OL-FS120 Single-Station Servo-Driven FOG Bonder
High-Precision Manual FOG Bonding for 120-Inch Displays
Ideal for manufacturers of ultra-large LCD/OLED panels, including:
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OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder
High-Precision Manual FOG Bonding for 65-Inch Displays
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Integrated Thermal Compression Platform for Both FOG and FOB Processes with Sequential Rework Capability
The OL-FF-173 by Olian Automatic Equipment Co., Ltd. is a versatile semi-automatic bonding machine designed for medium-sized display modules up to 17.3 inches. It uniquely supports both FOG (Film-on-Glass) and FOB (Film-on-Board) processes—including pre-bonding, main bonding, and rework functions—all within a single integrated platform. This makes it ideal for pilot lines, small-batch production, or repair stations handling mixed product types.
The system features a single-side, multi-segment architecture that can process up to 6 FPCs or 6 PCBs along one edge of a panel in sequence. Operators can configure the machine to run FOG only, FOB only, or FOG followed immediately by FOB—without changing hardware. If both are enabled, the machine automatically completes all FOG steps first, then proceeds to FOB bonding on the same unit.
For FOG mode, the operator places the LCD panel on the glass worktable and activates vacuum suction. They then position the FPC(s) on the FPC stage and perform rough alignment. Using a live monitor feed, they fine-tune alignment visually. After pressing both start buttons, the pre-press head descends to temporarily bond the first segment. The platform then shifts automatically to the next position. This repeats until all pre-press zones are complete. Finally, the platform moves to the main bonding station. The main press head applies full heat and pressure to cure all segments at once.
If FOB mode is also enabled, the machine returns to the FOG pre-press station—but now treats the bonded module as a “panel” for FOB processing. The operator places a PCB on the worktable, aligns it with the existing FPC leads, and initiates another bonding cycle. This seamless transition eliminates manual transfer between machines and reduces handling damage.
All loading, alignment, and unloading occur from the same front position, improving ergonomics and workflow consistency.
Both pre-press and main-press heads operate within a temperature range of room temperature to 400°C, with surface uniformity held to ±5°C—ensuring reliable ACF curing. Bonding time is adjustable from 0.1 to 99.9 seconds.
Force output is independently controlled:
Standard press head dimensions are:
All heads are made of high-wear-resistant material and can be customized to match specific COF or PCB layouts.
The machine uses physical controls including Φ24 mm start and vacuum buttons, plus a Φ22 mm emergency stop switch. A three-color signal lamp indicates operational status (ready, running, fault). While the document does not specify PLC or touchscreen use, the process is fully automated once started—minimizing operator error.
Safety is reinforced by the dual-hand start requirement, preventing accidental activation during alignment.
Olian includes one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, common troubleshooting, and replacement of wear parts. Duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is provided beyond the warranty term.
The OL-FF-173 excels in environments requiring flexibility and rework capability—such as:
Its ability to perform FOG → FOB in one continuous flow significantly reduces cycle time and improves yield compared to using two separate machines.
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OL-F017 – 17-Inch Dual-Station In/Out Lower-Alignment FOG Bonding Machine (Touch Panel Customized)
High-Precision Semi-Automatic COF Bonding System for Touch Displays
The OL-F017 by Olian Automatic Equipment Co., Ltd. is a high-performance semi-automatic FOG (Film-on-Glass) bonding machine designed specifically for large-format touch panels up to 17 inches. It features a dual-station platform with in-and-out linear motion and lower-side visual alignment, enabling efficient, precise bonding of COF (Chip-on-Film) circuits onto LCD glass edges. This model is optimized for touch panel (TP) manufacturers requiring custom alignment workflows and stable thermal compression.
Unlike top-view alignment systems, the OL-F017 uses a bottom-mounted camera and monitor setup. Operators view alignment marks from below through the transparent glass substrate. This “lower alignment” method reduces parallax error and improves accuracy—especially critical for narrow-pitch COFs used in modern touch displays.
The machine operates with two independent workstations that move linearly between loading and bonding positions. While one station is under compression, the operator can load or unload the other—doubling throughput without extra labor. Both stations share the same bonding head but operate sequentially, ensuring consistent process control.
