ACF bonding process ,is the process of Chip ic/COF ic/FPC bonded to the LCD(Glass)/PCB/Film/FPC/ ,use the ACF tape as the medium connecting materials,use the hot bar/bonding head as the source of the heat and pressure,use the tooling as the holder,and the silicone rubber or teflon as the Cushioning material, all the ACF bonding process finished by the ACF bonding equipments.
ACF tape has little conductive particles in the conductive lines of the tape.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
This process is what produces the connection between the ACF tape and the components. Advanced Integrated Technologies is equipped to assist you with your ACF bonding process.
According to different LCD/LED/OLED and different screens, there are many ACF tapes models. ACF tape is the important medium of the ACF bonding process.
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
| Model(Hitachi) | Process type | For Glass |
| AC-823CY W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-823CY W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8412KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-832L W1.2mm L100m | COG Low Temp | Thin Glass |
| AC-832L W1.5mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.0mm L100m | COG Low Temp | Thin Glass |
| AC-832L W2.5mm L100m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.2mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.5mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W1.8mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.0mm L50m | COG Low Temp | Thin Glass |
| AC-8622KZ W2.3mm L50m | COG Low Temp | Thin Glass |
| AC-7813KM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813KM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7246KU-20 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7813YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-7823YM-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| MF-331-25 W2.0mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.5mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.2mm L50m | FOG Low Temp | For Touch Screen |
| MF-331-25 W1.0mm L50m | FOG Low Temp | For Touch Screen |
| AC-4255KU-18 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-4255KU-18 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.0mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.2mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W1.5mm L100m | FOG Low Temp | Common Glass |
| AC-3514-25 W2.0mm L100m | FOG Low Temp | Common Glass |
| AC-7206U-18 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.2mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-7206U-18 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.0mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W1.5mm L50m | FOG Normal Temp | Common Glass |
| AC-2056R-35 W2.0mm L50m | FOG Normal Temp | Common Glass |
| AC-9851YM-35 W1.5mm L50m | FOG Low Temp | Common Glass |
| AC-9851YM-35 W2.0mm L50m | FOG Low Temp | Common Glass |
| AC-896C W1.5mm L100m | COG Low Temp | Thin Glass |
| Model(Sony) | Process type | For Glass |
| CP6920F3 W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F3 W1.2mm L50m | COG Low Temp | Common Glass |
| CP34531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP34531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36531 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36531 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP35231 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP35231 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP36931 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP36931 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP33731 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP33731 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP31831 W1.5mm L100m | COG Low Temp | Thin Glass |
| CP31831 W2.0mm L100m | COG Low Temp | Thin Glass |
| CP1220 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP1220 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP1220 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.0mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.2mm L100m | FOG Low Temp | Common Glass |
| CP13941 W1.5mm L100m | FOG Low Temp | Common Glass |
| CP13941 W2.0mm L100m | FOG Low Temp | Common Glass |
| CP6920F W3.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W3.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W2.0mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.5mm L50m | COG Low Temp | Common Glass |
| CP6920F W1.2mm L50m | COG Low Temp | Common Glass |
| CP920 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP920 W2.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.0mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.2mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W1.5mm L100m | FOG Low Temp | For Touch Screen |
| CP923 W2.0mm L100m | FOG Low Temp | For Touch Screen |
The source for heat and pressure in ACF bonding process is most often a hot bar/thermode/bonding head/bonding cutter.
Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple.
Tooling is designed to hold the components and position the ACF tape to line up correctly with the conductive pads on the PCB or other component.
The hot bar is then brought into contact with the ACF film over the top of the bonding pad, heated to the bonding temperature, and held for a specified time.
Tell us which products you want to bonding ,then we can suggest you the right ACF bonding equipments for you ..
ACF bonding equipment has been used in glass display applications for many years. It has recently become widely used in COF, COB,COG,FOG,FOB,FOF areas.
