FOB bonder归档 - ACF COF COG COP FOG FOP FOF FOB FOF TFOG TFOF OLB TAB bonder/bonding machines manufacturer

OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder

High-Precision Manual FOG Bonding for 65-Inch Displays

Engineered by Olian Automaic

The OL-FD065D Up-Down Alignment Constant-Temperature FOG Bonder is designed and manufactured by Olian Automaic.
It is a manual flat-panel display (FPD) bonding system, engineered for pre-bonding flexible printed circuits (FPC/COF) and film-on-glass (FOG) applications.
The equipment supports display sizes ranging from 10 inches (200×110 mm) to 65 inches (1450×810 mm), with material thicknesses between 0.1 mm and 1 mm.

Core Functionality

Features manual up-down alignment, allowing operators to precisely position the glass/film and FPC/PCB using Mark points.
After alignment, the system automatically performs the constant-temperature thermocompression bonding process.
Designed as a single-station solution, ideal for small-to-medium volume production and R&D environments.

Key Specifications

Platform Size: Compatible with displays up to 65 inches.
Display Compatibility:
- Maximum: 65 inches (1450×810 mm).
- Minimum: 10 inches (200×110 mm).
- Thickness: 0.1–1 mm.
FPC/COF Dimensions: Length and width from 12 mm to 60 mm; thickness 0.1–1 mm.
Alignment Accuracy:
- X-axis: ±0.04 mm.
- Y-axis: ±0.05 mm.
Cycle Time: Approximately 8 seconds per unit (excluding manual alignment time).
Temperature Range: Room temperature to 400°C with constant-temperature heating.
Temperature Uniformity: ±5°C across the bonding surface.
Pressure Control: 25–400 N with ±5 N precision.

Technical Features

Dual Imaging System:
- Equipped with two 300K-pixel CCD cameras.
- Coaxial LED lighting ensures uniform illumination.
- Field of view: 1.9×1.4 mm for high-precision alignment.
Adjustable Platforms:
- Glass platform with ±2 mm Z-axis adjustment via micrometer.
- FPC platform supports manual X/Y/Q/Z-axis adjustment (±5 mm for X/Y/Q; ±2 mm for Z).
- Vacuum fixation using 1 mm holes and 1.5 mm grooves for secure substrate holding.
Tungsten Alloy Hot Press Head:
- Surface flatness: ≤5 μm (55 mm standard).
- Parallelism can be fine-tuned using adjustment screws.

Performance and Efficiency

Product Pass Rate: ≥98% (excluding human error and material defects).
System Failure Rate: ≤2% under normal operating conditions.
Model Changeover Time: Approximately 20 minutes for quick production switching.
Dual Access Levels:
- Operator mode: No password required for daily operations.
- Engineer mode: Password-protected for advanced parameter settings.

Operational Environment

Power Requirements: Single-phase AC 220V, 50/60 Hz, 1500W.
Air Supply: 0.4–0.7 MPa, 250 L/min using transparent 8 mm tubing.
Vacuum Supply: 36 L/min using yellow tubing.
Operating Conditions: Cleanroom environment with temperature 22–27°C and humidity 40–70%.

After-Sales Support

Warranty: One year (covers non-consumable parts; excludes wear items and damage caused by misuse).
On-Site Training: One-day program covering equipment operation, calibration, and basic troubleshooting.
Technical Service: 72-hour on-site response for issues arising during the warranty period.

Target Applications

Ideal for manufacturers involved in the assembly of LCD and OLED panels.
Commonly used for television displays, industrial monitors, digital signage, and automotive infotainment systems.
Suitable for both prototyping and medium-batch production lines.

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OL-FP85T Dual-Station Manual Pulse Bonder

High-Precision FOG and Flip-Chip Bonding Solution for 85-Inch Displays

Engineered by Olian Automaic

The OL-FP85T Dual-Station Manual Pulse Bonder is developed by Olian Automaic.
It is designed for flexible printed circuits (FPC), chip-on-film (COF), and film-on-glass (FOG) applications.
Supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm).
Compatible with material thicknesses between 0.1 mm and 1 mm.

