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标签归档ACF TAPE

ACF Tape

ACF TAPE/ACF FILM

ACF Tape/ACF Film is normally made up of two main components, namely Adhesive & conductive particles.

What is ACF tape/ACF Film?

Adhesives

The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.

Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.

ACF tape/ACF Anisotropic Conductive Film

ACF TAPE
ACF TAPE
ACF TAPE

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

According to different LCD/LED/OLED and different screens, there are many ACF tapes models.  ACF tape is the import medium of the bonding process.

What is ACF Bonding?

During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions. 

Some ACF tape models

Model(Hitachi)Process typeFor Glass
AC-823CY  W1.2mm  L100mCOG Low TempThin Glass
AC-823CY  W1.5mm  L100mCOG Low TempThin Glass
AC-823CY  W2.0mm  L100mCOG Low TempThin Glass
AC-8412KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8412KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8412KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-832L  W1.2mm  L100mCOG Low TempThin Glass
AC-832L  W1.5mm  L100mCOG Low TempThin Glass
AC-832L W2.0mm  L100mCOG Low TempThin Glass
AC-832L W2.5mm  L100mCOG Low TempThin Glass
AC-8622KZ  W1.2mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.5mm  L50mCOG Low TempThin Glass
AC-8622KZ  W1.8mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.0mm  L50mCOG Low TempThin Glass
AC-8622KZ  W2.3mm  L50mCOG Low TempThin Glass
AC-7813KM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813KM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.0mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.2mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W1.5mm  L100mFOG Low TempCommon Glass
AC-7246KU-20  W2.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7813YM-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-7823YM-25  W2.0mm  L100mFOG Low TempCommon Glass
MF-331-25 W2.0mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.5mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.2mm  L50mFOG Low TempFor Touch Screen
MF-331-25 W1.0mm  L50mFOG Low TempFor Touch Screen
AC-4255KU-18  W1.0mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.2mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W1.5mm  L100mFOG Low TempCommon Glass
AC-4255KU-18  W2.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.0mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.2mm  L100mFOG Low TempCommon Glass
AC-3514-25  W1.5mm  L100mFOG Low TempCommon Glass
AC-3514-25  W2.0mm  L100mFOG Low TempCommon Glass
AC-7206U-18  W1.0mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.2mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W1.5mm  L50mFOG Normal TempCommon Glass
AC-7206U-18  W2.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.0mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W1.5mm  L50mFOG Normal TempCommon Glass
AC-2056R-35  W2.0mm  L50mFOG Normal TempCommon Glass
AC-9851YM-35  W1.5mm  L50mFOG Low TempCommon Glass
AC-9851YM-35  W2.0mm  L50mFOG Low TempCommon Glass
AC-896C  W1.5mm  L100mCOG Low TempThin Glass
Model(Sony)Process typeFor Glass
CP6920F3  W3.5mm  L50m COG Low TempCommon Glass
CP6920F3  W3.0mm  L50m COG Low TempCommon Glass
CP6920F3  W2.0mm  L50mCOG Low TempCommon Glass
CP6920F3  W1.5mm  L50m  COG Low TempCommon Glass
CP6920F3  W1.2mm  L50m  COG Low TempCommon Glass
CP34531  W1.5mm  L100m  COG Low TempThin Glass
CP34531  W2.0mm  L100m  COG Low TempThin Glass
CP36531  W1.5mm  L100m  COG Low TempThin Glass
CP36531  W2.0mm  L100m  COG Low TempThin Glass
CP35231  W1.5mm  L100m  COG Low TempThin Glass
CP35231  W2.0mm  L100m  COG Low TempThin Glass
CP36931  W1.5mm  L100m  COG Low TempThin Glass
CP36931  W2.0mm  L100m  COG Low TempThin Glass
CP33731  W1.5mm  L100m  COG Low TempThin Glass
CP33731  W2.0mm  L100m  COG Low TempThin Glass
CP31831  W1.5mm  L100m  COG Low TempThin Glass
CP31831  W2.0mm  L100m  COG Low TempThin Glass
CP1220  W1.0mm  L100m  FOG Low TempCommon Glass
CP1220  W1.2mm  L100m  FOG Low TempCommon Glass
CP1220  W1.5mm  L100m  FOG Low TempCommon Glass
CP1220  W2.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.0mm  L100m  FOG Low TempCommon Glass
CP13941  W1.2mm  L100m  FOG Low TempCommon Glass
CP13941  W1.5mm  L100m  FOG Low TempCommon Glass
CP13941  W2.0mm  L100m  FOG Low TempCommon Glass
CP6920F W3.5mm  L50m COG Low TempCommon Glass
CP6920F W3.0mm  L50m COG Low TempCommon Glass
CP6920F W2.0mm  L50mCOG Low TempCommon Glass
CP6920F W1.5mm  L50m  COG Low TempCommon Glass
CP6920F W1.2mm  L50m  COG Low TempCommon Glass
CP920  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP920  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP920  W2.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.0mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.2mm  L100m  FOG Low TempFor Touch Screen
CP923  W1.5mm  L100m  FOG Low TempFor Touch Screen
CP923  W2.0mm  L100m  FOG Low TempFor Touch Screen


