,容易出现虚焊以及容易焊坏产品。而脉冲热压机则不同于恒温烙铁,脉冲热压机在通电瞬间即可达到所要温度,而一旦焊头两端不加电压,瞬间即可达到室温;而且焊头平整,所以焊接出来的外观平整一致,极少出现虚焊不良。脉冲加热焊接机可以通过温度反馈功能防止因散热产生的温度下降,和常时定温加热方式相比效率更高。预压工程中脉冲电流加热方法可以更有效的控制管理温度。加压后的热硬化方法可以防止ACF的偏移或导电粒子的未连接.

1、脉冲加热技术,快速升温、降温
2、具备温度校正/温度及时补偿功能,内置热压头温度过温保护功能
3、4个高清摄像头可独立上下、左右、前后三轴精确微调、对焦、对位
4、配备彩色触摸操作屏和高分辨率液晶显示屏,清晰观看对位情况再热压
5、PLC可编程控制器,可设置、储存多种工作程序
6、可更换不同尺寸的钛合金压头,热压各种不同品牌手机的排线/COF.
7、独有的双缸结构可消除压头自重,压力精准平衡,稳定
8、可根据不同产品以及ACF胶带要求,配置不同的升温速度、热压时间,压力等
9、工作台运用千分尺调节X,Y,Z, θ轴微调定位
10、适用各种手机触膜和显示排线,COF屏热压邦定, 11、排线,平台可根据产品设计专用的定位模具,并配备真空吸附,保证良率

4.脉冲热压机 (ACF Pulse Heat Bonding machine) 适用范围

脉冲热压机应用于手机厂商,电视机厂商,触摸屏厂商 ,电脑 ,平板,打印机等等厂家,

脉冲热压机应用在以下产品生产工艺中:COF与柔性屏的热压,COF与PCB的热压,COF与FPC的热压,排线热压、软排线FFC与软性线路板FPC或硬性线路板PCB的焊接、TCP与线路板PCB或软性线路板FPC之间的焊接、软性线路板FPC与线路板PCB之间的焊接热压等。

olian
深圳欧联

四,深圳欧联公司介绍– ACF Machine factory.

深圳市欧联自动化设备有限公司,专注 FPD 平板显示、3C 领域自动化装备自动化设备的研发、制造、销售及服务于一体的国家级高新技术生产企业。先后获得国家级高新技术企业及多项研发专利及著作权。目前公司拥有近五十人专业研发、生产管理、品质管理、售后服务专业团队,公司设有精密 CNC 机加中心(精密 CNC、车床、铣床、磨床、二次元等生产设备),具备从产品设计到生产加工的整体制造能力。自成立以来,以精湛的技术、优质的品质、高效的售后服务于客户,现已成为业内知名的 LCM 整线自动化设备解决方案商。

Shenzhen Olian Automation Equipment Co., Ltd. is a national high-tech manufacturing enterprise focusing on RPD flat panel display, 3C field automation equipment automation equipment research and development, manufacturing, sales and service. Olian has won state-level high-tech enterprises and a number of research and development patents and copyrights. At present, Olian has nearly 50 professional R & D, production management, quality management, after-sales service professional team, Olian has a precision CNC machine plus center (precision CNC, lathe, milling machine, grinding machine, two yuan and other production equipment), with product design To the overall manufacturing capacity of production and processing. Since its establishment, Olian has become a well-known LCM complete line automation equipment solution provider in the industry with its exquisite technology, high quality and efficient after-sales service.

