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Bonding Machines

Shenzhen Olian Automatic Equipment Co., Ltd

Bonding Machines

Bonding Machines,a machine bondind the IC ,FPC on the glass or plastic,pcb,..

ACF TAPE ACF FILM ACF BONDING

1. Bonding Machines

Shenzhen Olian Automatic Equipment Co., Ltd
fully automatic and semi automatic COF COP COG bonding amchine
  • FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.
  • COG Bonder: Used for bonding COG (Chip On Glass) components.
  • COF Bonder: Used for bonding COF (Chip On Film) components.
  • COP Bonder: Used for bonding COP (Chip On Plastic) components.
  • FOG Bonder: Used for bonding FOG (Flexible On Glass) components.
  • FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.
  • FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.
  • TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.
  • OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.
  • IC Bonder: Used for bonding IC (Integrated Circuit) components.
  • Glass Bonder: Used for bonding glass components.
  • LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.
  • LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.
  • Mini LED Bonder: Used for bonding mini LED components.
  • Micro LED Bonder: Used for bonding micro LED components.
  • Zebra Paper Bonder: Used for bonding zebra paper components.
  • Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.
  • Mobilephone Bonding Machine: Used for bonding components in mobile phones.
  • Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.
  • Wearable Equipment Bonder: Used for bonding components in wearable devices.
  • TV Panel Bonder: Used for bonding components in TV panels.
  • LCD Module Bonder: Used for bonding LCD modules.
  • Flat Panel Display Bonder: Used for bonding flat panel displays.

2. Bonding Processes and Materials

  • ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.
  • COG (Chip On Glass): A process where chips are directly mounted on glass substrates.
  • COF (Chip On Film): A process where chips are mounted on flexible substrates.
  • COP (Chip On Plastic): A process where chips are mounted on plastic substrates.
  • FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.
  • FOB (Flexible On Board): A process where flexible circuits are mounted on boards.
  • FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.
  • TAB (Tape Automated Bonding): A process where tape is used to bond components.
  • OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.
  • IC (Integrated Circuit): A small chip that contains a complex electronic circuit.
  • FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.
  • Zebra Paper: A type of conductive paper used in bonding processes.

3. Repair and Maintenance Equipment

  • LCD Repair Machine: Used for repairing LCD screens.
  • LED Repair Machine: Used for repairing LED screens.
  • OLED Repair Machine: Used for repairing OLED screens.
  • Amoled Repair Machine: Used for repairing Amoled screens.
  • Mini LED Repair Machine: Used for repairing mini LED screens.
  • Micro LED Repair Machine: Used for repairing micro LED screens.
  • TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.
  • LCD Panel Repair Machine: Used for repairing LCD panels.
  • LED Panel Repair Machine: Used for repairing LED panels.
  • OLED Panel Repair Machine: Used for repairing OLED panels.
  • Amoled Panel Repair Machine: Used for repairing Amoled panels.
  • Flex Cable Repair Machine: Used for repairing flex cables.
  • IC Remover: A tool used to remove ICs from circuits.
  • IC Remove Machine: A machine used to remove ICs from circuits.
  • Differential Interference Microscope: A microscope used to inspect bonding processes.
  • Metallurgical Microscope: A microscope used to inspect metal surfaces.
  • Industrial Tool Microscope: A microscope used for industrial inspections.
  • Large Size Upright Microscope: A large microscope used for detailed inspections.
  • Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.

4. Specific Applications and Solutions

  • Whole Line Solution for Intelligent Wearable Products: A comprehensive solution for producing intelligent wearable products.
  • Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.
  • Mobile Product Line Solutions: Solutions for producing mobile products.
  • PAD Display Product Line Solutions: Solutions for producing PAD displays.
  • Tablet Product Line Solutions: Solutions for producing tablet displays.
  • Notebook Product Line Solutions: Solutions for producing notebook displays.
  • Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.
  • High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.
  • Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.
  • Display Product Line Solution: A comprehensive solution for producing displays.
  • Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.
  • Electronic Paper Line Solutions: Solutions for producing electronic paper.
  • Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.
  • Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.
  • Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.
  • Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.
  • FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.
  • 3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.

5. Accessories and Parts

  • Bonding Machine Head: A part of the bonding machine used for bonding.
  • Bonding Machine Press Head: A part of the bonding machine used for pressing.
  • Bonding Machine Spare Parts: Various spare parts for bonding machines.
  • Bonding Machine Parts: Various parts for bonding machines.
  • ACF Tape: A tape used in bonding processes.
  • ACF Bonding Tape: A tape used in bonding processes.
  • ACF Glue: A glue used in bonding processes.
  • ACF Adhesive: An adhesive used in bonding processes.
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