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OL-F0712 – 15.6-Inch Dual-Station FOG Bonding Machine

OL-F0712 – 15.6-Inch Dual-Station FOG Bonding Machine with Top & Bottom Vision Alignment

Ultra-High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels

The OL-F0712 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. What sets it apart is its dual-camera vision system—featuring simultaneous top-view and bottom-view alignment—enabling unparalleled registration accuracy between COF terminals and ITO pads, even on multi-layer, opaque, or high-density interconnect (HDI) panels.

Combined with dual independent workstations, the OL-F0712 delivers both micron-level precision and continuous production throughput, making it ideal for demanding applications in automotive displays, medical imaging, avionics, and premium consumer electronics.

⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.

🔍 Key Technical Features

✅ Dual-Vision Alignment System (Top + Bottom)

Camera Configuration:
- Top Camera: Views COF from above
- Bottom Camera: Images panel pads through glass substrate
Lens Magnification: 2× optical zoom (per camera)
Field of View (FOV): 1.9 mm × 1.4 mm
Lighting: Coaxial LED illumination on both sides for glare-free, shadow-free imaging
Inter-Camera Distance: Adjustable from 12 mm to 90 mm to match various COF pitches
Alignment Method: Operator manually fine-tunes X/Y/θ alignment using live split-screen view until COF and pad patterns are perfectly overlaid

This stereo alignment capability eliminates parallax and layer-shift errors—critical for panels with black matrix, touch sensors, or embedded layers.

✅ Dual-Station Continuous Workflow

Two independent vacuum platforms enable parallel operation:
- While Station 1 performs bonding, the operator loads/unloads Station 2
Reduces cycle time by up to 40% compared to single-station machines
Optimized for high-mix, medium-to-high volume production

✅ Bonding Performance

Panel Compatibility:
- Max Size: 350 mm × 250 mm (~15.6″ diagonal)
- Thickness: 0.2 – 2.2 mm
COF Specifications:
- Width: 12 – 30 mm
- Length: 12 – 60 mm
- Thickness: 0.02 – 0.2 mm
Bonding Force: Servo-controlled, 20–120 N (repeatability ≤ ±3 N)
Temperature Range: Up to 400°C with surface uniformity ≤ ±2°C
Bonding Time: 0.1 – 99.9 seconds (user-programmable)

✅ Buffer Tape Handling System

Buffer Tape Inner Diameter: ≥33 mm
Outer Diameter: ≤80 mm
Feed Pitch: Adjustable from 1 mm to 20 mm
Safety Feature: Machine triggers an alarm if tape fails to advance, preventing skipped bonds or misfeeds

🖥️ Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup
- Manual control buttons for emergency override and jog functions
Operating Modes:
- Manual Mode: Full control over alignment, head movement, and bonding
- Auto Mode: One-button cycle after visual alignment confirmation
Ergonomics:
- Work height: 890 ± 30 mm
- Dual monitors or split-screen display for simultaneous top/bottom view

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Power Supply: AC 220V, 50/60 Hz, single-phase
Compressed Air: 0.4–0.7 MPa
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C | Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Dual-vision alignment calibration
- Dual-station workflow optimization
- Parameter tuning for different COF types and panel stacks
- Troubleshooting (e.g., image focus issues, tape feed alarms)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables, wear parts (buttons, cutters), damage from misuse or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer within 72 hours if remote assistance fails during warranty

✅ Included Standard Components

Dual vacuum platforms with independent control
Top + bottom coaxial vision alignment system
Custom COF bonding heads (tooling per customer drawing)
Buffer tape feed mechanism with pitch control
Φ24 mm start/vacuum buttons, Φ22 mm emergency stop
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-F0712
Function: Dual-station, dual-vision FOG main bonder
Panel Size: Up to 15.6 inches
Bonding Sides: Front and rear edges
Core Advantage: Highest alignment accuracy via top+bottom vision + dual-station productivity
Target Applications:
- Automotive instrument clusters & center displays
- Medical diagnostic monitors
- Industrial HMIs with high-reliability requirements
- High-end laptops and tablets with narrow bezels

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OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine

OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment

High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels

The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.

Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.

⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.