Dual Independent Workstations for Enhanced Productivity

Left station dedicated to outer lead bonding (OLB).
Right station dedicated to film-on-board (FOB).
Each station operates independently to improve workflow efficiency.
Operators manually position glass/film and align FPCs/PCBs using Mark points.
System automatically executes thermocompression bonding after alignment.

Advanced Imaging for Precision Alignment

Equipped with dual imaging systems.
OLB station features coaxial LED lighting.
PCB station uses spot LED lighting.
Both stations use 300K-pixel CCD cameras.
Field of view: 1.9×1.4 mm for accurate alignment.

Superior Temperature and Pressure Control

Temperature range: room temperature to 450°C.
Pulse heating technology ensures consistent thermal performance.
Surface temperature uniformity: ±8°C.
Pressure control range: 25 N to 400 N.
Pressure accuracy: ±5 N for reliable and repeatable bonds.

High Accuracy and Yield Performance

Positional accuracy: ±0.050 mm (X-axis), ±0.055 mm (Y-axis).
Product pass rate: ≥98% (excluding human or material factors).
Failure rate: ≤2% under normal operating conditions.

Adjustable Platforms and Durable Design

Glass platform with ±2 mm Z-axis adjustment via micrometer.
Aluminum platform with ±2 mm lifting stage adjustment.
Vacuum fixation using 1 mm holes and 1.5 mm grooves.
Titanium alloy hot press head ensures durability.
Surface flatness: ≤3 μm.
Parallelism adjustable via precision screws.

Flexible Production and Secure Access

Model changeover time: ～20 minutes.
Dual access levels: operator mode (no password) and engineer mode (password-protected).
Ensures secure parameter management and reduces operational errors.

Optimized for Cleanroom Environments

Designed for cleanroom use.
Operating temperature: 22–27°C.
Humidity range: 40–70%.
Power supply: single-phase AC 220V, 50/60 Hz, 1500W.
Air supply: 0.4–0.7 MPa, 250 L/min (transparent 8 mm tubing).
Vacuum: 36 L/min (yellow tubing).
Standardized tubing for easy maintenance and integration.

Comprehensive After-Sales Support

One-year warranty (excludes wear parts and human-induced damage).
On-site training provided.
72-hour on-site response for warranty-period issues.
Minimizes production downtime and ensures continuous operation.

Target Applications

Ideal for large LCD and OLED panel assembly.
Suitable for television displays, industrial control screens, digital signage, and automotive infotainment systems.
Manual operation with automated bonding precision.
Fits well in prototyping and medium-volume production environments.

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OL-FPD85 Single-Station FOG FOB COF Pulse Bonder

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Precision Manual FOG Bonding for 85-Inch Displays.

The OL-FPD85 Single-Station Dual-Sided Alignment Pulse Bonder, manufactured by Shenzhen Olian Automatic Equipment Co., Ltd., is a manual flat-panel display (FPD) bonding solution engineered for pre-bonding flexible printed circuits (FPC/COF) or film-on-board (FOB) applications. Designed for 85-inch platforms, this equipment supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm) with thicknesses of 0.1–1 mm.

OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Key Specifications

Platform Size: 85-inch compatible
Display Compatibility:
- Max: 85″ (1890×1060 mm)
- Min: 10″ (200×110 mm)
- Thickness: 0.1–1 mm
FPC/COF Dimensions: 12–60 mm (L×W), thickness 0.1–1 mm
Accuracy: ±0.040 mm (X-axis), ±0.045 mm (Y-axis)
Cycle Time: ≤25 seconds per unit (excluding manual alignment)
Temperature Range: Room temperature to 450°C (pulse heating)
Pressure Control: 30–400 N (±5 N precision)

Core Features

Manual Dual-Sided Alignment:
Operators place glass/film on the platform, position FPC/PCB manually, and align using Mark points. The system automates the thermocompression bonding process.
Dual Imaging System:
- OLB Unit (Lower Lens): 2× 300K-pixel CCD cameras with coaxial LED lighting (FOV: 1.9×1.4 mm).
- PCB Unit (Upper Lens): 2× 300K-pixel CCD cameras with spot LED lighting (FOV: 1.9×1.4 mm).
Adjustable Platforms:
- Glass platform with ±2 mm Z-axis adjustment (micrometer).
- Aluminum platform with ±2 mm lifting stage adjustment.
- Vacuum fixation (1 mm holes, 1.5 mm grooves).
Titanium Alloy Hot Press Head:
- Surface flatness: ≤3 μm (55 mm standard).
- Parallelism adjusted via screws.