现有产品主要包括:ACF 贴附系列、Plasma 端子清洗系列、单颗及多边多颗 COG/COF 邦定系列、单段及单边多段 FOG/FOF 邦定(恒温/脉冲)系列、OGS/On Cell/In Cell 热压系列、OLB 邦定系列,COF 冲裁各类非标设备以及智能化工厂整体解决方案等。

公司拥有国内最早研发 FPD 平板显示领域设备的资深技术团队。为让技术一直创新并突破,我们与浙江大学深圳研究院建立了长期专项合作,研发并取得了多项关键技术的突破性成果。目前公司产品主要应用在全面屏、OLED、LCM、BLU 等多个领域。现与创维集团、帝晶光电、重庆中光电、深圳国显、天山微电子、立德通讯、中光电科技、亚世光电、中山国信通、拓佳、科森光电、闻太、德景、福瑞达、光弘等国内外两百多家知名企业建立起了长期友好的合作关系。产品覆盖广东、广西、江苏、浙江、江西、辽宁、湖南、湖北、福建、重庆等全国 20 多个省市。

COF-bonder
COF-bonder

我们的宗旨是“品质至上、技术创新”。我们推崇“诚信经营、实事求是、互利合作、共同发展”的经营方针我们不断追求完善、力求做得更好。立志成为该行业具有代表性的公司!

深圳市欧联自动化设备有限公司的诚信、实力和产品质量获得业界的认可。欢迎各界朋友莅临参观、指导和业务洽谈。也欢迎各类有志人士加盟代理设备。

公司质量做到如下承诺:

1.我司保证所供设备为全新、合格的原装材料制成,并符合国家有关机械的国内、行业标准2.我司保证所开发设备能满足客户的使用需求3.我司对售出设备实行终生服务,并提供免费1年的设备维护及使用的相关技术指导服务4.我司负责一年内不少于6次关于设备使用情况的电话回访

关键词:热压机,脉冲热压机(邦定机),恒温热压机(邦定机),排线热压机,COF热压机,COF邦定机,FPC热压机,, FPC邦定机,FPC 脉冲热压机,手机排线热压机,银行U盾热压机, 斑马纸热压机,脉冲焊接机,ACF热压机,FOG热压机,FOB 热压机,FOF热压机,压排机,软排线热压机,绿排邦定机,液晶屏绑定机,COG热压机,

五,深圳欧联主要产品

bonding-machine-working-videos
bonding-machine

1.ACF贴附机 ACF attaching machine

ACF贴附机,ACF粘贴机,ACF贴胶机,玻璃端ACF贴附,IC端ACF贴附,PCB端ACF贴附,多段ACF贴胶机,多工位ACF邦定机,PCB ACF邦定机,大尺寸ACF贴胶机,600长ACF邦定机

ACF Attaching machine
ACF Attaching machine,OL-A003
ACF贴附机 大尺寸ACF贴附, OL-A022

2.IC/COF邦定机、COG/COF预压机,COG/COF 本压机。ACF BONDING MACHINE

2.1 COG预压机,半自动高速COG,COG邦定机,预压机,ic绑定机,IC邦定机,IC预压机,COF预压机,高速COG,COG邦定机,预压机,IC绑定机,IC邦定机,IC预压机, COF预压机 .

COG/COF Bonder
COG/COF pre-Bonder OL-COF003
COG预压机
COG预压机 OL-C003
高速COF预压机,High speed COF pre-bonding machine
高速COG预压机 OL-C005
COG 高速预压机
COG 高速预压机 OL-CB003

2.2 COG本压机,伺服本压机,OLED本压机,OLED热压机,COG本压机,IC本压机,OLED本压良率高机器,COF本压机,三头本压机,高速COG,COG本压机,本压机,COF本压机

伺服高端COG/COF本压机 OL-C012
伺服高端COG本压机 OL-C008
三头本压机 OL-C006

3.排线热压机-恒温热压机,脉冲热压机ACF Bonding Machine

3.1 恒温热压机 ,恒温压排机,FPC邦定机,FOG热压机,FPC热压机,FOG本压机,压排机,三星压排机,苹果压排机,手机屏压屏机,手机屏维修邦定机,,OGS邦定机,毛毛虫热压机  , 上下加热FOG热压机,三工位本压机,三头FPC邦定,国产苹果热压机 , 单工位脉冲机,上下对位热压机,压排机,FOG热压机,FOG邦定,手机维修机 , 单工位下对位FOG,苹果三星压排机,热压机

