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ACF bonding process

ACF bonding process

ACF bonding process

ACF bonding process ,is the process of Chip ic/COF ic/FPC bonded to the LCD(Glass)/PCB/Film/FPC/ ,use the ACF tape as the medium connecting materials,use the hot bar/bonding head as the source of the heat and pressure,use the tooling as the holder,and the silicone rubber or teflon as the Cushioning material, all the ACF bonding process finished by the ACF bonding equipments.

ACF tape has little conductive particles in the conductive lines of the tape. 

acf bonding process

During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions. 

This process is what produces the connection between the ACF tape and the components.  Advanced Integrated Technologies is equipped to assist you with your ACF bonding process.

ACF bonding process sorts and conditions:

acf bonding process
ACF bonding process

According to different LCD/LED/OLED and different screens, there are many ACF tapes models.  ACF tape is the important medium of the ACF bonding process.

ACF Tape/ACF Film-ACF bonding process materials

ACF TAPE

ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.

-Adhesives

The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.

-Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.

ACF tape/ACF Anisotropic Conductive Film

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

Some ACF models:

Model(Hitachi)Process typeFor Glass
AC-823CY  W1.2mm  L100mCOG Low TempThin Glass
AC-823CY  W1.5mm  L100mCOG Low TempThin Glass
AC-823CY  W2.0mm  L100mCOG Low TempThin Glass
AC-8412KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-832L  W1.2mm  L100mCOG Low TempThin Glass
AC-832L  W1.5mm  L100mCOG Low TempThin Glass
AC-832L W2.0mm  L100mCOG Low TempThin Glass
AC-832L W2.5mm  L100mCOG Low TempThin Glass
AC-8622KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-7813KM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W2.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W2.0mm  L100mFOG Low TempCommon Glass
MF-331-25 W2.0mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.5mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.2mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.0mm  L50mFOG Low TempFor Touch Screen
AC-4255KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-3514-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7206U-18  W1.0mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.2mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.5mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W2.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.5mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W2.0mm  L50mFOG Normal TempCommon Glass
AC-9851YM-35  W1.5mm  L50mFOG Low TempCommon Glass
AC-9851YM-35  W2.0mm  L50mFOG Low TempCommon Glass
AC-896C  W1.5mm  L100mCOG Low TempThin Glass
Model(Sony)Process typeFor Glass
CP6920F3  W3.5mm  L50m COG Low TempCommon Glass
CP6920F3  W3.0mm  L50m COG Low TempCommon Glass
CP6920F3  W2.0mm  L50mCOG Low TempCommon Glass
CP6920F3  W1.5mm  L50m  COG Low TempCommon Glass
CP6920F3  W1.2mm  L50m  COG Low TempCommon Glass
CP34531  W1.5mm  L100m  COG Low TempThin Glass
CP34531  W2.0mm  L100m  COG Low TempThin Glass
CP36531  W1.5mm  L100m  COG Low TempThin Glass
CP36531  W2.0mm  L100m  COG Low TempThin Glass
CP35231  W1.5mm  L100m  COG Low TempThin Glass
CP35231  W2.0mm  L100m  COG Low TempThin Glass
CP36931  W1.5mm  L100m  COG Low TempThin Glass
CP36931  W2.0mm  L100m  COG Low TempThin Glass
CP33731  W1.5mm  L100m  COG Low TempThin Glass
CP33731  W2.0mm  L100m  COG Low TempThin Glass
CP31831  W1.5mm  L100m  COG Low TempThin Glass
CP31831  W2.0mm  L100m  COG Low TempThin Glass
CP1220  W1.0mm  L100m  FOG Low TempCommon Glass
CP1220  W1.2mm  L100m  FOG Low TempCommon Glass
CP1220  W1.5mm  L100m  FOG Low TempCommon Glass
CP1220  W2.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.2mm  L100m  FOG Low TempCommon Glass
CP13941  W1.5mm  L100m  FOG Low TempCommon Glass
CP13941  W2.0mm  L100m  FOG Low TempCommon Glass
CP6920F W3.5mm  L50m COG Low TempCommon Glass
CP6920F W3.0mm  L50m COG Low TempCommon Glass
CP6920F W2.0mm  L50mCOG Low TempCommon Glass
CP6920F W1.5mm  L50m  COG Low TempCommon Glass
CP6920F W1.2mm  L50m  COG Low TempCommon Glass
CP920  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP920  W2.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP923  W2.0mm  L100m  FOG Low TempFor Touch Screen
AC-7813KM specification

ACF tape data sheet(for example:7206U/2056R)

ACF hot bar/ACF bonding head-ACF bonding process heat and pressure source

The source for heat and pressure in ACF bonding process is most often a hot bar/thermode/bonding head/bonding cutter.

Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple. 

Tooling is designed to hold the components and position the ACF tape to line up correctly with the conductive pads on the PCB or other component. 

The hot bar is then brought into contact with the ACF film over the top of the bonding pad, heated to the bonding temperature, and held for a specified time. 


Tell us which products you want to bonding ,then we can suggest you the right ACF bonding equipments for you ..

ACF Bonding Equipment Applications

ACF bonding equipment has been used in glass display applications for many years.  It has recently become widely used in COF, COB,COG,FOG,FOB,FOF areas.  

ACF bonding equipment

Industries that use this technology most are the mobile phone manufacturing, automotive industry, and LCD production, mobile computers, TV manufacturing, open cell panels factories, touch panel ,AD shower, Watch, Pad… factories. and  many Labs who researching in the LCD/LED/OLED/MICRO LED/MINI LED displays industries.

  • TAB Bonding (TCP-PCB / TCP-LCD)
  • COG Bonding (IC-LCD)
  • COB Bonding (IC-PCB)
  • COF Bonding (COF-LCD/PCB)
  • FOG Bonding(FPC-LCD)
  • FOB Bonding(FPC-PCB)
  • FOF Bonding(FPC-FPC)
  • Plasma Display (FPC-PDP)
  • Flip Chip Package
  • ……

ACF Bonding equipment Features

  • Heat cure
  • Fast bonding time
  • High adhesion to plastic PET,COF & FPC, substrate
  • Excellent thermal stability
  • Good contact resistance for reliability
  • Good corrosion resistance
  • Excellent chemical resistance
  • Good for wide bonding temperature range
  • Replaces solder for lead-free solution

Silicon rubber and Teflon

Teflon Tape ( Teflon cushion)

Similar to Silicone rubber, Teflon tape is often used to provide evenly distributed pressure and temperature on the ACF bonding process.

Features of Teflon Tape :

1. Superior chemical resistance – hardly affected by acids and alkalis.

2. Excellent electrical properties, including little dielectric loss, high insulation resistance and breakdown voltage.

3. Extremely high volume resistivity and remain stable over a wide range of temperature.

4. Continuous use in a wide range of temperature from -100degC to +260degC

5. Lowest friction cofficient among all solid materials and excellent self-lubricating ability.

6. Non-adhesiveness and mold releasing property

7. Excellent weather and moisture resistance

8. Superior flame resistance

Shenzhen olian is a professional ACF bonding equipment design&making factory, We know all the ACF bonding process, we also offer all the bonding machine accessories and parts. Welcome you visit us .

Wechat/whatsapp:+86 18025364779, QQ:2307972393, https://bonding-machine.com

ACF Bonding equipment
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ACF bonding head/ACF bonder

ACF bonding head

ACF bonding head also name:ACF/TAB/COF/COG/FOG/FPC/FOF Bonding machine press head /bonding tip/welding heads/ Hot Bar / soldering heads / heater tip / heater tools/ thermode for hot bar / ACF Bonding machine cutter head/bonding cutter/heat cutter……

Panasonic FOG press head

It have pulse heating and constant temperature bonding head.

Materials:

Normal materials:

-SUS440C steel(440C不锈钢)

-Tungsten steel(钨钢,钨钢(硬质合金)具有硬度高、耐磨、强度和韧性较好、耐热、耐腐蚀等一系列优良性能,特别是它的高硬度和耐磨性,即使在500℃的温度下也基本保持不变,在1000℃时仍有很高的硬度 )

-Titanium alloy (normal used in pulse heating bonding machine), (钛合金,脉冲压头一般用钛合金制作)

-Ceramic (陶瓷,一般用在COG压头)

-Brass (黄铜)

-and others.

Size:

It will be different sizes for different products, such as TV Panel/cell phone/Touch panel/camera/watch/ Heat Seal Paper/, every products have the different shapes and sizes, so we need to make the customized bonding head according to your products.

Applications:

ACF Bonding head has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.

– TAB Bonding (TCP-PCB / TCP-LCD)

– COG Bonding (IC-LCD)

– COB Bonding (IC-PCB)

– COF Bonding (COF-LCD/PCB)

– FOG Bonding(FPC-LCD)

– FOB Bonding(FPC-PCB)

– FOF Bonding(FPC-FPC)

– Plasma Display (FPC-PDP)

– Flip Chip Package

– ……

Features:

-Heat cure

-Fast bonding time

-High adhesion to plastic PET,COF & FPC, substrate

-Excellent thermal stability

-Good contact resistance for reliability

-Good corrosion resistance

-Excellent chemical resistance

-Good for wide bonding temperature range

-Replaces solder for lead-free solution

Photos:

CRYSTAL
ACF bonding head
acf bonding head
ACF bonding head for TV Repairing COF bonding machine

Shenzhen Olian Automatci Equipment make all the ACF bonding machine heads/hot bar/welding tips……

Olian,is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD/LED/OLED module automatic bonding machine (COG/FOG/ FOB/ACF/COF/OLB/TAB/FOF bonding machine)and all the parts,accessories(ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.)