Technical Advantages

High Yield: ≥98% product pass rate (excluding human/material factors).
Low Downtime: ≤2% failure rate (non-human factors).
Quick Changeover: ～20 minutes for new model setup.
Dual Access Levels: Operator (no password) and engineer (password-protected parameters).

Operational Environment

Power: Single-phase AC 220V, 50/60 Hz, 1500W.
Air Supply: 0.4–0.7 MPa, 250 L/min (transparent 8 mm tubing).
Vacuum: 36 L/min (yellow tubing).
Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

Warranty: 1 year (excludes wear parts and human-induced damage).
Training: 1-day on-site program covering operation, calibration, and troubleshooting.
Service: 72-hour on-site response for warranty-period issues.

This bonder is ideal for manufacturers requiring precision alignment for large-format displays. Its manual flexibility and automated pressing ensure high-quality bonds for FPC/COF applications.

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OL-FF-173 – 17.3-Inch FOG/FOB Bonding & Rework machine

OL-FF-173 – 17.3-Inch Single-Side Multi-Zone FOG/FOB Bonding & Rework machine

Integrated Thermal Compression Platform for Both FOG and FOB Processes with Sequential Rework Capability

The OL-FF-173 by Olian Automatic Equipment Co., Ltd. is a versatile semi-automatic bonding machine designed for medium-sized display modules up to 17.3 inches. It uniquely supports both FOG (Film-on-Glass) and FOB (Film-on-Board) processes—including pre-bonding, main bonding, and rework functions—all within a single integrated platform. This makes it ideal for pilot lines, small-batch production, or repair stations handling mixed product types.

The system features a single-side, multi-segment architecture that can process up to 6 FPCs or 6 PCBs along one edge of a panel in sequence. Operators can configure the machine to run FOG only, FOB only, or FOG followed immediately by FOB—without changing hardware. If both are enabled, the machine automatically completes all FOG steps first, then proceeds to FOB bonding on the same unit.

Dual-Mode Workflow: FOG and FOB in One Cycle

For FOG mode, the operator places the LCD panel on the glass worktable and activates vacuum suction. They then position the FPC(s) on the FPC stage and perform rough alignment. Using a live monitor feed, they fine-tune alignment visually. After pressing both start buttons, the pre-press head descends to temporarily bond the first segment. The platform then shifts automatically to the next position. This repeats until all pre-press zones are complete. Finally, the platform moves to the main bonding station. The main press head applies full heat and pressure to cure all segments at once.

If FOB mode is also enabled, the machine returns to the FOG pre-press station—but now treats the bonded module as a “panel” for FOB processing. The operator places a PCB on the worktable, aligns it with the existing FPC leads, and initiates another bonding cycle. This seamless transition eliminates manual transfer between machines and reduces handling damage.

All loading, alignment, and unloading occur from the same front position, improving ergonomics and workflow consistency.

Precision Thermal and Mechanical Performance

Both pre-press and main-press heads operate within a temperature range of room temperature to 400°C, with surface uniformity held to ±5°C—ensuring reliable ACF curing. Bonding time is adjustable from 0.1 to 99.9 seconds.

Force output is independently controlled:

Pre-press: 25 N to 400 N
Main press (FOG): 35 N to 500 N

Standard press head dimensions are:

Pre-press: 55 mm × 1 mm
FOG main press: 55 mm × 1 mm
FOB main press: 55 mm × 2 mm

All heads are made of high-wear-resistant material and can be customized to match specific COF or PCB layouts.

Control, Safety, and Reliability

The machine uses physical controls including Φ24 mm start and vacuum buttons, plus a Φ22 mm emergency stop switch. A three-color signal lamp indicates operational status (ready, running, fault). While the document does not specify PLC or touchscreen use, the process is fully automated once started—minimizing operator error.

Safety is reinforced by the dual-hand start requirement, preventing accidental activation during alignment.

Support, Training, and Warranty

Olian includes one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, common troubleshooting, and replacement of wear parts. Duration can be adjusted by mutual agreement.