🔍 Key Technical Features

✅ Dual-Station Continuous Workflow

Two independent vacuum platforms allow simultaneous loading/unloading and bonding
While Station 1 bonds, the operator prepares Station 2—maximizing uptime and throughput
Ideal for lean production cells requiring minimal operator idle time

✅ Bottom Vision Alignment System

Camera Type: High-resolution industrial CMOS
Lens Magnification: 2× optical zoom
Field of View (FOV): 1.9 mm × 1.4 mm
Lighting: Coaxial LED illumination for glare-free imaging of reflective pads
Inter-Camera Distance: Adjustable from 12 mm to 90 mm to accommodate various COF pitches
Alignment Method: Manual fine-tuning via joystick or micrometer knobs under live camera view

✅ Bonding Performance

Panel Compatibility:
- Max Size: 350 mm × 250 mm (~15.6″ diagonal)
- Thickness: 0.2 – 2.2 mm
COF Dimensions:
- Width: 12 – 30 mm
- Length: 12 – 60 mm
- Thickness: 0.02 – 0.2 mm
Bonding Force: Servo-controlled, 20–120 N (±3 N repeatability)
Temperature Range: Up to 400°C with ±2°C uniformity
Bonding Time: 0.1 – 99.9 seconds (programmable)

✅ Buffer Tape Handling (for COF Carrier)

Buffer Tape Inner Diameter: ≥33 mm
Outer Diameter: ≤80 mm
Feed Pitch: Adjustable from 1 mm to 20 mm
Safety Feature: Machine triggers alarm if tape fails to advance, preventing missed bonds

🖥️ Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface)
- Manual control buttons for emergency override
Operating Modes:
- Manual Mode: Full operator control over alignment and bonding
- Auto Mode: One-button cycle after visual alignment confirmation
Ergonomics:
- Work height: 890 ± 30 mm
- Clean, uncluttered layout for easy access and maintenance

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Power Supply: AC 220V, 50/60 Hz, single-phase
Compressed Air: 0.4–0.7 MPa
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C | Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Dual-station workflow setup
- Bottom-vision alignment calibration
- Parameter optimization for different COF types
- Troubleshooting (e.g., misalignment, tape feed errors)
Warranty: 12 months on mechanical/electrical systems under normal use
- Exclusions: Consumables, wear parts, damage from misuse or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote resolution fails during warranty

✅ Included Standard Components

Dual vacuum platforms with independent control
Bottom-view stereo microscope system with coaxial lighting
Custom COF bonding heads (tooling per customer drawing)
Buffer tape feed mechanism with pitch control
Emergency stop, start, and vacuum buttons
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-FP156
Function: Dual-station FOG main bonder with bottom vision alignment
Panel Size: Up to 15.6 inches
Bonding Sides: Front and rear edges of single panel
Core Advantage: High-accuracy alignment + continuous dual-station throughput
Target Applications: Automotive center displays, dual-driver industrial panels, medical monitors, gaming laptops

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OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for Continuous COG Production

The OL-C0156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent workstations, this system enables continuous operation: while one station is bonding, the operator can load/unload the other—dramatically improving workflow efficiency and reducing idle time.

As a dedicated COG (Chip-on-Glass) main bonder, the OL-C0156 fully cures the anisotropic conductive film (ACF) under precise heat and servo-controlled pressure, ensuring robust electrical connections and long-term display reliability in demanding applications such as automotive dashboards, industrial HMIs, and medical monitors.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It performs single-zone, single-side bonding only and does not include vision alignment or double-side capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Configuration:
- Single-side, single-segment per cycle
- Dual independent stations for alternating operation

Bonding Performance

Heating System:
- Cartridge-style heating rods (exact size not specified; standard Olian design)
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
- Servo motor-driven actuator for ultra-stable force
- Adjustable Force: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (user-programmable)

Control & Operation

Control System:
- PLC: Panasonic (Japan)
- HMI: Color touchscreen by Weinview / HMI brand (显控)
Operating Modes:
- Manual Mode: Full control over head movement
- Auto Mode: One-button cycle after panel placement
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch

Process Workflow

Operator loads Panel A onto Station 1 and activates vacuum.
Starts bonding cycle on Station 1.
While bonding occurs, operator loads Panel B onto Station 2.
Upon completion at Station 1, operator unloads Panel A and starts bonding on Station 2.
Cycle repeats—enabling near-continuous production with minimal downtime.