Pulse Heating Bonding Machine
FPC bonder
FPC bonder

3.2.脉冲热压机ACF Pulse Heat Bonding Machine,脉冲压排机,FPC邦定机,FOG热压机,FPC热压机,FOG本压机,压排机,三星压排机,苹果压排机,手机屏压屏机,手机屏维修邦定机,OLED邦定机,OLED本压机,ON-CELL热压机,斑马纸热压机,高清晰邦定机,FPC邦定,ONCELL,OLED产品, 转盘脉冲机,脉冲机,脉冲热压机,高精度热压机 , 万能热压机,万能排线邦定机,单工位压排机 , 上下对位脉冲机,脉冲邦定机,脉冲热压机

Pulse Heating Bonding Machine
FOG BONDER
ACF MACHINE
Pulse Heating Bonding Machine
ACF MACHINE
ACF MACHINE
ACF MACHINE

4.液晶电视维修机,液晶电视返修设备,大尺寸OLB设备,液晶屏返修机,COF邦定机, COF本压,PCB半自动预本压机 ,脉冲热压机ACF Pulse Heat Bonding Machine

COF邦定机
液晶屏维修设备
ACF MACHINE
COF bonder 双头液晶电视COF邦定机
ACF MACHINE
单头COF邦定机 液晶电视维修设备 OL-FPD85

5.COF冲裁机,COF冲切机

Pulse Heating Bonding Machine
COF冲拆机,COF裁切机
COF cutting machine

6.显微镜,金相显微镜,微分干涉显微镜, 等离子清洗机, IC拆解机 

Pulse Heating Bonding Machine
Pulse Heating Bonding Machine
Pulse Heating Bonding Machine

7.各种耗材,测温仪,测压仪,CCD,镜头,压头,石英条,COF裁切刀,ACF胶带,铁氟龙,硅胶皮,背光条,测试仪,ACF去除液,蓝胶,酒精,静电布等耗材

Pulse Heating Bonding Machine
Pulse Heating Bonding Machine
Pulse Heating Bonding Machine

8.COF屏/柔性屏/OLED屏/曲面屏/FOF邦定机 整套邦定生产方案

Pulse Heating Bonding Machine

深圳欧联,专业热压机,脉冲热压机,恒温热压机,ACF贴附机,COG/COF预压本压机,全自动,半自动生产设备,欢迎来厂参观打样。

Shenzhen Olian, professional in ACF machine over 10 years. Welcome you visit us any time. Thank you .



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ACF bonding process

ACF bonding process

ACF bonding process

ACF bonding process ,is the process of Chip ic/COF ic/FPC bonded to the LCD(Glass)/PCB/Film/FPC/ ,use the ACF tape as the medium connecting materials,use the hot bar/bonding head as the source of the heat and pressure,use the tooling as the holder,and the silicone rubber or teflon as the Cushioning material, all the ACF bonding process finished by the ACF bonding equipments.

ACF tape has little conductive particles in the conductive lines of the tape. 

acf bonding process

During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions. 

This process is what produces the connection between the ACF tape and the components.  Advanced Integrated Technologies is equipped to assist you with your ACF bonding process.

ACF bonding process sorts and conditions:

acf bonding process
ACF bonding process

According to different LCD/LED/OLED and different screens, there are many ACF tapes models.  ACF tape is the important medium of the ACF bonding process.

ACF Tape/ACF Film-ACF bonding process materials

ACF TAPE

ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.

-Adhesives

The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.

-Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.