Industries that use this technology most are the mobile phone manufacturing, automotive industry, and LCD production, mobile computers, TV manufacturing, open cell panels factories, touch panel ,AD shower, Watch, Pad… factories. and many Labs who researching in the LCD/LED/OLED/MICRO LED/MINI LED displays industries.
Similar to Silicone rubber, Teflon tape is often used to provide evenly distributed pressure and temperature on the ACF bonding process.
Features of Teflon Tape :
1. Superior chemical resistance – hardly affected by acids and alkalis.
2. Excellent electrical properties, including little dielectric loss, high insulation resistance and breakdown voltage.
3. Extremely high volume resistivity and remain stable over a wide range of temperature.
4. Continuous use in a wide range of temperature from -100degC to +260degC
5. Lowest friction cofficient among all solid materials and excellent self-lubricating ability.
6. Non-adhesiveness and mold releasing property
7. Excellent weather and moisture resistance
8. Superior flame resistance
Shenzhen olian is a professional ACF bonding equipment design&making factory, We know all the ACF bonding process, we also offer all the bonding machine accessories and parts. Welcome you visit us .
Wechat/whatsapp:+86 18025364779, QQ:2307972393, https://bonding-machine.com
ACF bonding head also name:ACF/TAB/COF/COG/FOG/FPC/FOF Bonding machine press head /bonding tip/welding heads/ Hot Bar / soldering heads / heater tip / heater tools/ thermode for hot bar / ACF Bonding machine cutter head/bonding cutter/heat cutter……
It have pulse heating and constant temperature bonding head.
Normal materials:
-SUS440C steel（440C不锈钢）
-Tungsten steel（钨钢，钨钢（硬质合金）具有硬度高、耐磨、强度和韧性较好、耐热、耐腐蚀等一系列优良性能，特别是它的高硬度和耐磨性，即使在500℃的温度下也基本保持不变，在1000℃时仍有很高的硬度 ）
-Titanium alloy (normal used in pulse heating bonding machine), （钛合金，脉冲压头一般用钛合金制作）
-Ceramic （陶瓷，一般用在COG压头）
-Brass （黄铜）
-and others.
It will be different sizes for different products, such as TV Panel/cell phone/Touch panel/camera/watch/ Heat Seal Paper/, every products have the different shapes and sizes, so we need to make the customized bonding head according to your products.
ACF Bonding head has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.
– TAB Bonding (TCP-PCB / TCP-LCD)
– COG Bonding (IC-LCD)
– COB Bonding (IC-PCB)
– COF Bonding (COF-LCD/PCB)
– FOG Bonding(FPC-LCD)
– FOB Bonding(FPC-PCB)
– FOF Bonding(FPC-FPC)
– Plasma Display (FPC-PDP)
– Flip Chip Package
– ……
-Heat cure
-Fast bonding time
-High adhesion to plastic PET,COF & FPC, substrate
-Excellent thermal stability
-Good contact resistance for reliability
-Good corrosion resistance
-Excellent chemical resistance
-Good for wide bonding temperature range
-Replaces solder for lead-free solution
Shenzhen Olian Automatci Equipment make all the ACF bonding machine heads/hot bar/welding tips……
Olian,is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD/LED/OLED module automatic bonding machine （COG/FOG/ FOB/ACF/COF/OLB/TAB/FOF bonding machine）and all the parts,accessories(ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.)
Welcome you visit us.
Tel:+86-755-23209022 Fax:+86-755-23209033
QQ:2307972393
Mobilephone/WeChat:+86 18025364779
WhatsApp/Line: +86 18025364779
E-mail:olian@szolian.com
Address: Floor 5,Building D, Sogood Science Park, Aviation Road, Sanwei Village, Xixiang Town, Bao’an District, Shenzhen, China
COF bonding machine, also name TAB bonding machine, ACF bonding machine, OLB Bonding machine, COF bonder，ACF Bonder，TAB bonder，TCP bonder，PCB bonder, TV panel repairing machine, panel bonding machine.
COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the machine is Pulse heating bonding machine with Titanium alloy press bonding head.
Machine Operating Video in Youtube:
COF bonding machine is the widely used machine all over the world. This bonding machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED, and television. This bonding machine may consist of has two Digital Microscope, and also has a Digital Pressure Gauge. The machine consists of vacuum generator which may help to hold the panel during the bonding process. It may also provide the quick as well as easy solutions for various mobile problems. The machine is fast as well as it is very easy to access this bonding machine. This bonding machine is able to provide high accuracy repair apparatus for repair different size of the LED or LCD screen as well as LCD Panel. the machine also consists a process of repairing the technical equipment in an easy way.
We provide the various sizes and types of this machine, as well as all the services, are available if any defect may occur in the machine. Anisotropic conductive film (ACF) bonding machine commonly use in connectivity with electrical and mechanical connections from electronics driver to glass substrate of the LCD/LED/TV. During the ACF bonding process, heat and pressure are applied via a thermode (or hot bar) on to the ACF film or other component that is sandwiching the ACF film.
The bonding machine helps to repair LED,LCD,TV, of lining issues on panel . Ultimate solutions of bonding of COF with fast and easy to operate bonding machine. it is a kind of high precision repair equipment for repair various size LED/LCD screen/LCD Panel.
SPEC Download：
OL-TVCBM-1285-DH-SH-SS- SPEC.pdf
Single/double Head Manual platform ACF/TAB/COF Bonding machine for TV repair,Television repair,Panel repair,screen repair.
1) Machine Model Number: OL-1285-DH/SH-SS (Single Head &Double head)
2) Device Description :Screen Repair machine / LCD Bonding machine
3) Device Uses :FPC、 COF、TAB、 LCD Panel and PCB combination bonding
4) Applicable LCD panel specifications :12″-100″(65″,85″100″ options)
5) Applicable LCD panel thickness :0.3MM-1.1MM[Single glass]
6) Bonding IC number :Multiple / Panel Can be set
7) Bind direction :X or Y Unidirection
8) Bonding IC size :Replaceable blade according to IC specifications (The original machine is equipped45X1.5X10)
9) Device processing time :TFT，3.8S/chip
10) Production Beats :TAB，100 pcs/H
11) Accuracy :Within ± 1.5μm (support 4K screen)
12) Highest positioning accuracy setting :±0.5μm (Currently domestic the highest index)
13) Equipment requirements the work environment :Clean, No dust, Clean room
14) Supply Pressure :0.5~0.7Mpa (Dry air source)
15) Power Supply :AC 220V±10%，50HZ，3500W
16) Cylinder Device :Japan SMC original thin cylinder MXS20-75/MXS20-100
17) Heating Type :Pulse (rapid heating / cooling and auxiliary cooling function)
18) PID Temperature Control System :Brand: YUDIAN (516 model)
Adjustable heating curve Precision PID self-tuning type
The peak temperature : within +/- 3 degrees Celsius
Room temperature time to 180 degrees the response time within 2-3 seconds
19) Hot pressing head :
Materials: Japan Titanium
origin: United States
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times grinding)
20) Thermocouple Type :K type Original US OMEGA wire
21) Industrial control units / Programmer :Import Panasonic PLC FX－C40T
22) Image unit :
Panasonic image processing system
COF counterpoint: down counterpoint
PCB counterpoint : UP counterpoint
Number of lenses : 4
Microscopy: 30-120 Continuous zoom
COF Display: 19-inch HD 1PCS