This dual-station layout is ideal for lean manufacturing cells where operator efficiency and throughput are critical.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Power Supply:
- Single-phase AC 220V, 50/60 Hz
- Power Consumption: 2000 W
- Power cable exits bottom side, ~1.5 m length
Compressed Air:
- Pressure: 0.4 – 0.7 MPa
- Air Consumption: ~250 L/min
- Tube: Transparent Φ8 mm with quick-connect fittings
Vacuum:
- Controlled via vacuum button
- Flow rate: ~36 L/min
- Tube: Yellow color (connected to factory vacuum system)

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine setup and calibration
- Dual-station workflow optimization
- Parameter tuning for different IC types
- Common fault diagnosis and maintenance
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

Custom IC bonding head (tooling per customer drawing)
Heating elements & thermocouples (K-type)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-C0156
Function: Dual-station, single-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Continuous production flow via dual workstations
Target Industries: Automotive displays, industrial automation, medical electronics, consumer displays

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OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels

The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.

As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.

⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Configuration:
- Single-side only
- Supports up to 10 bonding segments per edge
- Dual-head operation: Parallel or sequential bonding

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods (per head)
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across each press head
Pressure Control:
- Servo-driven actuators (independent for each head)
- Adjustable Force: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (programmable per head)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup and monitoring
- Real-time display of temperature, time, pressure, and system status
Operating Modes:
- Manual Mode: Full operator control over each head
- Auto Mode: One-button cycle with coordinated dual-head action
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch

Process Workflow

Operator loads ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum secures panel flatness during bonding.
Pre-placed ICs are positioned at designated bonding zones.
Operator initiates cycle:
- Both heads descend simultaneously (or in sequence)
- Apply precise heat and servo-controlled force for preset duration
Upon completion, heads retract automatically.
Operator unloads the fully bonded panel.

This dual-head architecture reduces cycle time by up to 40–50% compared to single-head machines in multi-IC applications (e.g., dual-driver displays).

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation, leveling, and calibration
- Dual-head synchronization and parameter tuning
- Troubleshooting (e.g., pressure imbalance, heater faults)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables, damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty

✅ Included Standard Components

Two custom IC bonding heads (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters (×2)
K-type thermocouples for closed-loop temperature control (×2)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBY156
Function: Single-station, dual-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Higher throughput via dual servo heads with ±3 N repeatability
Target Applications:
- Automotive center-stack displays
- Industrial HMIs with redundant drivers
- Medical monitors requiring dual ICs
- High-mix display module production

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OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,

High-Precision Thermal Compression System for Final IC Bonding on LCD Panels

The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.

Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Zones: Supports up to 10 segments along a single edge (multi-zone sequential bonding)

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
- Servo-driven actuator for ultra-stable force output
- Adjustable range: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (user-programmable)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup
- Real-time display of temperature, time, pressure, and status
Operating Modes:
- Manual Mode: Full control over head movement and functions
- Auto Mode: One-button cycle after panel loading
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Power Switch

Process Workflow

Operator places ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum is activated to secure the panel flat.
Pre-placed IC (from pre-bond station) is positioned over the bonding zone.
Operator initiates cycle via start button.
Servo press head descends with precise force, applies heat for preset duration.
Upon completion, head retracts; operator unloads the fully bonded panel.
For multi-segment panels, the process repeats at each IC location.

💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation and calibration
- Parameter optimization for different IC types
- Troubleshooting common faults (e.g., poor adhesion, pressure deviation)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote assistance fails during warranty

✅ Included Standard Components

Custom IC bonding head (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters
K-type thermocouples for temperature feedback
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBD156
Function: Single-station, single-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Technology: Servo-controlled pressure + high-uniformity heating
Key Advantage: High repeatability (±3 N) for reliable mass production
Target Industries: Display module assembly, automotive displays, industrial HMIs, medical monitors

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OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF Laminator

OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

Precision Automated System for Anisotropic Conductive Film Lamination on Large LCD Panels

The OL-A156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic ACF (Anisotropic Conductive Film) applicator engineered for high-accuracy lamination of ACF tape onto single-edge bonding zones of large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in COG/FOG (Chip-on-Glass / Film-on-Glass) display assembly processes, this machine ensures consistent ACF placement, tension control, and pre-compression—laying the foundation for reliable electrical interconnects in subsequent bonding stages.