ACF tape/ACF Anisotropic Conductive Film

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

Some ACF models:

Model(Hitachi)Process typeFor Glass
AC-823CY  W1.2mm  L100mCOG Low TempThin Glass
AC-823CY  W1.5mm  L100mCOG Low TempThin Glass
AC-823CY  W2.0mm  L100mCOG Low TempThin Glass
AC-8412KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-832L  W1.2mm  L100mCOG Low TempThin Glass
AC-832L  W1.5mm  L100mCOG Low TempThin Glass
AC-832L W2.0mm  L100mCOG Low TempThin Glass
AC-832L W2.5mm  L100mCOG Low TempThin Glass
AC-8622KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-7813KM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W2.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W2.0mm  L100mFOG Low TempCommon Glass
MF-331-25 W2.0mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.5mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.2mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.0mm  L50mFOG Low TempFor Touch Screen
AC-4255KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-3514-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7206U-18  W1.0mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.2mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.5mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W2.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.5mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W2.0mm  L50mFOG Normal TempCommon Glass
AC-9851YM-35  W1.5mm  L50mFOG Low TempCommon Glass
AC-9851YM-35  W2.0mm  L50mFOG Low TempCommon Glass
AC-896C  W1.5mm  L100mCOG Low TempThin Glass
Model(Sony)Process typeFor Glass
CP6920F3  W3.5mm  L50m COG Low TempCommon Glass
CP6920F3  W3.0mm  L50m COG Low TempCommon Glass
CP6920F3  W2.0mm  L50mCOG Low TempCommon Glass
CP6920F3  W1.5mm  L50m  COG Low TempCommon Glass
CP6920F3  W1.2mm  L50m  COG Low TempCommon Glass
CP34531  W1.5mm  L100m  COG Low TempThin Glass
CP34531  W2.0mm  L100m  COG Low TempThin Glass
CP36531  W1.5mm  L100m  COG Low TempThin Glass
CP36531  W2.0mm  L100m  COG Low TempThin Glass
CP35231  W1.5mm  L100m  COG Low TempThin Glass
CP35231  W2.0mm  L100m  COG Low TempThin Glass
CP36931  W1.5mm  L100m  COG Low TempThin Glass
CP36931  W2.0mm  L100m  COG Low TempThin Glass
CP33731  W1.5mm  L100m  COG Low TempThin Glass
CP33731  W2.0mm  L100m  COG Low TempThin Glass
CP31831  W1.5mm  L100m  COG Low TempThin Glass
CP31831  W2.0mm  L100m  COG Low TempThin Glass
CP1220  W1.0mm  L100m  FOG Low TempCommon Glass
CP1220  W1.2mm  L100m  FOG Low TempCommon Glass
CP1220  W1.5mm  L100m  FOG Low TempCommon Glass
CP1220  W2.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.2mm  L100m  FOG Low TempCommon Glass
CP13941  W1.5mm  L100m  FOG Low TempCommon Glass
CP13941  W2.0mm  L100m  FOG Low TempCommon Glass
CP6920F W3.5mm  L50m COG Low TempCommon Glass
CP6920F W3.0mm  L50m COG Low TempCommon Glass
CP6920F W2.0mm  L50mCOG Low TempCommon Glass
CP6920F W1.5mm  L50m  COG Low TempCommon Glass
CP6920F W1.2mm  L50m  COG Low TempCommon Glass
CP920  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP920  W2.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP923  W2.0mm  L100m  FOG Low TempFor Touch Screen
AC-7813KM specification

ACF tape data sheet(for example:7206U/2056R)

ACF hot bar/ACF bonding head-ACF bonding process heat and pressure source

The source for heat and pressure in ACF bonding process is most often a hot bar/thermode/bonding head/bonding cutter.

Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple. 

Tooling is designed to hold the components and position the ACF tape to line up correctly with the conductive pads on the PCB or other component. 

The hot bar is then brought into contact with the ACF film over the top of the bonding pad, heated to the bonding temperature, and held for a specified time. 


Tell us which products you want to bonding ,then we can suggest you the right ACF bonding equipments for you ..

ACF Bonding Equipment Applications

ACF bonding equipment has been used in glass display applications for many years.  It has recently become widely used in COF, COB,COG,FOG,FOB,FOF areas.  

