OL-FS120 Single-Station Servo-Driven FOG Bonder
High-Precision Manual FOG Bonding for 120-Inch Displays
Ideal for manufacturers of ultra-large LCD/OLED panels, including:
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OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder
High-Precision Manual FOG Bonding for 65-Inch Displays
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OL-FP85T Dual-Station Manual Pulse Bonder
High-Precision FOG and Flip-Chip Bonding Solution for 85-Inch Displays
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OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Precision Manual FOG Bonding for 85-Inch Displays.
The OL-FPD85 Single-Station Dual-Sided Alignment Pulse Bonder, manufactured by Shenzhen Olian Automatic Equipment Co., Ltd., is a manual flat-panel display (FPD) bonding solution engineered for pre-bonding flexible printed circuits (FPC/COF) or film-on-board (FOB) applications. Designed for 85-inch platforms, this equipment supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm) with thicknesses of 0.1–1 mm.
This bonder is ideal for manufacturers requiring precision alignment for large-format displays. Its manual flexibility and automated pressing ensure high-quality bonds for FPC/COF applications.
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Integrated Thermal Compression Platform for Both FOG and FOB Processes with Sequential Rework Capability
The OL-FF-173 by Olian Automatic Equipment Co., Ltd. is a versatile semi-automatic bonding machine designed for medium-sized display modules up to 17.3 inches. It uniquely supports both FOG (Film-on-Glass) and FOB (Film-on-Board) processes—including pre-bonding, main bonding, and rework functions—all within a single integrated platform. This makes it ideal for pilot lines, small-batch production, or repair stations handling mixed product types.
The system features a single-side, multi-segment architecture that can process up to 6 FPCs or 6 PCBs along one edge of a panel in sequence. Operators can configure the machine to run FOG only, FOB only, or FOG followed immediately by FOB—without changing hardware. If both are enabled, the machine automatically completes all FOG steps first, then proceeds to FOB bonding on the same unit.
For FOG mode, the operator places the LCD panel on the glass worktable and activates vacuum suction. They then position the FPC(s) on the FPC stage and perform rough alignment. Using a live monitor feed, they fine-tune alignment visually. After pressing both start buttons, the pre-press head descends to temporarily bond the first segment. The platform then shifts automatically to the next position. This repeats until all pre-press zones are complete. Finally, the platform moves to the main bonding station. The main press head applies full heat and pressure to cure all segments at once.
If FOB mode is also enabled, the machine returns to the FOG pre-press station—but now treats the bonded module as a “panel” for FOB processing. The operator places a PCB on the worktable, aligns it with the existing FPC leads, and initiates another bonding cycle. This seamless transition eliminates manual transfer between machines and reduces handling damage.
All loading, alignment, and unloading occur from the same front position, improving ergonomics and workflow consistency.
Both pre-press and main-press heads operate within a temperature range of room temperature to 400°C, with surface uniformity held to ±5°C—ensuring reliable ACF curing. Bonding time is adjustable from 0.1 to 99.9 seconds.
Force output is independently controlled:
Standard press head dimensions are:
All heads are made of high-wear-resistant material and can be customized to match specific COF or PCB layouts.
The machine uses physical controls including Φ24 mm start and vacuum buttons, plus a Φ22 mm emergency stop switch. A three-color signal lamp indicates operational status (ready, running, fault). While the document does not specify PLC or touchscreen use, the process is fully automated once started—minimizing operator error.
Safety is reinforced by the dual-hand start requirement, preventing accidental activation during alignment.
Olian includes one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, common troubleshooting, and replacement of wear parts. Duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is provided beyond the warranty term.
The OL-FF-173 excels in environments requiring flexibility and rework capability—such as:
Its ability to perform FOG → FOB in one continuous flow significantly reduces cycle time and improves yield compared to using two separate machines.
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OL-F017 – 17-Inch Dual-Station In/Out Lower-Alignment FOG Bonding Machine (Touch Panel Customized)
High-Precision Semi-Automatic COF Bonding System for Touch Displays
The OL-F017 by Olian Automatic Equipment Co., Ltd. is a high-performance semi-automatic FOG (Film-on-Glass) bonding machine designed specifically for large-format touch panels up to 17 inches. It features a dual-station platform with in-and-out linear motion and lower-side visual alignment, enabling efficient, precise bonding of COF (Chip-on-Film) circuits onto LCD glass edges. This model is optimized for touch panel (TP) manufacturers requiring custom alignment workflows and stable thermal compression.