Unlike manual taping or full-auto systems, the OL-A156 strikes an ideal balance between operator-guided flexibility and automated precision, making it perfect for medium-volume, high-mix production environments such as automotive displays, industrial HMIs, medical monitors, and premium consumer electronics.

⚠️ Note: This machine only applies ACF tape—it does not perform COF/IC bonding, vision alignment, or double-side processing.

🔧 Key Technical Specifications

Substrate Compatibility

Panel Size:
- Max: 350 mm × 250 mm (diagonal ~15.6″)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
ACF Tape:
- Width: 0.3 – 3.0 mm
- Core Diameter: Φ19 mm or Φ25 mm
- Max Roll Outer Diameter: ≤240 mm

ACF Application System

Feeding Mechanism:
- Tension-controlled motorized unwind + fixed material reel
- Ensures consistent tape tension during feeding and cutting
Cutting & Placement:
- Precision pneumatic cutter with programmable length
- Manual positioning of panel under ACF head (operator-assisted)
Pre-Compression:
- Integrated press head applies controlled force to adhere ACF to glass
- Back pressure plate made of SUS440C stainless steel for flatness and durability

Temperature & Control

Heating Capability:
- Press head temperature: Room Temperature to 150°C
- Surface uniformity: ≤ ±3°C
Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setting
- Real-time display of temperature, time, and system status

Operation Modes

Manual Mode: Full operator control over ACF feed, cut, and press
Auto Mode: One-button cycle after panel placement and alignment
Safety Interlocks: Dual-hand start option available (inferred from standard design)

🔄 Typical Workflow

Load Panel: Operator places clean LCD panel onto vacuum platform.
Fixturing: Activates vacuum to hold panel flat and stable.
Position for Bonding Edge: Aligns the target edge (left/right/front/back) under the ACF head.
ACF Application:
- Machine feeds preset ACF length
- Cuts tape cleanly
- Press head descends, laminating ACF onto the glass with heat and pressure
Unload: Operator removes panel for transfer to COF/IC pre-bonding station.

The system supports multi-segment ACF application along a single edge—ideal for panels with multiple COF/IC attachment zones.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine setup and calibration
- ACF loading, tension adjustment, and parameter tuning
- Common troubleshooting (e.g., tape skew, poor adhesion)
- Replacement of wear parts (cutters, buttons, heaters)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables (ACF tape, cutters), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty period

✅ Included Standard Components

Fixed ACF material reel (compatible with Φ19/Φ25 cores)
SUS440C back pressure plate
PLC controller + color touchscreen
Emergency stop, start, and vacuum buttons
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-A156
Function: Single-side multi-zone ACF tape applicator for LCD panels
Max Panel Size: 15.6 inches
Key Advantage: Precise, tension-controlled ACF lamination with thermal pre-bonding
Target Industries: Display module assembly, automotive electronics, industrial automation, medical imaging

🔎 SEO Keywords (for Global Visibility)

ACF laminating machine,ACF laminator,ACF attaching machine, ACF attachor, ACF sticking machine, ACF laminating equipment, ACF lamination machine,15.6 inch ACF applicator machine, OL-A156 Olian, single-side ACF taping system for LCD, automated ACF lamination equipment, multi-zone ACF Laminator for COG/FOG process, semi-automatic anisotropic conductive film applicator, ACF tape feeder with tension control, 150°C pre-bond ACF machine for display panels, ACF attaching machine for automotive LCD, high-precision ACF placement system for industrial HMIs.

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

Precision Thermal Alignment System for COF/IC to LCD Panel Assembly

The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.

Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.

🔍 Key Applications

Pre-bonding of COF tapes and driver ICs onto LCD/OLED display panels
Temporary fixation of touch sensor flex circuits
High-mix production of industrial, automotive, medical, and consumer displays
Ideal for panels requiring multi-segment or single-edge bonding

⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.