A single operator handles all steps from one position. They place the LCD panel on the glass platform and activate vacuum hold-down. Then they position the FPC on its dedicated stage. Using the live monitor feed, they manually adjust X/Y/θ alignment until the mark points match. Once confirmed as “OK,” they press both start buttons to begin the cycle.
The platform then moves automatically into the bonding zone. The heated press head descends, applies preset force and time, and completes the main bond. After bonding, the platform returns to the loading position. If enabled, the buffer tape advances once. The operator removes the finished panel and repeats the process.
The OL-F017 supports panels from 5 inches (112 × 65 mm) to 17 inches (380 × 240 mm) with thicknesses from 0.2 mm to 2.2 mm. FPC dimensions range from 12 × 12 mm to 60 × 60 mm, with a minimum mark-to-mark distance of 11 mm. The COF-to-glass step height must be at least 0.4 mm to ensure proper contact.
Bonding parameters are fully adjustable:
The standard FPC press head measures 60 mm × 1.0 mm but can be customized per customer requirements. Heating is fast and stable, using embedded cartridge heaters with real-time feedback.
The machine includes a 2x optical magnification lens with a 1.9 mm × 1.4 mm field of view. Lighting is provided by a coaxial LED source, eliminating shadows and enhancing mark contrast. The two camera lenses can be spaced from 11 mm to 90 mm apart, accommodating various COF layouts.
This lower-alignment design is ideal for transparent substrates like cover glass or OGS (One-Glass Solution) panels. It avoids interference from upper fixtures and provides a direct view of alignment targets.
The LCD platform measures 550 mm (W) × 320 mm (D). The FPC stage is 120 mm × 60 mm. The entire machine weighs approximately 380 kg and stands 1550 mm tall, with a work height of 860 ± 30 mm. Its footprint is 1550 mm (W) × 960 mm (D).
The frame is finished in industrial beige, while functional parts are chrome-plated or anodized for durability. All surfaces are delivered clean and dust-free. Warning labels are affixed near hot or moving components for safety.
Operation requires a cleanroom environment with temperature between 22°C and 27°C and humidity from 40% to 70% RH. The machine must be used in a dust-controlled, static-safe area to protect sensitive display components.
An integrated buffer tape mechanism manages ACF carrier film. It accepts tape with an inner diameter ≥33 mm and outer diameter ≤80 mm. The feed pitch is adjustable from 1 to 20 mm. If the tape fails to advance during operation, the system triggers an audible and visual alarm—preventing missed bonds.
Control is managed via PLC logic, a color touchscreen interface, and physical manual buttons. Emergency stop and dual-hand start functions ensure operator safety. The system also includes status indicators and fault diagnostics.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, troubleshooting, and replacement of wear parts. Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumables and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is available after warranty expiration.
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OL-FOG156 Series – 15.6-Inch Single-Side Multi-Zone FOG Bonding Machines
Flexible Thermal Compression Systems for High-Density COF Bonding on LCD Panels
The OL-FOG156 Series by Olian Automatic Equipment Co., Ltd. comprises two variants of semi-automatic single-station FOG (Film-on-Glass) bonding machines, engineered for multi-segment thermal compression of COF (Chip-on-Film) circuits onto one edge of large-format rigid LCD panels up to 15.6 inches.
Both models support sequential pre-bonding and main bonding in a single workflow, with operator-assisted visual alignment via monitor. The key difference lies in the press head length, enabling optimization for either long continuous COF arrays (OL-FOG156L) or shorter, discrete COF segments (OL-FOG156S).
⚠️ Note: These machines assume that ACF has already been applied. They perform thermal compression only, not ACF lamination or automated vision alignment.