Welcome you visit us.

Tel:+86-755-23209022 Fax:+86-755-23209033

QQ:2307972393

Mobilephone/WeChat:+86 18025364779

WhatsApp/Line: +86 18025364779

E-mail:olian@szolian.com

Address: Floor 5,Building D, Sogood Science Park, Aviation Road, Sanwei Village, Xixiang Town, Bao’an District, Shenzhen, China

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COF bonding machine

COF BONDING MACHINE

COF bonding machine

COF bonding machine, also name TAB bonding machine, ACF bonding machine, OLB Bonding machine, COF bonder,ACF Bonder,TAB bonder,TCP bonder,PCB bonder, TV panel repairing machine, panel bonding machine.

COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the machine is Pulse heating bonding machine with Titanium alloy press bonding head.

COF bonding machine photos

COF bonding machine
COF bonding machine
COF bonding machine
COF bonding machine
COF bonding machine
COF bonding machine and accessories

The machine working video:

Machine Operating Video in Youtube:

TV reparing Glass Side Bonding
TV reparing PCB Side Bonding

COF bonding machine Introduction

COF bonding machine is the widely used machine all over the world. This bonding machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED, and television. This bonding machine may consist of has two Digital Microscope, and also has a Digital Pressure Gauge. The machine consists of vacuum generator which may help to hold the panel during the bonding process. It may also provide the quick as well as easy solutions for various mobile problems. The machine is fast as well as it is very easy to access this bonding machine. This bonding machine is able to provide high accuracy repair apparatus for repair different size of the LED or LCD screen as well as LCD Panel. the machine also consists a process of repairing the technical equipment in an easy way.

We provide the various sizes and types of this machine, as well as all the services, are available if any defect may occur in the machine. Anisotropic conductive film (ACF) bonding machine commonly use in connectivity with electrical and mechanical connections from electronics driver to glass substrate of the LCD/LED/TV. During the ACF bonding process, heat and pressure are applied via a thermode (or hot bar) on to the ACF film or other component that is sandwiching the ACF film.

The bonding machine helps to repair LED,LCD,TV, of lining issues on panel . Ultimate solutions of bonding of COF with fast and easy to operate bonding machine. it is a kind of high precision repair equipment for repair various size LED/LCD screen/LCD Panel.

The Machine OL-1285-DH/SH-SS Specification

SPEC Download:

OL-TVCBM-1285-DH-SH-SS- SPEC.pdf

Single/double Head Manual platform ACF/TAB/COF Bonding machine for TV repair,Television repair,Panel repair,screen repair.

Machine Model Number:

1) Machine Model Number: OL-1285-DH/SH-SS   (Single Head &Double head)

2) Device Description :Screen Repair machine / LCD Bonding machine

3) Device Uses :FPC、 COF、TAB、 LCD Panel and PCB combination bonding

4) Applicable LCD panel specifications :12″-100″(65″,85″100″ options)

5) Applicable LCD panel thickness :0.3MM-1.1MM[Single glass]

6) Bonding IC number :Multiple / Panel   Can be set

7) Bind  direction :X or Y Unidirection

8) Bonding IC size :Replaceable blade according to IC specifications (The original machine is equipped45X1.5X10)

9) Device processing time :TFT,3.8S/chip

10) Production Beats :TAB,100 pcs/H

11) Accuracy :Within ± 1.5μm  (support 4K screen)

12) Highest positioning accuracy setting :±0.5μm (Currently domestic the highest index)

13) Equipment requirements the work environment :Clean, No dust, Clean room

14) Supply Pressure :0.5~0.7Mpa  (Dry air source)

15) Power Supply :AC 220V±10%,50HZ,3500W

Machine Parts Informations:

16) Cylinder Device :Japan SMC original thin cylinder  MXS20-75/MXS20-100

17) Heating Type :Pulse (rapid heating / cooling and auxiliary cooling function)

18) PID Temperature Control System :Brand: YUDIAN  (516 model)

Adjustable heating curve  Precision PID self-tuning type

The peak temperature : within +/- 3 degrees Celsius

Room temperature time to 180 degrees the response time within 2-3 seconds

19) Hot pressing head :

Materials: Japan Titanium

origin: United States

Plane precision (hot press side) :0.001mm

Plane thickness 0.5  (Reserved 3 times grinding)