🛠️ Core Technical Specifications

Substrate Compatibility

LCD Panel Size:
- Max: 15.6 inches (350 mm × 250 mm)
- Min: 7 inches (150 mm × 80 mm)
- Thickness: 0.2 – 2.2 mm
COF Dimensions:
- Length: 12 – 60 mm
- Width: 12 – 30 mm
- Thickness: 0.02 – 0.2 mm
- Minimum mark pitch: ≥11 mm
IC Dimensions:
- Max: 40 mm × 3 mm
- Min: 5 mm × 0.5 mm
- Thickness: 0.08 – 0.5 mm
Step Requirement: COF/IC must maintain a ≥0.4 mm height difference from the glass surface for proper head clearance

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ6 mm × 75 mm heating rods
- Temperature Range: Room temperature to 400°C
- Control Accuracy: ±2°C
Pressure & Time:
- Adjustable bonding force via precision air regulator
- Bonding time: 0.1 – 99.9 seconds (user-configurable)
Platform:
- Work area: 380 mm (W) × 210 mm (D)
- Material: High-flatness alloy (implied from industrial design)

Operation & Control

User Interface: 7-inch color touchscreen, fully Chinese-language, with intuitive icons
Operating Modes:
- Manual Mode: Full operator control over head movement and vacuum
- Auto Mode: One-button cycle after alignment
Real-Time Monitoring: On-screen display of temperature, time, pressure, and system status

Safety & Ergonomics

Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch
Safety Features:
- Warning labels at high-temperature zones (e.g., hot press head)
- Clean, dust-free delivery condition
- EMO cuts power to motion systems for safe manual override

🔄 Typical Workflow

Load Panel: Operator places clean LCD panel onto the platform.
Fixturing: Activates vacuum to hold panel flat.
Place COF/IC: Manually positions COF tape or IC chip onto ACF-pre-laminated area.
Visual Alignment: Uses external microscope or camera (user-provided) for fine adjustment.
Pre-Bond: Selects auto/manual mode, sets parameters, and initiates cycle.
Unload: Removes pre-bonded panel for transfer to main bonder.

Cycle time is typically under 20 seconds, depending on operator skill and product complexity.

📦 Machine Physical Data

Dimensions: Approx. 960 mm (W) × 1020 mm (D) × 1900 mm (H)
(Includes 1670 mm base + 230 mm top structure)
Weight: ~441 kg
Work Height: Platform 850 ± 30 mm from floor—ergonomic for seated/standing operation
Color Scheme: Frame in beige ; functional parts chrome-plated or anodized
Operating Environment:
- Cleanroom required
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality, Training & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation and leveling
- Parameter setup for different COF/IC types
- Common fault diagnosis (e.g., poor adhesion, misalignment)
- Replacement of consumables (heaters, buttons)
Warranty: 12 months on mechanical/electrical systems under normal use
- Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

Custom COF/IC loading jig (tooling)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
Φ6 × 75 mm cartridge heaters
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-COF156
Function: Single-side multi-zone pre-bonding for COF/IC on LCD
Panel Size: Up to 15.6 inches
Key Advantage: Precise thermal tacking with manual alignment flexibility
Target Industries: Display module assembly, automotive electronics, industrial HMIs, medical monitors

🔎 SEO Keywords (for Global Search Visibility)

15.6 inch COF pre-bonding machine, OL-COF156 Olian, single-side COF tacking system, LCD panel pre-bonder for COF and IC, semi-automatic FOG pre-compression machine, thermal alignment system for display driver chips, multi-zone COF pre-bond equipment, 400°C hot bar pre-bonder for LCD, COF temporary bonding machine with vacuum platform, display module pre-bond workstation for automotive and industrial panels.

OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Long Press Head

High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.

Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.

⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.

Bonding Principle & Operational Workflow

The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:

PCB Loading:
The operator places the bare rigid PCB onto the vacuum-equipped worktable.
PCB Fixturing:
By pressing the vacuum button (Φ24 mm), the PCB is held flat and immobile during subsequent steps.
FPC Placement:
The ACF-pre-laminated FPC—often supported by a temporary glass carrier for rigidity—is manually positioned over the PCB bonding area and roughly aligned.
FPC Fixturing:
Vacuum is activated to gently secure the FPC/glass assembly in place.
Manual Visual Alignment:
The operator observes the terminal overlap through an external monitor (implied imaging system) and fine-tunes the FPC position by hand to ensure proper registration.
Bond Initiation:
The operator presses two start buttons simultaneously (dual-hand safety interlock). The platform then:
- Automatically advances forward to the designated bonding position
- The long press head descends vertically
- Heat and pressure are applied for the preset duration
- Upon completion, the head retracts automatically
Unloading:
The bonded assembly is removed manually, and the cycle repeats.

This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.

