OL-FP85T Dual-Station Manual Pulse Bonder
High-Precision FOG and Flip-Chip Bonding Solution for 85-Inch Displays
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OL-CRW017-4 – 17-Inch COF-to-FPC Automatic Bonding Machine (Quad-Camera, A+P+M)
High-Speed Precision Bonder for Multi-Segment Flexible Circuit Assembly
The OL-CRW017-4 by Olian Automatic Equipment Co., Ltd. is a high-performance automatic bonding machine engineered for precise thermal compression of COF (Chip-on-Film) to FPC (Flexible Printed Circuit) modules up to 17 inches. Featuring four high-resolution cameras and full A+P+M (Alignment + Pre-press + Main-press) functionality, it delivers consistent, high-yield bonding for demanding display and electronics manufacturing.
This system is ideal for mass production of driver boards, touch modules, and automotive displays where multi-point COF-to-FPC connections require micron-level accuracy and process repeatability.
Equipped with four independent cameras, the OL-CRW017-4 enables simultaneous alignment at multiple bonding zones. Each camera provides real-time video feed with adjustable magnification and coaxial LED lighting—ensuring clear visibility of alignment marks even on dark or reflective surfaces.
Operators perform initial rough placement manually. Fine alignment is then verified visually via monitors. Once alignment is confirmed as “OK,” the operator initiates the cycle using a dual-hand start mechanism—a critical safety feature that prevents accidental activation during setup.
The machine executes a complete three-stage bonding sequence:
Temperature is adjustable from room temperature to 400°C, with press head surface uniformity held within ±5°C. Bonding time ranges from 0.1 to 99.9 seconds. Force output is precisely regulated to suit delicate flex materials—minimizing risk of damage.
Standard press heads are made of high-wear tungsten steel. Custom dimensions are available for specialized applications.
The OL-CRW017-4 uses a manual loading/unloading approach for maximum flexibility. Operators place the FPC on the worktable and secure it via vacuum. They then position the COF(s) and align them visually. After bonding, they remove the finished module and repeat.
All operations occur from a single front position—enhancing ergonomics and reducing cycle time. The platform includes dense vacuum channels to hold thin FPCs flat during bonding.
The machine includes essential manual controls:
A three-color signal tower (red/yellow/green) provides instant status feedback: ready, running, or fault. These physical controls ensure reliability in industrial environments—even without complex software interfaces.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers:
Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote troubleshooting fails, an engineer will arrive on-site within 72 hours. Lifetime technical support is available beyond the warranty term.
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In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.
COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel
. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices
. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.
COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces
. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices
. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing
.
COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays
. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices
.
FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices
. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications
.
FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics
. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes
.
FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays
. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.
ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG
. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines
.
TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities
. These machines are ideal for applications requiring high-density interconnections and compact designs
.
FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications
. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics
.
In addition to the above technologies, we also offer specialized bonding machines for various applications, including:
Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:
Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.