Unlike top-view alignment systems, the OL-F017 uses a bottom-mounted camera and monitor setup. Operators view alignment marks from below through the transparent glass substrate. This “lower alignment” method reduces parallax error and improves accuracy—especially critical for narrow-pitch COFs used in modern touch displays.
The machine operates with two independent workstations that move linearly between loading and bonding positions. While one station is under compression, the operator can load or unload the other—doubling throughput without extra labor. Both stations share the same bonding head but operate sequentially, ensuring consistent process control.
A single operator handles all steps from one position. They place the LCD panel on the glass platform and activate vacuum hold-down. Then they position the FPC on its dedicated stage. Using the live monitor feed, they manually adjust X/Y/θ alignment until the mark points match. Once confirmed as “OK,” they press both start buttons to begin the cycle.
The platform then moves automatically into the bonding zone. The heated press head descends, applies preset force and time, and completes the main bond. After bonding, the platform returns to the loading position. If enabled, the buffer tape advances once. The operator removes the finished panel and repeats the process.
The OL-F017 supports panels from 5 inches (112 × 65 mm) to 17 inches (380 × 240 mm) with thicknesses from 0.2 mm to 2.2 mm. FPC dimensions range from 12 × 12 mm to 60 × 60 mm, with a minimum mark-to-mark distance of 11 mm. The COF-to-glass step height must be at least 0.4 mm to ensure proper contact.
Bonding parameters are fully adjustable:
The standard FPC press head measures 60 mm × 1.0 mm but can be customized per customer requirements. Heating is fast and stable, using embedded cartridge heaters with real-time feedback.
The machine includes a 2x optical magnification lens with a 1.9 mm × 1.4 mm field of view. Lighting is provided by a coaxial LED source, eliminating shadows and enhancing mark contrast. The two camera lenses can be spaced from 11 mm to 90 mm apart, accommodating various COF layouts.
This lower-alignment design is ideal for transparent substrates like cover glass or OGS (One-Glass Solution) panels. It avoids interference from upper fixtures and provides a direct view of alignment targets.
The LCD platform measures 550 mm (W) × 320 mm (D). The FPC stage is 120 mm × 60 mm. The entire machine weighs approximately 380 kg and stands 1550 mm tall, with a work height of 860 ± 30 mm. Its footprint is 1550 mm (W) × 960 mm (D).
The frame is finished in industrial beige, while functional parts are chrome-plated or anodized for durability. All surfaces are delivered clean and dust-free. Warning labels are affixed near hot or moving components for safety.
Operation requires a cleanroom environment with temperature between 22°C and 27°C and humidity from 40% to 70% RH. The machine must be used in a dust-controlled, static-safe area to protect sensitive display components.
An integrated buffer tape mechanism manages ACF carrier film. It accepts tape with an inner diameter ≥33 mm and outer diameter ≤80 mm. The feed pitch is adjustable from 1 to 20 mm. If the tape fails to advance during operation, the system triggers an audible and visual alarm—preventing missed bonds.
Control is managed via PLC logic, a color touchscreen interface, and physical manual buttons. Emergency stop and dual-hand start functions ensure operator safety. The system also includes status indicators and fault diagnostics.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, troubleshooting, and replacement of wear parts. Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumables and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is available after warranty expiration.
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OL-FOG156 Series – 15.6-Inch Single-Side Multi-Zone FOG Bonding Machines
Flexible Thermal Compression Systems for High-Density COF Bonding on LCD Panels
The OL-FOG156 Series by Olian Automatic Equipment Co., Ltd. comprises two variants of semi-automatic single-station FOG (Film-on-Glass) bonding machines, engineered for multi-segment thermal compression of COF (Chip-on-Film) circuits onto one edge of large-format rigid LCD panels up to 15.6 inches.
Both models support sequential pre-bonding and main bonding in a single workflow, with operator-assisted visual alignment via monitor. The key difference lies in the press head length, enabling optimization for either long continuous COF arrays (OL-FOG156L) or shorter, discrete COF segments (OL-FOG156S).