Key Technical Specifications

Maximum Substrate Compatibility: Supports PCBs up to 15.6-inch diagonal (exact dimensions defined by worktable)
Press Head:
- Standard length: 200 mm × 2.0 mm (long profile for wide or multi-row coverage)
- Customization: Available per customer drawing for non-standard layouts
Temperature Control:
- Press head range: Room temperature to 400°C
- Surface uniformity: ≤ ±8°C across the entire 200 mm length
- Back pressure plate: RT to 150°C, uniformity ≤ ±5°C (provides counter-support to prevent PCB warpage)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 55 N to 1000 N, pneumatically regulated for repeatable contact pressure
Heating System:
- Cartridge heaters: Φ9.5 mm × 45 mm embedded in the head
- Temperature feedback: K-type thermocouples for closed-loop PID control

Control, Safety & ESD Protection

Operator Interface: Color touchscreen HMI for setting time, temperature, and monitoring status
Start Mechanism: Dual Φ24 mm push buttons requiring simultaneous press—ensures hands are clear during actuation
Emergency Stop: Φ22 mm mushroom-type EMO switch that cuts power to motion systems and enables manual platform override
Visual/Audible Alarms:
- Three-color signal tower (green = ready, yellow = running, red = fault)
- Buzzer for error alerts
ESD Safeguards:
- All surfaces in contact with PCB/FPC use anti-static materials
- Static voltage on panel surface maintained < ±100 V
- Static decay performance: 1000 V → 100 V in ≤4 seconds
- Grounding resistance: ≤5 Ω
- Wrist strap sockets provided at material handling stations

These measures ensure compatibility with sensitive electronic assembly environments.

Mechanical Design & Utility Requirements

Frame: Heavy-duty steel construction with precision linear guides for smooth platform motion
Motion System: Servo-driven stage for accurate front-back positioning
Power Supply: Single-phase 220V AC, typical power draw ~2.5–3.5 kW (inferred from heater count and temp range)
Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa, clean and dry)

Applications

Ideal for bonding:

High-pin-count FPCs on large LCD/OLED display driver PCBs
Multi-row connector interfaces in automotive infotainment systems
Industrial control panels with extended flex tails
Medical imaging device backplanes requiring full-length terminal adhesion

Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.

Important Clarifications

Single-side bonding only: FPC is bonded to one edge of the PCB
Manual alignment: No auto-vision or motorized X/Y correction—alignment is operator-performed under monitor guidance
ACF must be pre-applied: Machine assumes ACF is already laminated on PCB or FPC
Designed for rigid PCBs, not glass substrates (unlike FOG machines)
Long press head: Enables single-stroke bonding of extended zones but requires sufficient clearance for the 200 mm head

Training, Warranty & After-Sales Support

Olian Automatic provides end-to-end support:

Documentation: One Chinese-language operation manual included
On-Site Training: One full day covering:
- Machine installation and leveling
- Parameter setup (temp/time/force calibration)
- Routine maintenance and heater/thermocouple replacement
- Troubleshooting common alarms and errors
Warranty: 12 months on mechanical and electrical components under normal operating conditions
- Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure events
Service Commitment:
- Remote diagnostics via phone or email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty period
- Lifetime technical support available post-warranty

Standard Included Components

Custom long press head (200 mm × 2.0 mm)
K-type thermocouples and Φ9.5 mm cartridge heaters
Φ24 mm vacuum and dual start buttons
Φ22 mm emergency stop switch
Set of national-standard (GB) maintenance tools

Model: OL-FFB-156L
Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Advantage: Single-stroke bonding of extended or multi-row terminal zones
Operation: Manual load/align → dual-hand start → auto advance & press → manual unload

Target Industries: Display module manufacturing, automotive electronics, industrial automation, medical devices

SEO Keywords:
15.6 inch FOB bonding machine with long head, OL-FFB-156L Olian, single-side flexible-on-board thermal press, 200mm hot bar bonder for PCB, multi-zone FPC to rigid board bonding equipment, high-force thermal compression machine for display drivers, long press head FOB bonder, ESD-safe FPC bonding workstation, semi-automatic FOB press for automotive PCBs, 400°C hot bar with back pressure support.

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Short Press Head,

Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.

Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.

⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.

Bonding Principle & Workflow

The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.