| Feature | Specification |
|---|---|
| Panel Size | Max: 350 mm × 250 mm (~15.6″) Min: 150 mm × 80 mm (~7″) Thickness: 0.2–2.2 mm |
| Temperature Range | RT to 400°C (both pre-press & main press) |
| Press Head Uniformity | ≤ ±8°C across surface |
| Bonding Time | 0.1 – 99.9 seconds (programmable) |
| Pre-Press Force | 25 – 400 N |
| Main Press Force | OL-FOG156L: 55 – 1000 N OL-FOG156S: 25 – 400 N |
| Max FPCs per Edge | ≤10 pcs (OL-FOG156L) ≤ Number of main press heads (OL-FOG156S) |
| Operation | Manual loading → Vacuum fixation → Visual alignment → Dual-hand start → Auto sequential bonding |
| Control | Manual buttons + indicator lights (no PLC/touchscreen) |
| Safety | Emergency stop, dual-hand start, three-color status lamp |
| Parameter | OL-FOG156L (Long Head) | OL-FOG156S (Short Head) |
|---|---|---|
| Pre-Press Head Length | 55 mm × 1 mm (standard) | 55 mm × 1 mm (standard) |
| Main Press Head Length | 200 mm × 2 mm (standard) | 220 mm × 1 mm (standard) |
| Typical Use Case | Bonding long, continuous COF ribbons (e.g., single wide driver IC or multi-chip array spanning >150 mm) | Bonding multiple short, discrete COFs (e.g., 2–10 separate flex circuits along one edge) |
| Force Capability | Higher main press force (up to 1000 N) for robust bonding of wide areas | Moderate force (up to 400 N), sufficient for standard COF segments |
| Customization | Both heads customizable per customer layout |
💡 Design Insight: Despite the name “short,” the OL-FOG156S actually has a slightly longer nominal main head (220 mm vs. 200 mm), but it is thinner (1 mm vs. 2 mm) and optimized for modular, segmented pressure application—not continuous wide-area bonding.
This semi-automated multi-zone approach ensures consistent bonding quality across complex edge layouts without full automation cost.
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Ultra-High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-F0712 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. What sets it apart is its dual-camera vision system—featuring simultaneous top-view and bottom-view alignment—enabling unparalleled registration accuracy between COF terminals and ITO pads, even on multi-layer, opaque, or high-density interconnect (HDI) panels.
Combined with dual independent workstations, the OL-F0712 delivers both micron-level precision and continuous production throughput, making it ideal for demanding applications in automotive displays, medical imaging, avionics, and premium consumer electronics.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
This stereo alignment capability eliminates parallax and layer-shift errors—critical for panels with black matrix, touch sensors, or embedded layers.
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OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
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OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine with Lower-Side Fixed Alignment
The OL-F003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses lower-side visual alignment only, where operators view panel terminals from below through a single microscope while manually positioning the FPC from above.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to either the panel or the FPC. It performs main bonding only—fully curing the ACF joint under heat and pressure. It does not apply ACF, nor does it support IC or COF bonding.
Unlike dual-lens systems, the OL-F003 employs a single lower-view microscope. The operator places the panel on a transparent glass stage. They look through the microscope from below to see the panel’s terminal marks. Then, they manually place and adjust the FPC from above using visual estimation and experience.
This “lower-only” method is simple, cost-effective, and suitable for applications where ultra-high precision is not required or where FPC pads are large enough for manual placement tolerance.
The machine features two identical, fully independent bonding stations side by side. Each station includes:
Operators can work on one station while the other is idle, enabling continuous production. All loading, unloading, and alignment are performed manually at the front.
The entire bonding cycle is semi-automatic—alignment is manual, but pressing is controlled and repeatable.
Heating is delivered via embedded cartridge heaters, monitored by K-type thermocouples for stable thermal control.
An integrated buffer tape feed system protects the FPC during bonding:
All critical parameters—temperature, time, pressure—are set via the HMI for consistent results.
Compact footprint suits cleanrooms, pilot lines, and repair workshops.
Suitable for bonding:
Commonly used in:
Olian Automatic provides complete post-sale support:
Model: OL-F003
Type: Dual-Station Manual FOG Bonding Machine
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
Core Advantage: Simple, reliable, cost-effective manual bonding with dual-station throughput
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In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.
COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel
. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices
. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.
COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces
. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices
. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing
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COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays
. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices
.
FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices
. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications
.
FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics
. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes
.
FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays
. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.
ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG
. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines
.
TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities
. These machines are ideal for applications requiring high-density interconnections and compact designs
.
FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications
. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics
.
In addition to the above technologies, we also offer specialized bonding machines for various applications, including:
Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:
Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.