TF-4200EB-45/1000MLBlueLCM Insulation protective adhesive
TF-4200EB-451/1000MLBlueLCM Insulation protective adhesive
TF-4200EB-452/1000MLBlueLCM Insulation protective adhesive
TF-4200EB-75/1000MLBlueLCM Insulation protective adhesive
Model(ACF Remover)
Remover/G-430/1L Clean FPC Sidecommon 
Remover/G-450/1L Thick Clean IC Sidecommon 
Remover/G-450/1L Diluted Clean FPC Sidecommon 
Remover/G-550/1L Thick Clean IC Sidecommon 
Remover/G-550/1L Diluted Clean IC Sidecommon 
Remover/G-650/1L Thick Clean IC Sidecommon 
Remover/G-650/1L Diluted Clean IC Sidecommon 

Please contact us if you need any other ACF tapes and ACF removers.

ACF tape Applications

ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.

– TAB Bonding (TCP-PCB / TCP-LCD)

– COG Bonding (IC-LCD)

– COB Bonding (IC-PCB)

– COF Bonding (COF-LCD/PCB)

– FOG Bonding(FPC-LCD)

– FOB Bonding(FPC-PCB)

– FOF Bonding(FPC-FPC)

– Plasma Display (FPC-PDP)

– Flip Chip Package

– ……

ACF Bonding Features

  • Heat cure,
  • Fast bonding time,
  • High adhesion to plastic PET,COF & FPC, substrate,
  • Excellent thermal stability,
  • Good contact resistance for reliability,
  • Good corrosion resistance,
  • Excellent chemical resistance,
  • Good for wide bonding temperature range,
  • Replaces solder for lead-free solution.

Because of ACF bonding advantages and features ,the ACF bonding machine is becoming more and more popular and useful.

ACF Bonding Machine

The Bonding Machine use the ACF tape as the medium ,so it named ACF bonding machine.

ACF Bonding Machine, is the widely used machine in the LCD/LED/OLED, LCM/open cell/panel/screen/display produce factories and repairing service shops all over the world.

ACF TAPE
FOG/FOB/FOF bonding machine

The ACF Bonding Machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED,OLED, TV/television, Laptop, Pad, Cell phone, Watch, Touch Panel, Ad Player, and all the flat and edge screens.

The ACF Bonding Machine may consist of HD Digital Microscope, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process. The bonding press head may press the IC/FPC/COF onto the Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time.

According to the different bonding materials, the ACF bonding machine can be divided into different bonding machines.

COG Bonging machine

COG bonding machine, also name IC Bonding machine, Chips bonding machine, COG(Chip on glass) bonding machine, it is bonding the Chip IC on the glass using ACF conductive adhesive as medium, by a certain temperature, pressure, time, driver IC will be bonded onto the glass. COG bonding machine has COG Pre-Bonding Machine and COG Main-Bonding Machine. They are all constant temperature machines. it maybe have single station ,double stations, three stations, and maybe four stations bonding machine.

COG Pre-bonding machine

COG PRE-BONDING MACHINE

COG Main-Bonding Machine

FOG bonding machine

FOG bonding machine, FOB bonding machine, FPC bonding machine, Flex cable bonding machine.FOG(FPC on glass )or FOB(FPC on PCB Board), FOF(FPC on FPC), also COF on Glass bonding, COF on board bonding, COF on film bonding. It have Pulse Heating Bonding Machines and Constant Temperature Bonding Machines.

FPC bonding machine
FPC bonding machine

ACF attaching machine

ACF attaching machine which is attaching the ACF tape on the Glass/Board/FPC/COF before bonding. it also name ACF machine, ACF attachment machine, ACF Attached machine , ACF bonding machine , ACF pre-paste , ACF equipment , ACF pre-paste machines , ACF pre- affixed equipment, ACF single station machine , ACF multi-station machines and so on.  The attaching machine, also can paste the Double-sided tape.