⚠️ Note: These machines assume that ACF has already been applied. They perform thermal compression only, not ACF lamination or automated vision alignment.
| Feature | Specification |
|---|---|
| Panel Size | Max: 350 mm × 250 mm (~15.6″) Min: 150 mm × 80 mm (~7″) Thickness: 0.2–2.2 mm |
| Temperature Range | RT to 400°C (both pre-press & main press) |
| Press Head Uniformity | ≤ ±8°C across surface |
| Bonding Time | 0.1 – 99.9 seconds (programmable) |
| Pre-Press Force | 25 – 400 N |
| Main Press Force | OL-FOG156L: 55 – 1000 N OL-FOG156S: 25 – 400 N |
| Max FPCs per Edge | ≤10 pcs (OL-FOG156L) ≤ Number of main press heads (OL-FOG156S) |
| Operation | Manual loading → Vacuum fixation → Visual alignment → Dual-hand start → Auto sequential bonding |
| Control | Manual buttons + indicator lights (no PLC/touchscreen) |
| Safety | Emergency stop, dual-hand start, three-color status lamp |
| Parameter | OL-FOG156L (Long Head) | OL-FOG156S (Short Head) |
|---|---|---|
| Pre-Press Head Length | 55 mm × 1 mm (standard) | 55 mm × 1 mm (standard) |
| Main Press Head Length | 200 mm × 2 mm (standard) | 220 mm × 1 mm (standard) |
| Typical Use Case | Bonding long, continuous COF ribbons (e.g., single wide driver IC or multi-chip array spanning >150 mm) | Bonding multiple short, discrete COFs (e.g., 2–10 separate flex circuits along one edge) |
| Force Capability | Higher main press force (up to 1000 N) for robust bonding of wide areas | Moderate force (up to 400 N), sufficient for standard COF segments |
| Customization | Both heads customizable per customer layout |
💡 Design Insight: Despite the name “short,” the OL-FOG156S actually has a slightly longer nominal main head (220 mm vs. 200 mm), but it is thinner (1 mm vs. 2 mm) and optimized for modular, segmented pressure application—not continuous wide-area bonding.
This semi-automated multi-zone approach ensures consistent bonding quality across complex edge layouts without full automation cost.
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OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
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ACF bonding Keywords Categorization and Explanation:
FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.
COG Bonder: Used for bonding COG (Chip On Glass) components.
COF Bonder: Used for bonding COF (Chip On Film) components.
COP Bonder: Used for bonding COP (Chip On Plastic) components.
FOG Bonder: Used for bonding FOG (Flexible On Glass) components.
FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.
FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.
TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.
OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.
IC Bonder: Used for bonding IC (Integrated Circuit) components.
Glass Bonder: Used for bonding glass components.
LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.
LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.
Mini LED Bonder: Used for bonding mini LED components.
Micro LED Bonder: Used for bonding micro LED components.
Zebra Paper Bonder: Used for bonding zebra paper components.
Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.
Mobilephone Bonding Machine: Used for bonding components in mobile phones.
Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.
Wearable Equipment Bonder: Used for bonding components in wearable devices.
TV Panel Bonder: Used for bonding components in TV panels.
LCD Module Bonder: Used for bonding LCD modules.
Flat Panel Display Bonder: Used for bonding flat panel displays.
ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.
COG (Chip On Glass): A process where chips are directly mounted on glass substrates.
COF (Chip On Film): A process where chips are mounted on flexible substrates.
COP (Chip On Plastic): A process where chips are mounted on plastic substrates.
FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.
FOB (Flexible On Board): A process where flexible circuits are mounted on boards.
FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.
TAB (Tape Automated Bonding): A process where tape is used to bond components.
OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.
IC (Integrated Circuit): A small chip that contains a complex electronic circuit.
FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.
Zebra Paper: A type of conductive paper used in bonding processes.
LCD Repair Machine: Used for repairing LCD screens.
LED Repair Machine: Used for repairing LED screens.
OLED Repair Machine: Used for repairing OLED screens.
Amoled Repair Machine: Used for repairing Amoled screens.
Mini LED Repair Machine: Used for repairing mini LED screens.
Micro LED Repair Machine: Used for repairing micro LED screens.
TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.
LCD Panel Repair Machine: Used for repairing LCD panels.
LED Panel Repair Machine: Used for repairing LED panels.
OLED Panel Repair Machine: Used for repairing OLED panels.
Amoled Panel Repair Machine: Used for repairing Amoled panels.
Flex Cable Repair Machine: Used for repairing flex cables.
IC Remover: A tool used to remove ICs from circuits.
IC Remove Machine: A machine used to remove ICs from circuits.