ACF bonding equipment

Industries that use this technology most are the mobile phone manufacturing, automotive industry, and LCD production, mobile computers, TV manufacturing, open cell panels factories, touch panel ,AD shower, Watch, Pad… factories. and  many Labs who researching in the LCD/LED/OLED/MICRO LED/MINI LED displays industries.

  • TAB Bonding (TCP-PCB / TCP-LCD)
  • COG Bonding (IC-LCD)
  • COB Bonding (IC-PCB)
  • COF Bonding (COF-LCD/PCB)
  • FOG Bonding(FPC-LCD)
  • FOB Bonding(FPC-PCB)
  • FOF Bonding(FPC-FPC)
  • Plasma Display (FPC-PDP)
  • Flip Chip Package
  • ……

ACF Bonding equipment Features

  • Heat cure
  • Fast bonding time
  • High adhesion to plastic PET,COF & FPC, substrate
  • Excellent thermal stability
  • Good contact resistance for reliability
  • Good corrosion resistance
  • Excellent chemical resistance
  • Good for wide bonding temperature range
  • Replaces solder for lead-free solution

Silicon rubber and Teflon

Teflon Tape ( Teflon cushion)

Similar to Silicone rubber, Teflon tape is often used to provide evenly distributed pressure and temperature on the ACF bonding process.

Features of Teflon Tape :

1. Superior chemical resistance – hardly affected by acids and alkalis.

2. Excellent electrical properties, including little dielectric loss, high insulation resistance and breakdown voltage.

3. Extremely high volume resistivity and remain stable over a wide range of temperature.

4. Continuous use in a wide range of temperature from -100degC to +260degC

5. Lowest friction cofficient among all solid materials and excellent self-lubricating ability.

6. Non-adhesiveness and mold releasing property

7. Excellent weather and moisture resistance

8. Superior flame resistance

Shenzhen olian is a professional ACF bonding equipment design&making factory, We know all the ACF bonding process, we also offer all the bonding machine accessories and parts. Welcome you visit us .

Wechat/whatsapp:+86 18025364779, QQ:2307972393, https://bonding-machine.com

ACF Bonding equipment
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OLED-BONDING-machine

AMOLED Bonding Machine

AMOLED Bonding Machine

AMOLED bonding machine, is for AMOLED display produce and repair machine for TV/Cell phone/Watch/other AMOLED products.  bonding the COFs on the flexible FPCs.


What is OLED?

ACF bonding machine | COF Bonding machine | TAB bonding machine | OLB bonding machine | PCB bonding machine | FPC bonding machine | COG bonding machine | FOG bonding machine

An organic light-emitting diode (OLED) is a light-emitting diode (LED) in which the emissive electroluminescent layer is a film of organic compound that emits light in response to an electric current. This organic layer is situated between two electrodes; typically, at least one of these electrodes is transparent. OLEDs are used to create digital displays in devices such as television screens, computer monitors, portable systems such as smartphoneshandheld game consoles and PDAs. A major area of research is the development of white OLED devices for use in solid-state lighting applications.

There are two main families of OLED: those based on small molecules and those employing polymers. Adding mobile ions to an OLED creates a light-emitting electrochemical cell (LEC) which has a slightly different mode of operation. An OLED display can be driven with a passive-matrix (PMOLED) or active-matrix (AMOLED) control scheme. In the PMOLED scheme, each row (and line) in the display is controlled sequentially, one by one,whereas AMOLED control uses a thin-film transistor backplane to directly access and switch each individual pixel on or off, allowing for higher resolution and larger display sizes.

An OLED display works without a backlight because it emits visible light. Thus, it can display deep black levels and can be thinner and lighter than a liquid crystal display (LCD). In low ambient light conditions (such as a dark room), an OLED screen can achieve a higher contrast ratio than an LCD, regardless of whether the LCD uses cold cathode fluorescent lamps or an LED backlight.

OLED Advantages

The different manufacturing process of OLEDs has several advantages over flat panel displays made with LCD technology.