The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is provided beyond the warranty term.

Ideal Applications

The OL-FF-173 excels in environments requiring flexibility and rework capability—such as:

Display module R&D labs
Small-volume OEM production
Repair centers handling defective FOG/FOB units
Manufacturers of industrial, medical, or automotive displays with mixed FPC/PCB interfaces

Its ability to perform FOG → FOB in one continuous flow significantly reduces cycle time and improves yield compared to using two separate machines.

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OL-FOB156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FOB156 – 15.6-Inch FOB Bonding Machine

High-Efficiency Thermal Compression System for Multi-Segment COF-to-PCB Bonding

The OL-FOB156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic FOB (Film-on-Board) bonding machine engineered for the precise thermal compression of multiple COF (Chip-on-Film) or FPC (Flexible Printed Circuit) leads onto a single edge of rigid PCBs used in display modules up to 15.6 inches. Designed with a long main press head, this system supports multi-segment sequential bonding, enabling high-reliability electrical connections across extended or densely populated PCB bonding zones—common in automotive displays, industrial control panels, and smart appliance interfaces.

Unlike single-point bonders, the OL-FOB156L allows operators to process up to 10 individual FPCs along one side of a PCB in a single workflow, significantly improving throughput while maintaining consistent bond quality.

FKey Features and Capabilities

The machine operates through a well-defined manual-assisted process..

The operator begins by placing the PCB onto the dedicated worktable and activating vacuum suction via a Φ24 mm button to ensure flatness and stability.

Next, the FPCs are positioned on their respective stage and roughly aligned with the PCB pads. Using a live monitor feed, the operator performs fine visual alignment before initiating the cycle with a dual-hand start mechanism—a critical safety feature that prevents accidental activation.

Once started, the machine automatically executes a pre-press step at the first bonding position using a compact 55 mm × 2 mm tungsten carbide press head.

After completion, the platform shifts horizontally to the next segment, repeating the pre-press until all designated positions are processed.

If the system is configured for automatic alignment (e.g., with optional vision), pre-press may be skipped, proceeding directly to main bonding.

Main bonding station

Following pre-press, the platform moves to the main bonding station,

where two long (200 mm × 2 mm standard) tungsten carbide press heads descend simultaneously.

These heads deliver a precisely controlled force ranging from 55 N to 1000 N,

with temperature maintained between room temperature and 400°C.

The surface temperature uniformity across the press head is guaranteed within ±8°C, ensuring consistent ACF (Anisotropic Conductive Film) curing. Bonding time is fully adjustable from 0.1 to 99.9 seconds.

Both pre-press and main press units utilize pneumatic cylinders with linear guides for smooth vertical.

motion and precision pressure regulators for repeatable force control.

The press heads are made of tungsten steel, offering exceptional wear resistance and surface flatness within ±5 microns. The main press heads also feature push-pull adjustment screws for fine-tuning parallelism relative to the PCB surface.

The PCB platform is constructed from hard anodized magnesium aluminum alloy, providing excellent rigidity and thermal stability. It incorporates a dense array of 1 mm vacuum holes and channels to secure panels firmly during bonding.

Platform flatness is maintained within ±0.008 mm per 100 mm, and it supports four-axis manual adjustment (X, Y, θ, and Z) via micrometer-style knobs with ±3 mm (X/Y/θ) and ±4 mm (Z) travel—enabling precise registration even with panel tolerances.

The machine is designed for single-operator use, with all loading, alignment. and unloading performed.

from the same front position, enhancing ergonomics and workflow efficiency.

Control and Safety

Operation is managed through physical controls: a Φ24 mm start button, a Φ24 mm vacuum switch.

and a Φ22 mm emergency stop.

A three-color signal lamp provides real-time status feedback (ready, running, fault). The system does not include a PLC or touchscreen, prioritizing simplicity and reliability in production environments.

Support and Warranty

Olian includes a Chinese-language operation manual and provides one-day on-site training covering.

installation, parameter setup, routine maintenance, and replacement of consumable parts.

The machine is covered by a 12-month warranty under normal operating conditions.

During the warranty period, if remote troubleshooting fails, Olian guarantees on-site technical support within 72 hours. Lifelong technical assistance is available beyond the warranty term.