Differential Interference Microscope: A microscope used to inspect bonding processes.
Metallurgical Microscope: A microscope used to inspect metal surfaces.
Industrial Tool Microscope: A microscope used for industrial inspections.
Large Size Upright Microscope: A large microscope used for detailed inspections.
Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.
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Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.
Mobile Product Line Solutions: Solutions for producing mobile products.
PAD Display Product Line Solutions: Solutions for producing PAD displays.
Tablet Product Line Solutions: Solutions for producing tablet displays.
Notebook Product Line Solutions: Solutions for producing notebook displays.
Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.
High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.
Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.
Display Product Line Solution: A comprehensive solution for producing displays.
Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.
Electronic Paper Line Solutions: Solutions for producing electronic paper.
Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.
Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.
Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.
Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.
FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.
3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.
Bonding Machine Head: A part of the bonding machine used for bonding.
Bonding Machine Press Head: A part of the bonding machine used for pressing.
Bonding Machine Spare Parts: Various spare parts for bonding machines.
Bonding Machine Parts: Various parts for bonding machines.
ACF Tape: A tape used in bonding processes.
ACF Bonding Tape: A tape used in bonding processes.
ACF Glue: A glue used in bonding processes.
ACF Adhesive: An adhesive used in bonding processes.
ACF Bonding Machine Head: A part of the ACF bonding machine.
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ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.
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ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.
ACF Bonding Machine New: A new ACF bonding machine.
ACF Bonding Machine Homemade: A self-made ACF bonding machine.
ACF Bonding Machine Working: The working principle of an ACF bonding machine.
ACF Bonding Machine Cost: The cost of an ACF bonding machine.
Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.
Low Cost ACF Bonding Machine: An affordable ACF bonding machine.
ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.
ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.
How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.
Homemade ACF Bonding Machine: A self-made ACF bonding machine.
ACF Bonding Machine eBay: ACF bonding machines available on eBay.
ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.
ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.
ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.
ACF Bonding Machine New: A new ACF bonding machine.
ACF Bonding Machine Homemade: A self-made ACF bonding machine.
ACF Bonding Machine Working: The working principle of an ACF bonding machine.
ACF Bonding Machine Cost: The cost of an ACF bonding machine.
Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.
Low Cost ACF Bonding Machine: An affordable ACF bonding machine.
ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.
ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.
How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.
Homemade ACF Bonding Machine: A self-made ACF bonding machine.
ACF Bonding Machine eBay: ACF bonding machines available on eBay.
ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.
ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.
ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.
ACF Bonding Machine New: A new ACF bonding machine.
ACF Bonding Machine Homemade: A self-made ACF bonding machine.
ACF Bonding Machine Working: The working principle of an ACF bonding machine.
ACF Bonding Machine Cost: The cost of an ACF bonding machine.
Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.
Low Cost ACF Bonding Machine: An affordable ACF bonding machine.
ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.
ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.
How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.
Homemade ACF Bonding Machine: A self-made ACF bonding machine.
ACF Bonding Machine eBay: ACF bonding machines available on eBay.
ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.
ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.
ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.
ACF Bonding Machine New: A new ACF bonding machine.
ACF Bonding Machine Homemade: A self-made ACF bonding machine.
ACF Bonding Machine Working: The working principle of an ACF bonding machine.
ACF Bonding Machine Cost: The cost of an ACF bonding machine.
Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.
Low Cost ACF Bonding Machine: An affordable ACF bonding machine.
ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.
ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.
How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.
Homemade ACF Bonding Machine: A self-made ACF bonding machine.
ACF Bonding Machine eBay: ACF bonding machines available on eBay.
ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.
ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.
ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.
ACF Bonding Machine New: A new ACF bonding machine.
ACF Bonding Machine Homemade: A self-made ACF bonding machine.
ACF Bonding Machine Working: The working principle of an ACF bonding machine.
ACF Bonding Machine Cost: The cost of an ACF bonding machine.
Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.
Low Cost ACF Bonding Machine: An affordable ACF bonding machine.
ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for
In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.
COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel
. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices
. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.
COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces
. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices
. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing
.
COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays
. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices
.
FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices
. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications
.
FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics
. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes
.
FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays
. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.
ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG
. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines
.
TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities
. These machines are ideal for applications requiring high-density interconnections and compact designs
.
FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications
. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics
.
In addition to the above technologies, we also offer specialized bonding machines for various applications, including:
Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:
Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.