PCB counterpoint the display : same (Can be installed )
Upper light source : have
Down light source : have
23）COF trimming unit :
Origin: Taiwan
Rail Type: U-rail (2056 high)
Accuracy : 0.01
Adjustable direction :X/Y/R
R Itinerary : Coarse 360 degrees, fine tuning +/- 5 degrees
24）COF Fixture : COF mechanical clamping type, Z tilt radius micrometer trimming
25) Lens spinner unit :
Control mode: X / Y / Z micrometer control
Focus Adjustment: Manually adjust the focus
26) Position detection : None
27) Silicone / Teflon :Manual switching position
28) LCD stage (platform) :Manual sliding or fixed optional ,automatic stage can be customized
29) Alarm device :Pressure abnormal/ temperature anomalies / thermocouple abnormal / action abnormal
30) Hot press head counterpoint :Cylinder stop can be set at any position in the vertical direction
31) Control mode :Touch screen + button operation Using Taiwan’s Wei Lun touch screen dual-core
32) Parameter setting :According to the need to set up Store multiple sets of hot pressing parameters
33) Rated voltage :180-220 (customizable 110V)
34) Peak power :400-2200W (Supports 68X1.5X10 lengthened tool bit
35) Maximum power :2200W
36) Actual power :500W
37) Body size :1200X1200x1380mm(L*W*H)
38) Machine weight :500KG
OL-TVCBM1285-DH/SH-SS COF bonding machine , is our company in the R&D process , according to maintenance staff tailored high-end products , machine not only in the accuracy of the temperature and the mechanical accuracy do the precision design , the procedures also increases the glass and circuit board parameters direct selected function , working pressure automatically switch , greatly facilitate the technical staff selected the parameters , increased the tool bit preheating function , to ensure that the machine at any temperature difference can ensure heating rate and temperature accuracy , double head design , glass and circuit board independent bonding reached factory-class level , high bonding excellent rate、low repair rate , this machine is the maintenance and after-sales staff preferred the classic model.
OL-1285-DH/SH-SS platform Up to 100inch, the COF/TAB/ACF Bonding machine for TV repair,Television repair,Panel repair,screen repair. Welcome you visit us,our website:www.szoulian.com, It is your best choose for your TV COF repairing.
Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.
Wechat/Whatsapp:+8618025364779
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| 1 | ACF AC-7206-18 1.5*50M Glass side ACF胶带 | |
| 2 | ACF AC-2056R-35 2.0*50M PCB side ACF胶带 | |
| 3 | ACF Removing Liquid G-450 1000ML ACF去除液 G450 | |
| 4 | Acetone Liquid BT-H1-500ML 丙酮 | |
| 5 | Hitachi Blue Glue 100ML 蓝色胶水 | |
| 6 | Fuji Silicone 50M 硅胶皮 | |
| 7 | Teflon 50M 铁氟龙 | |
| 8 | Alcohol 酒精 | |
| 9 | Heating Solder Iron 30W +T-Type Soldering Tips T型烙铁+硅胶条 | |
| 10 | Removing Wind Station Hot Air Gun 825+Fan 除风站 热风枪 | |
| 11 | Optical Microscope 显微镜 | |
| 12 | TAB Cutter COF切刀 | |
| 13 | Correction table 校正表 | |
| 14 | LVDS LVDS接头 | |
| 15 | LCD Test Board LCD测试板 | |
| 16 | Allen Key 六角扳手 | |
| 17 | Air Compressor OTS550 空压机 | |
| 18 | Static Wipe Cloth 静电擦拭布 | |
| 19 | Cotton swabs 棉签 | |
| 20 | Handheld Magnifier 手持放大镜 | |
| 21 | Precision Tweezers 精密镊子 | |
| 22 | Nano Sponge 纳米海绵 | |
| 23 | quatz bar spare one 备用石英条 | |
| 24 | Alcohol bottles 空酒精瓶 |
12-85inch 100inch COF Bonding machine for TV Repairing machine,Welcome you visit us !
We’re Professional LCD/LED/OLED Bonding Machine Manufacturer.
Design&Make the best and latest IC/COG/COF/FPC/FOG/FOB/COF/ OLB/PCB/TAB/ACF Bonding Machine for TV/Cellphone/Watch/Touch/Laptop Screens produce and repairing.