Customization and Applications

While the standard main press head measures 200 mm × 2 mm, Olian offers customization to match specific PCB layouts. This model is particularly suited for applications requiring long-edge, multi-chip COF bonding, such as driver boards for large-format LCDs where multiple flex circuits must be reliably connected in sequence.

In summary, the OL-FOB156L delivers a robust, efficient, and operator-friendly solution for medium-to-high volume FOB production—combining precision mechanics, thermal stability, and flexible multi-zone capability in a single platform.

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ACF bonding Keywords Explanation

ACF bonding Keywords Categorization and Explanation:

1. Bonding Machines

FOB Bonder: A machine used for bonding FOB (Flexible On Board) components.

COG Bonder: Used for bonding COG (Chip On Glass) components.

COF Bonder: Used for bonding COF (Chip On Film) components.

COP Bonder: Used for bonding COP (Chip On Plastic) components.

FOG Bonder: Used for bonding FOG (Flexible On Glass) components.

FOF Bonder: Used for bonding FOF (Flexible On Flexible) components.

FPC Bonder: Used for bonding FPC (Flexible Printed Circuit) components.

TAB Bonder: Used for bonding TAB (Tape Automated Bonding) components.

OLB Bonder: Used for bonding OLB (Outer Lead Bonding) components.

IC Bonder: Used for bonding IC (Integrated Circuit) components.

Glass Bonder: Used for bonding glass components.

LCD Panel Bonder: Used for bonding LCD (Liquid Crystal Display) panels.

LED Panel Bonder: Used for bonding LED (Light Emitting Diode) panels.

Mini LED Bonder: Used for bonding mini LED components.

Micro LED Bonder: Used for bonding micro LED components.

Zebra Paper Bonder: Used for bonding zebra paper components.

Touch Panel FPC Bonder: Used for bonding FPC components in touch panels.

Mobilephone Bonding Machine: Used for bonding components in mobile phones.

Smart Watch LCD Bonder: Used for bonding LCD components in smart watches.

Wearable Equipment Bonder: Used for bonding components in wearable devices.

TV Panel Bonder: Used for bonding components in TV panels.

LCD Module Bonder: Used for bonding LCD modules.

Flat Panel Display Bonder: Used for bonding flat panel displays.

2. Bonding Processes and Materials

ACF (Anisotropic Conductive Film): A film used in bonding processes to connect different layers.

COG (Chip On Glass): A process where chips are directly mounted on glass substrates.

COF (Chip On Film): A process where chips are mounted on flexible substrates.

COP (Chip On Plastic): A process where chips are mounted on plastic substrates.

FOG (Flexible On Glass): A process where flexible circuits are mounted on glass substrates.

FOB (Flexible On Board): A process where flexible circuits are mounted on boards.

FOF (Flexible On Flexible): A process where flexible circuits are mounted on other flexible circuits.

TAB (Tape Automated Bonding): A process where tape is used to bond components.

OLB (Outer Lead Bonding): A process where the outer leads of components are bonded.

IC (Integrated Circuit): A small chip that contains a complex electronic circuit.

FPC (Flexible Printed Circuit): A flexible circuit board used in various electronic devices.

Zebra Paper: A type of conductive paper used in bonding processes.

3. Repair and Maintenance Equipment

LCD Repair Machine: Used for repairing LCD screens.

LED Repair Machine: Used for repairing LED screens.

OLED Repair Machine: Used for repairing OLED screens.

Amoled Repair Machine: Used for repairing Amoled screens.

Mini LED Repair Machine: Used for repairing mini LED screens.

Micro LED Repair Machine: Used for repairing micro LED screens.

TFT Glass Repair Machine: Used for repairing TFT (Thin Film Transistor) glass screens.

LCD Panel Repair Machine: Used for repairing LCD panels.

LED Panel Repair Machine: Used for repairing LED panels.

OLED Panel Repair Machine: Used for repairing OLED panels.

Amoled Panel Repair Machine: Used for repairing Amoled panels.

Flex Cable Repair Machine: Used for repairing flex cables.

IC Remover: A tool used to remove ICs from circuits.

IC Remove Machine: A machine used to remove ICs from circuits.

Differential Interference Microscope: A microscope used to inspect bonding processes.

