Bonding Machines

Bonding Machines

Bonding Machines,a machine bondind the IC ,FPC on the glass or plastic,pcb,..

1. Bonding Machines

• FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.
• COG Bonder: Used for bonding COG (Chip On Glass) components.
• COF Bonder: Used for bonding COF (Chip On Film) components.
• COP Bonder: Used for bonding COP (Chip On Plastic) components.
• FOG Bonder: Used for bonding FOG (Flexible On Glass) components.
• FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.
• FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.
• TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.
• OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.
• IC Bonder: Used for bonding IC (Integrated Circuit) components.
• Glass Bonder: Used for bonding glass components.
• LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.
• LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.
• Mini LED Bonder: Used for bonding mini LED components.
• Micro LED Bonder: Used for bonding micro LED components.
• Zebra Paper Bonder: Used for bonding zebra paper components.
• Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.
• Mobilephone Bonding Machine: Used for bonding components in mobile phones.
• Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.
• Wearable Equipment Bonder: Used for bonding components in wearable devices.
• TV Panel Bonder: Used for bonding components in TV panels.
• LCD Module Bonder: Used for bonding LCD modules.
• Flat Panel Display Bonder: Used for bonding flat panel displays.

2. Bonding Processes and Materials

• ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.
• COG (Chip On Glass): A process where chips are directly mounted on glass substrates.
• COF (Chip On Film): A process where chips are mounted on flexible substrates.
• COP (Chip On Plastic): A process where chips are mounted on plastic substrates.
• FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.
• FOB (Flexible On Board): A process where flexible circuits are mounted on boards.
• FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.
• TAB (Tape Automated Bonding): A process where tape is used to bond components.
• OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.
• IC (Integrated Circuit): A small chip that contains a complex electronic circuit.
• FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.
• Zebra Paper: A type of conductive paper used in bonding processes.

3. Repair and Maintenance Equipment

• LCD Repair Machine: Used for repairing LCD screens.
• LED Repair Machine: Used for repairing LED screens.
• OLED Repair Machine: Used for repairing OLED screens.
• Amoled Repair Machine: Used for repairing Amoled screens.
• Mini LED Repair Machine: Used for repairing mini LED screens.
• Micro LED Repair Machine: Used for repairing micro LED screens.
• TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.
• LCD Panel Repair Machine: Used for repairing LCD panels.
• LED Panel Repair Machine: Used for repairing LED panels.
• OLED Panel Repair Machine: Used for repairing OLED panels.
• Amoled Panel Repair Machine: Used for repairing Amoled panels.
• Flex Cable Repair Machine: Used for repairing flex cables.
• IC Remover: A tool used to remove ICs from circuits.
• IC Remove Machine: A machine used to remove ICs from circuits.
• Differential Interference Microscope: A microscope used to inspect bonding processes.
• Metallurgical Microscope: A microscope used to inspect metal surfaces.
• Industrial Tool Microscope: A microscope used for industrial inspections.
• Large Size Upright Microscope: A large microscope used for detailed inspections.
• Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.

4. Specific Applications and Solutions

• Whole Line Solution for Intelligent Wearable Products: A comprehensive solution for producing intelligent wearable products.
• Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.
• Mobile Product Line Solutions: Solutions for producing mobile products.
• PAD Display Product Line Solutions: Solutions for producing PAD displays.
• Tablet Product Line Solutions: Solutions for producing tablet displays.
• Notebook Product Line Solutions: Solutions for producing notebook displays.
• Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.
• High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.
• Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.
• Display Product Line Solution: A comprehensive solution for producing displays.
• Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.
• Electronic Paper Line Solutions: Solutions for producing electronic paper.
• Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.
• Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.
• Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.
• Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.
• FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.
• 3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.

5. Accessories and Parts

• Bonding Machine Head: A part of the bonding machine used for bonding.
• Bonding Machine Press Head: A part of the bonding machine used for pressing.
• Bonding Machine Spare Parts: Various spare parts for bonding machines.
• Bonding Machine Parts: Various parts for bonding machines.
• ACF Tape: A tape used in bonding processes.
• ACF Bonding Tape: A tape used in bonding processes.
• ACF Glue: A glue used in bonding processes.
• ACF Adhesive: An adhesive used in bonding processes.