FPC Bonder​

FPC Bonder​

FPC Bonder, also known as a Flexible Printed Circuit Bonder or Flex Cable Bonding Machine, is a crucial device in the electronics manufacturing industry. Shenzhen Olian, a renowned name in the field, designs and manufactures a wide range of high – quality FPC Bonders. These bonders can be classified into different types based on their operation mode, heating technology, and more.​

1. Working Principle​

The FPC Bonder functions by pressing the FPC (Flexible Printed Circuit) onto various substrates such as glass, PCB (Printed Circuit Board), or another FPC. This is achieved using ACF (Anisotropic Conductive Film) conductive adhesive as a medium. The process involves applying a specific temperature, pressure, and time. For example, when bonding an FPC to a glass substrate in the LCD manufacturing process, the ACF, which contains conductive particles, is placed between the FPC and the glass. Under the action of heat and pressure from the FPC Bonder, the adhesive softens, and the conductive particles are pressed to form electrical connections between the FPC and the glass, while the non – conductive matrix of the ACF provides insulation.​

2. Applications​

FPC Bonders are widely used in numerous industries. In the LCD/LED/OLED manufacturing sector, they are essential for attaching FPCs to panels in products like mobile phones, TVs, watches, pads, notebooks, touch panels, and ad players. In mobile phone production, for instance, FPC Bonders ensure the reliable connection of FPCs that carry signals between different components such as the display, motherboard, and camera module. They are also used in the repair services of these products. Additionally, in industries such as bank card manufacturing (where FPCs are used for contactless payment functions), zebra paper applications, and camera production, Shenzhen Olian’s FPC Bonders play a vital role.​

3. Types of FPC Bonders by Shenzhen Olian​

3.1 By Heating Technology​

3.1.1 Pulse Heating Bonder​

This type of FPC Bonder from Shenzhen Olian, such as the OL – FP003，OL-FP005, OL-FDP006,OL-FP006 model, uses pulse heating technology. It provides rapid heating and cooling cycles. Pulse heating is beneficial when dealing with sensitive components or materials that require precise temperature control. The heating element in the pulse heating bonder delivers short, high – energy pulses of heat, which can quickly reach the required bonding temperature. This not only reduces the overall heating time but also minimizes the risk of overheating adjacent components.​

3.1.2 Constant Temperature Bonder​

The constant temperature FPC bonder, like some models OL-FD006,OL-F003,OL-F006,OL-FOG156,OL-FOB156, in Shenzhen Olian’s product line, maintains a stable and continuous temperature during the bonding process. This is suitable for applications where a consistent temperature environment is crucial for achieving high – quality bonds. For example, when bonding FPCs to substrates with materials that have specific temperature – sensitive characteristics, a constant temperature bonder can ensure that the temperature remains within the optimal range throughout the bonding operation.​

3.2 By Operation Mode​

3.2.1 Semi – automatic FPC Bonder​

Shenzhen Olian’s semi – automatic FPC Bonders, such as certain entry – level models, require some manual intervention during the bonding process.

Operators are responsible for tasks like manually loading the FPC and substrate onto the machine’s platform.

Once the components are in place, the machine takes over and applies the pre – set temperature, pressure, and time parameters for the bonding operation.

These bonders are an excellent choice for small – to – medium – sized production batches or for manufacturers with a more hands – on approach.

They are cost – effective and can be easily operated by technicians with basic training.

For instance, in a small – scale electronics repair shop that needs to bond FPCs in a limited number of devices daily, a semi – automatic FPC Bonder provides the flexibility to handle different repair jobs while keeping costs down. Technically, they may have a slightly lower production capacity compared to their fully automatic counterparts but still offer high – precision bonding.

They often come with adjustable platforms to accommodate different – sized FPCs and substrates, and the temperature and pressure settings can be customized according to the specific bonding requirements.​

3.2.2 Automatic FPC Bonder​

The automatic FPC Bonders from Shenzhen Olian, on the other hand, offer a high – level of automation. These machines are equipped with advanced robotic arms or conveyor systems that can automatically load, position, and bond the FPCs to the substrates.

They are ideal for large – scale production lines where high – volume and high – speed bonding are required.

For example, in a large – scale mobile phone manufacturing factory that produces thousands of devices per day, an automatic FPC Bonder can significantly increase production efficiency.

They are integrated with sophisticated vision – based alignment systems, such as the down/up contraposition HD colorful CCD and large – sized HD LCD screens for visual inspection. This ensures that the FPCs are precisely aligned with the substrates before bonding, resulting in a higher yield rate.

Automatic FPC Bonders also often feature advanced control systems, such as the Panasonic PLC control system, which enables seamless operation and easy programming of different bonding processes. They can handle a wide range of FPC and substrate sizes, from small – sized components in wearable devices to larger – sized ones in tablets and laptops.​

3.3 By Applications:

FPC Bonder can be classified based on their specific applications and the type of bonding process they perform:

1. FOG (Flex-On-Glass) Bonder
   • Description: FOG bonders are used to bond FPCs directly onto glass substrates, commonly found in LCD and OLED displays. These machines offer high bonding accuracy and are essential for maintaining the quality and performance of display panels.
   • Features:
     • High bonding accuracy (XY: ±10µm) for all panel sizes.
     • Enhanced alignment accuracy using the same camera view to recognize marks on FPC and the LCD panel.
     • Improved stability through a rigid frame and new control methods for bonding load and speed.
   • Applications: Widely used in the production of small to medium-sized display panels, such as those found in smartphones and tablets.
2. FOB (Flex-On-Board) Bonder
   • Description: FOB bonders are designed to bond FPCs onto printed circuit boards (PCBs). They are crucial for connecting flexible circuits to rigid boards, ensuring a reliable electrical connection.
   • Features:
     • High throughput, capable of transferring up to 4 panels at once for panels smaller than 8 inches.
     • Reduced model changeover time, as no stage replacement is required for panel size and ACF width changes.
     • Double-stage IC supply to eliminate line stops.
   • Applications: Commonly used in the assembly of electronic devices where FPCs need to be connected to PCBs, such as in automotive electronics and industrial control panels.
3. FOF (Flex-On-Flex) Bonder
   • Description: FOF bonders are used to bond FPCs onto other FPCs, creating a flexible-to-flexible connection. This is particularly useful in applications where space is limited and flexibility is required.
   • Features:
     • High precision and reliability in bonding flexible-to-flexible connections.
     • Suitable for a wide range of FPC sizes and configurations.
   • Applications: Used in wearable technology, foldable devices, and other applications where flexibility and compact design are crucial.
4. T-FOG (Touch Flex-On-Glass) Bonder
   • Description: T-FOG bonders are a variant of FOG machines that touch panel FPCs onto glass substrates. This process is particularly useful for applications where additional support or protection is required.
   • Features:
     • Enhanced bonding strength and durability.
     • Suitable for high-resolution displays and applications requiring high reliability.
   • Applications: Commonly used in high-end display manufacturing, such as OLED and micro-LED displays.
5. FOP (Flexible Printed Circuit on Plastic) Bonder
   • Description: FOP bonders are general-purpose machines used for bonding FPCs to Plastic, They offer a wide range of bonding options and are highly versatile.
   • Features:
     • High bonding accuracy and precision.
     • Support for various bonding materials, including ACF and solder paste.
     • Suitable for a wide range of panel sizes and applications.
   • Applications: Used in the production of a variety of electronic devices, from consumer electronics to industrial and medical equipment.

4. Technical Specifications​

Shenzhen Olian’s FPC Bonders come with impressive technical specifications. Take the upper and down contraposition movable platform FPC bonding machine (models like F003/F006/FP003/FP006/FS003/FS006) as an example:​

• Suitable for: It is designed for aligning and pressing FPCs to LCD panel glass, PCB, or COF (Chip on Film) which have ACF film attached. It can handle size ranges from 1 to 12 inches.​

• Attach Precision: The attach precision is as high as ±0.015 mm, ensuring accurate and reliable connections.​

• Machine Capacity: With a capacity of 6000 pcs/day (at 12 s/pc), it offers high – volume production capabilities.​

• Power Supply: It operates on a power supply of 220 V ± 10%, 50 Hz, with a power consumption of 1200 W.​

• Air Supply: Requires an air supply of 0.5 – 0.7 MPa of dry air.​

• Platform Size and Precision: The platform size is L 90 * W 60 mm, and it has a precision of ±0.01 mm.​

• Temperature and Time Range: The temperature range is 1 – 350 °C, and the time range is 1 – 99.9 sec, providing flexibility for different bonding requirements.​

• Product Size and Weight: The machine has dimensions of W 850 * D 800 * H 1460 mm and a net weight of about 200-500 kg.​

These FPC Bonders are also equipped with advanced features such as a constant temperature heating system or a pulse heating system, Panasonic PLC control system for precise operation control, a human – machine interface for easy operation, automatic temperature alarm to prevent overheating, a press head level adjustable device for accurate pressure application, down/up contraposition HD colorful CCD and 10.4 – 24 inch HD LCD for visual inspection during the bonding process, and manual/automatic switching options. They also have imported electrical configurations, making them suitable for all LCD, LED, on – cell, and OLED panels.​

Key Features and Specifications

• High Precision: Offers high bonding accuracy, typically within ±0.015mm, ensuring reliable connections.
• Increased Productivity: Automation reduces the time required for each bonding process, allowing for higher production rates.
• Reduced Labor Costs: By minimizing manual operations, the machine reduces labor costs and the risk of human error.
• Enhanced Reliability: The consistent bonding process ensures that each product meets high-quality standards, reducing the likelihood of defects.
• Real-Time Monitoring: Advanced sensors detect bonding quality in real time, allowing for immediate error detection and minimizing waste and rework.
• High-Speed Automation: Designed for high-speed production, increasing throughput while maintaining accuracy.

Applications of FPC Bonders

FPC Bonders are indispensable across diverse industries:

• Consumer Electronics: Commonly used in the manufacturing of smartphones, tablets, and other devices that require flexible and durable displays.
• Automotive Displays: Used in the production of vehicle displays, where flexibility and durability are critical.
• Medical Devices: High-precision bonding for diagnostic equipment screens.
• Industrial Equipment: Applied in control panels and ruggedized display solutions.
• Foldable and Wearable Tech: Facilitates bonding for next-gen foldable devices and flexible wearables.

In conclusion, Shenzhen Olian’s FPC Bonder are highly reliable and efficient devices that meet the diverse needs of the electronics manufacturing and repair industries. Their advanced features and excellent technical specifications make them a preferred choice for companies looking to ensure high – quality FPC bonding operations.