Metallurgical Microscope: A microscope used to inspect metal surfaces.

Industrial Tool Microscope: A microscope used for industrial inspections.

Large Size Upright Microscope: A large microscope used for detailed inspections.

Second Hand Differential Interference Microscope: A used microscope for inspecting bonding processes.

4. Specific Applications and Solutions

Whole Line Solution for Intelligent Wearable Products: A comprehensive solution for producing intelligent wearable products.

Whole Line Solution for Intelligent Watches: A comprehensive solution for producing intelligent watches.

Mobile Product Line Solutions: Solutions for producing mobile products.

PAD Display Product Line Solutions: Solutions for producing PAD displays.

Tablet Product Line Solutions: Solutions for producing tablet displays.

Notebook Product Line Solutions: Solutions for producing notebook displays.

Industrial Control Display Product Line Solutions: Solutions for producing industrial control displays.

High-Level Flexible Screen Glue Field Production Solutions: Solutions for producing high-level flexible screens.

Intelligent Locomotive, Notebook Product Line Solutions: Solutions for producing intelligent locomotives and notebooks.

Display Product Line Solution: A comprehensive solution for producing displays.

Commercial Display Screen – Flexible Bonding Production Line Solution: A solution for producing commercial display screens.

Electronic Paper Line Solutions: Solutions for producing electronic paper.

Electronic Paper Laminating, Bonding, Dispensing Field Line Solutions: Solutions for producing electronic paper laminating, bonding, and dispensing.

Backlight Leading, Laminated Film, Shading, Wrapping Line Equipment Solutions: Solutions for producing backlight leading, laminated film, shading, and wrapping.

Fingerprint Module Under the Screen Bond Spot Glue and AOI Intelligent Detection Field Solutions: Solutions for producing fingerprint modules under the screen.

Automatic OCA, OCR Fit Field Production Solutions: Solutions for producing automatic OCA (Optically Clear Adhesive) and OCR (Optical Character Recognition) fits.

FPC Covering Film, EMI Automatic Laminating, FPC Exposure Special Equipment Field Solutions: Solutions for producing FPC covering film, EMI (Electromagnetic Interference) automatic laminating, and FPC exposure.

3C Product Inspection Packaging Production Line Solution: Solutions for producing 3C product inspection and packaging.

5. Accessories and Parts

Bonding Machine Head: A part of the bonding machine used for bonding.

Bonding Machine Press Head: A part of the bonding machine used for pressing.

Bonding Machine Spare Parts: Various spare parts for bonding machines.

Bonding Machine Parts: Various parts for bonding machines.

ACF Tape: A tape used in bonding processes.

ACF Bonding Tape: A tape used in bonding processes.

ACF Glue: A glue used in bonding processes.

ACF Adhesive: An adhesive used in bonding processes.

ACF Bonding Machine Head: A part of the ACF bonding machine.

ACF Bonding Machine Price: The cost of an ACF bonding machine.

ACF Bonding Machine Manufacturer: A company that manufactures ACF bonding machines.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine PDF: A PDF document related to ACF bonding machines.

ACF Bonding Machine Spare Parts: Spare parts for ACF bonding machines.

ACF Bonding Machine Working: The working principle of an ACF bonding machine.

ACF Bonding Machine Cost: The cost of an ACF bonding machine.

Accessoire ACF Bonding Machine: Accessories for ACF bonding machines.

Low Cost ACF Bonding Machine: An affordable ACF bonding machine.

ACF Bonding Machine Demon for Replacing IC: A demonstration of using an ACF bonding machine for replacing ICs.

ACF Pulse Heat Bonding Machine: A machine that uses pulse heat for bonding.

How to Make ACF Bonding Machine: Instructions for making an ACF bonding machine.

Homemade ACF Bonding Machine: A self-made ACF bonding machine.

ACF Bonding Machine eBay: ACF bonding machines available on eBay.

ACF Bonding Machine for Mobile: An ACF bonding machine for mobile devices.

ACF Bonding Machine Head Price: The cost of an ACF bonding machine head.

ACF Bonding Machine Manual: A manual for operating an ACF bonding machine.

ACF Bonding Machine New: A new ACF bonding machine.

ACF Bonding Machine Homemade: A self-made ACF bonding machine.