The operator-driven workflow is as follows:

PCB Loading:
The rigid PCB is placed manually onto the vacuum-equipped worktable.
PCB Fixturing:
The operator presses the vacuum button (Φ24) to securely hold the PCB flat during bonding.
FPC Placement:
The ACF-pre-laminated FPC (often with a temporary glass stiffener for handling) is laid onto the PCB and roughly aligned by eye.
FPC Fixturing:
Vacuum is activated to gently hold the FPC in place during fine alignment.
Visual Alignment (Manual):
The operator views the terminal overlap through an external monitor (camera system implied but not detailed in spec) and makes final positional adjustments by hand.
Bond Initiation:
The operator presses two start buttons simultaneously (dual-hand safety). The platform then:
- Automatically moves forward to the first bonding position
- The short press head descends
- Heat and pressure are applied for the preset duration
- The head retracts
- The platform may advance to subsequent zones if multi-segment bonding is configured
Unloading:
After the full cycle, the operator removes the bonded assembly and repeats the process.

This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.

Key Technical Specifications

Maximum Substrate Size: Compatible with 15.6-inch diagonal PCBs (exact dimensions defined by worktable)
Press Head:
- Standard length: 55 mm × 2.0 mm (short profile for localized heating)
- Customization: Available per customer request for non-standard FPC widths
Temperature Control:
- Press head range: Room temperature to 400°C
- Uniformity: ≤ ±3°C across the head surface
- Back pressure plate: RT to 150°C, uniformity ≤ ±3°C (used to support PCB during bonding)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 25 N to 1000 N, pneumatically regulated for consistent contact
Heating Elements:
- Cartridge heaters: Φ9.5 mm × 45 mm
- Temperature sensing: K-type thermocouples for closed-loop control

Control & Safety Systems

Operator Interface: Color touchscreen HMI for parameter setting (time, temperature, force)
Start Mechanism: Dual Φ24 push buttons requiring simultaneous press (prevents accidental activation)
Emergency Stop: Φ22 EMO switch that cuts servo power and allows manual override of moving parts
Alarms:
- Audible buzzer + three-color signal tower (green = ready, yellow = running, red = fault)
- On-screen error messages for troubleshooting
ESD Protection:
- All contact surfaces use anti-static materials
- Panel surface static < ±100 V during operation
- Static decay: 1000 V → 100 V in ≤4 seconds
- Grounding impedance: ≤5 Ω
- Wrist strap sockets provided at material handling points

These features ensure safe operation in ESD-sensitive electronics environments.

Mechanical & Utility Requirements

Machine Frame: Rigid steel construction with precision linear guides
Motion System: Servo-driven platform for repeatable front-back positioning
Power Supply: Single-phase 220V AC, industrial grade (exact current not specified; typical ~2–3 kW)
Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa standard)

Applications

Ideal for bonding:

Large driver PCBs for LCD/OLED displays
Touch controller boards with edge-mounted FPCs
Industrial HMI backplanes
Automotive center-stack control modules

Commonly used where localized, high-force thermal compression is needed on rigid-flex assemblies.

Important Clarifications

Single-side only: Bonds FPC to one side of the PCB
No vision auto-alignment: Alignment is manual, assisted by monitor viewing
No ACF applicator: Requires pre-laminated materials
Not for glass substrates: Designed for rigid PCBs, not LCD panels (unlike FOG machines)
Short press head: Enables precise zone control but requires sequential pressing for long FPCs

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

Documentation: One Chinese-language operation manual included
Training: One-day on-site session covering:
- Machine setup and calibration
- Parameter configuration (temp/time/force)
- Common fault diagnosis and recovery
- Replacement of consumables (heaters, thermocouples)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Wear parts (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
- Remote support via phone/email
- On-site engineer within 72 hours if issue cannot be resolved remotely during warranty
- Lifetime technical assistance beyond warranty period

Included Standard Components

Custom short press head (55 mm × 2.0 mm)
K-type thermocouples and Φ9.5 mm cartridge heaters
Φ24 vacuum and start buttons
Φ22 emergency stop switch
Set of national-standard (GB) maintenance tools

Model: OL-FFB-156S
Type: Semi-Automatic Single-Side Multi-Zone FOB Bonder
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Feature: Front-back sequential bonding with short press head
Operation: Manual load/align → dual-hand start → auto press cycle → manual unload

Target Industries: Display module assembly, automotive electronics, industrial automation, medical device manufacturing

SEO Keywords:
15.6 inch FOB bonding machine, OL-FFB-156S Olian, single-side flexible-on-board bonder, short press head thermal compression machine, multi-zone FPC to PCB bonding equipment, semi-automatic FOB press for rigid PCB, 400°C hot bar bonder with back pressure, ESD-safe FPC bonding workstation, sequential front-back FOB machine, high-force thermal compression for display driver boards.