20) Thermocouple Type :K type   Original US OMEGA wire

21) Industrial control units / Programmer :Import Panasonic PLC FX-C40T

22) Image unit :

Panasonic image processing system

COF counterpoint: down counterpoint

PCB counterpoint : UP counterpoint

Number of lenses : 4

Microscopy: 30-120 Continuous zoom

COF Display: 19-inch HD 1PCS

PCB counterpoint the display : same (Can be installed )

Upper light source : have

Down light source : have

23)COF trimming unit :

Origin: Taiwan

Rail Type: U-rail (2056 high)

Accuracy : 0.01

Adjustable direction :X/Y/R

R Itinerary : Coarse 360 degrees, fine tuning +/- 5 degrees

24)COF Fixture : COF mechanical clamping type, Z tilt radius  micrometer trimming

25) Lens spinner unit :

Control mode: X / Y / Z micrometer control

Focus Adjustment: Manually adjust the focus

26) Position detection : None

27) Silicone / Teflon :Manual switching position

28) LCD stage (platform) :Manual sliding or fixed optional ,automatic stage can be customized

29) Alarm device :Pressure abnormal/ temperature anomalies / thermocouple abnormal / action abnormal

30) Hot press head counterpoint :Cylinder stop can be set at any position in the vertical direction

31) Control mode :Touch screen + button operation   Using Taiwan’s Wei Lun touch screen dual-core

32) Parameter setting :According to the need to set up Store multiple sets of hot pressing parameters

Machine Electrical parameter:

33) Rated voltage :180-220  (customizable 110V)

34) Peak power :400-2200W  (Supports 68X1.5X10 lengthened tool bit

35) Maximum power :2200W

36) Actual power :500W

37) Body size :1200X1200x1380mm(L*W*H)

38) Machine weight :500KG

Remark:

OL-TVCBM1285-DH/SH-SS COF bonding machine , is our company in the R&D process , according to maintenance staff tailored high-end products , machine not only in the accuracy of the temperature and the mechanical accuracy do the precision design , the procedures also increases the glass and circuit board parameters direct selected function , working pressure automatically switch , greatly facilitate the technical staff selected the parameters , increased the tool bit preheating function , to ensure that the machine at any temperature difference can ensure heating rate and temperature accuracy , double head design , glass and circuit board independent bonding reached factory-class level , high bonding excellent rate、low repair rate , this machine is the maintenance and after-sales staff preferred the classic model.

OL-1285-DH/SH-SS platform Up to 100inch, the COF/TAB/ACF Bonding machine for TV repair,Television repair,Panel repair,screen repair. Welcome you visit us,our website:www.szoulian.com, It is your best choose for your TV COF repairing.

About the Accessories

COF bonding machine
cof bonding machine

Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.

Wechat/Whatsapp:+8618025364779

液晶电视维修辅助设备耗材 ,ACF胶带 AC-7206,AC-2056,G450去除液,日立蓝胶,酒精,丙酮,酒精瓶,棉布,纳米海绵,棉签,COF裁切刀,空压机,显微镜,热风枪,石英条,硅胶皮,铁氟龙,精密镊子,六角扳手,烙铁头,放大镜,校正仪,LVDS链接线, 驱动测试板等,免费随机附送整套,免费来厂学习,免费打出口木箱,欢迎来厂试机购买。

Accessories list:

1ACF  AC-7206-18  1.5*50M  Glass side ACF胶带
2ACF AC-2056R-35  2.0*50M PCB side ACF胶带 
3ACF Removing Liquid  G-450  1000ML ACF去除液 G450
4Acetone Liquid BT-H1-500ML  丙酮 
5Hitachi Blue Glue  100ML 蓝色胶水 
6Fuji Silicone  50M 硅胶皮 
7Teflon  50M 铁氟龙 
8Alcohol  酒精 
9Heating Solder Iron 30W +T-Type Soldering Tips T型烙铁+硅胶条 
10Removing Wind Station Hot Air Gun 825+Fan 除风站 热风枪 
11Optical Microscope 显微镜 
12TAB Cutter   COF切刀 
13Correction table   校正表 
14LVDS                     LVDS接头 
15LCD Test Board   LCD测试板 
16Allen Key 六角扳手 
17Air Compressor  OTS550 空压机 
18Static Wipe Cloth 静电擦拭布 
19Cotton swabs 棉签 
20Handheld Magnifier 手持放大镜 
21Precision Tweezers 精密镊子 
22Nano Sponge 纳米海绵 
23quatz bar spare one 备用石英条 
24Alcohol bottles 空酒精瓶 

12-85inch 100inch COF Bonding machine for TV Repairing machine,Welcome you visit us !

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