ACF TAPE
ACF-ATTACHING-MACHINE

Semi-auto LCM making machines

Semi Automatic LCM making machines include:COG pre-bonding machine, COG main-bonding machine , FOG(FOB) bonding machine, ACF attaching machine as below:

LCM making machines
LCM making machines

Full automatic COG bonding machine

Full automatic COG bonding machine, it include the LCD cleaning, IC loading, ACF attaching on the glass, IC pre-bonding, and IC main-bonding processes.

FULL AUTOMATIC COG MACHINES
FULL AUTOMATIC COG MACHINE

Full automatic FOG bonding machine

Full automatic FOG bonding machine, It include the ACF attaching on the glass, FPC loading, FPC bonding on the glass and output to testing..

LCM full automatic produce machine

LCM full automatic produce machine include all the process of the COG and FOG bonding machines.

If you need the ACF bonding machines and the ACF tapes and all the accessories,please contact us Olian .Wechat/whatsapp:+86 18025364779,QQ:2307972393, E-mail:2307972393@qq.com

ACF TAPE
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COF Bonding Machine Accessories

COF Bonding Machine Accessoires

COF bonding machine

COF bonding machine, also name TAB bonding machine, ACF bonding machine, OLB Bonding machine, Chip on Film bonding machine. COF(Chip on Film, Chip on Flex).COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The COF Bonding machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the COF bonding machine is Pulse heating bonding machine with Titanium alloy press bonding head. Good and complete COF bonding machine accessories are also very important for the LCD/LED/OLED

Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below:

COF bonding machine

COF bonding machine

COF bonding machine accessories

We also offer all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.

Please contact us feel free to  purchase the COF bonding machine accessories.

ACF Tape/ACF Film  & Applications

ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.

Adhesives

The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.

ACF Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.

ACF TAPE

ACF tape & ACF Anisotropic Conductive Film

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

Teflon Tape ( Teflon cushion)

Similar to Silicone rubber, Teflon tape is often used to provide evenly distributed pressure and temperature on the ACF bonding process.

Features of Teflon Tape :

  1. Superior chemical resistance – hardly affected by acids and alkalis.
  2. Excellent electrical properties, including little dielectric loss, high insulation resistance and breakdown voltage.
  3. Extremely high volume resistivity and remain stable over a wide range of temperature.
  4. Continuous use in a wide range of temperature from -100degC to +260degC
  5. Lowest friction cofficient among all solid materials and excellent self-lubricating ability.
  6. Non-adhesiveness and mold releasing property
  7. Excellent weather and moisture resistance
  8. Superior flame resistance

ACF Remover

ACF REMOVER

ACF REMOVER G450/G550/G650/G750

ACF Remover is a solvent designed to removed hardened ACF during rework of LCD module assembly. have many model number as: G430,G450,G550,G650,G750

ACF Remover Removing Process :

  1. Apply ACF Remover on the FPC/COG
  2. Wait 3~5 minutes for ACF Remover to react and soften ACF bond
  3. Remove ACF after 3~5 minutes
  4. Cleaning with aqueous liquid or acetone

Buy machine, send all the accessories free.

1 COF bonding machine  
2 ACF  AC-7206-18  1.5*50M  Glass side ACF胶带
3 ACF AC-2056R-35  2.0*50M PCB side ACF胶带
4 ACF Removing Liquid  G-450  1000ML ACF去除液 G450
5 Acetone Liquid BT-H1-500ML  丙酮
6 Hitachi Blue Glue  100ML 蓝色胶水
7 Fuji Silicone  50M 硅胶皮
8 Teflon  50M 铁氟龙
9 Alcohol  酒精
10 Heating Solder Iron 30W +T-Type Soldering Tips T型烙铁+硅胶条
11 Removing Wind Station Hot Air Gun 825+Fan 除风站 热风枪
12 Optical Microscope 显微镜
13 TAB Cutter   COF切刀
14 Correction table   校正表
15 LVDS                     LVDS接头
16 LCD Test Board   LCD测试板
17 Allen Key 六角扳手
18 Air Compressor  OTS550 空压机
19 Static Wipe Cloth 静电擦拭布
20 Cotton swabs 棉签
21 Handheld Magnifier 手持放大镜
22 Precision Tweezers 精密镊子
23 Nano Sponge 纳米海绵
24 quatz bar spare one 备用石英条
25 Alcohol bottles 空酒精瓶

COF bonding machine accessories

COF bonding machine accessories

Welcome to buy the COF bonding machine and all the COF bonding machine accessories.

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