Lower cost in the future

OLEDs can be printed onto any suitable substrate by an inkjet printer or even by screen printing, theoretically making them cheaper to produce than LCD or plasma displays. However, fabrication of the OLED substrate is currently more costly than that of a TFT LCD. Roll-to-roll vapor-deposition methods for organic devices do allow mass production of thousands of devices per minute for minimal cost; however, this technique also induces problems: devices with multiple layers can be challenging to make because of registration – lining up the different printed layers to the required degree of accuracy.

Lightweight and flexible plastic substrates

OLED displays can be fabricated on flexible plastic substrates, leading to the possible fabrication of flexible organic light-emitting diodes for other new applications, such as roll-up displays embedded in fabrics or clothing. If a substrate like polyethylene terephthalate (PET)can be used, the displays may be produced inexpensively. Furthermore, plastic substrates are shatter-resistant, unlike the glass displays used in LCD devices.

Better picture quality

OLEDs enable a greater contrast ratio and wider viewing angle compared to LCDs, because OLED pixels emit light directly. This also provides a deeper black level, since a black OLED display emits no light. Furthermore, OLED pixel colors appear correct and unshifted, even as the viewing angle approaches 90° from the normal.

Better power efficiency and thickness

LCDs filter the light emitted from a backlight, allowing a small fraction of light through. Thus, they cannot show true black. However, an inactive OLED element does not produce light or consume power, allowing true blacks. Removing the backlight also makes OLEDs lighter because some substrates are not needed. When looking at top-emitting OLEDs, thickness also plays a role when talking about index match layers (IMLs). Emission intensity is enhanced when the IML thickness is 1.3–2.5 nm. The refractive value and the matching of the optical IMLs property, including the device structure parameters, also enhance the emission intensity at these thicknesses.

Response time

OLEDs also have a much faster response time than an LCD. Using response time compensation technologies, the fastest modern LCDs can reach response times as low as 1 msfor their fastest color transition, and are capable of refresh frequencies as high as 240 Hz. According to LG, OLED response times are up to 1,000 times faster than LCD,putting conservative estimates at under 10 μs (0.01 ms), which could theoretically accommodate refresh frequencies approaching 100 kHz (100,000 Hz). Due to their extremely fast response time, OLED displays can also be easily designed to be strobed, creating an effect similar to CRT flicker in order to avoid the sample-and-hold behavior seen on both LCDs and some OLED displays, which creates the perception of motion blur.

Shenzhen Olian AMOLED bonding machine

Shenzhen Olian Automatic Equipment have the OLED bonding machine for AMOLED screens.

if you need the machine for the OLED screen repairing, please contact us .

AMOLED bonding machine- ACF attaching machine

ACF-ATTACHING-MACHINE

AMOLED bonding machine- COF Pre-bonding machine

FPC bonding machine

OLED bonding machine- COF Final-bonding machine

ACF bonding machine|COF Bonding machine|TAB bonding machine|OLB bonding machine|PCB bonding machine|FPC bonding machine|COG bonding machine|FOG bonding machine|

Welcome  you visit us if you do the  OLED edge screen/curved screen/full screen(Huawei mate10,mate 20,OPPO/VIVO/MI/Samsung S8/Apple X etc.) repairing and produce business ,please contact us and test our OLED bonding machine.

OLED-BONDING-machine

OLED-BONDING-machine

All the bonding machines ,welcome you visit us-Shenzhen Olian(Professional in design&making all kinds of bonding machines)

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COF Punching Machine

COF Punching Machine

COF punchig machine, also named Automatic COF Punching Machine、COF cutting machine、COF cutter、COF Punching Equipment、 it have these features:

coif punching machine

1. the COF punching machine Optional online production or off-line production;

2. the machine With COF cleaning device and mechanical positioning function before cleaning, reduce foreign matter in production, mention production quality;

3. the COF punching machine Independent 4-station operation brings high efficiency and high productivity to production.

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