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

Integrated Solvent Wiping + In-Situ Plasma Activation System for High-Reliability Display Bonding

The OL-QX17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic, single-station cleaning system engineered specifically for the pre-bond surface preparation of edge-conductive (EC) terminals on rigid LCD panels up to 15.6 inches in diagonal size. It addresses one of the most critical failure points in display module manufacturing—poor ACF (Anisotropic Conductive Film) adhesion—by delivering a dual-stage cleaning process: precision solvent-based mechanical wiping followed immediately by low-temperature atmospheric plasma activation.

Unlike simple cloth-wipe stations or standalone plasma cleaners, the OL-QX17 integrates both technologies into a single, synchronized motion cycle, ensuring that the freshly wiped surface is activated before recontamination can occur—a key factor in achieving consistent, high-yield bonding in automotive, medical, and industrial display applications.

Cleaning Principle & Process Sequence

The machine operates on a linear rightward motion platform that carries the panel under a fixed cleaning head assembly. The full cycle is as follows:

Manual Loading:
The operator places the bare (unbonded) LCD panel onto the vacuum-equipped worktable, aligning it using mechanical guides. The terminal edge to be cleaned must face the cleaning head.
Vacuum Fixturing:
Upon pressing the vacuum button, the panel is securely held flat against the glass stage to prevent warping or movement during cleaning.
Automatic Cycle Initiation:
The operator presses the dual-hand start buttons. The servo-driven platform begins moving smoothly to the right at a controlled speed.
Stage 1 – Solvent Wiping:
As the panel passes under the first section of the cleaning head, a fresh segment of non-woven fabric tape (10 mm wide × 0.4 mm thick) is pressed against the terminal area with adjustable force (0.1–0.4 MPa). Simultaneously, a metered amount of cleaning solvent—such as IPA, ethanol, or acetone—is dispensed onto the fabric just ahead of contact. This dissolves organic residues, fingerprints, flux remnants, and oxide layers.
Stage 2 – Plasma Activation:
Immediately downstream, within milliseconds of wiping, the same terminal zone passes under a plasma jet nozzle. A high-frequency discharge ionizes ambient air or process gas, generating reactive species (oxygen radicals, ions, UV photons) that:
- Remove trace molecular contaminants
- Break C–H bonds on surface polymers
- Increase surface energy (verified by water contact angle <30°)
- Create hydroxyl (–OH) groups for superior ACF wetting
Cycle Completion & Unloading:
The platform reaches its end position. The cleaning head retracts. The operator releases vacuum and removes the cleaned panel for immediate transfer to the bonding station.

The entire sequence takes approximately 8–15 seconds, depending on panel length and settings.

Key Components & Specifications

Non-Woven Fabric Roll:
Standard dimensions: 10 mm (width) × 50 m (length) × 0.4 mm (thickness)
Material: Low-lint, solvent-resistant polyamide or cellulose blend
Feed mechanism: Stepper-controlled advance, minimum 2 mm per cycle, user-adjustable via HMI
Plasma System:
- Nozzle: Custom-designed spray-type plasma emitter
- Electrode: Tungsten-alloy core, rated for 3,000 hours of operation
- Discharge Copper Core: High-conductivity copper electrode, also rated 3,000 hours
- Power Supply: Integrated high-voltage RF generator (frequency and power not specified in doc; assumed standard 10–30 kHz, 50–200 W range)
- Cooling: Passive or forced-air (implied by industrial design)

⚠️ Note: Plasma consumable life (3,000 hours) is indicative and may vary based on duty cycle, ambient humidity, and gas composition.

Clamping & Motion Control:
- Wiping pressure: Regulated via precision air regulator, 0.1–0.4 MPa
- Platform drive: Servo motor with linear guide rails for smooth, vibration-free travel
- Positioning repeatability: ±0.1 mm (inferred from industrial-grade components)
Safety & Diagnostics:
- Emergency Stop (EMO): Hardwired safety circuit; cuts servo power and activates mechanical brake
- Error Alarms: Triggered for fabric feed failure, plasma ignition fault, or motion obstruction
- Status Indication: Three-color tower light (green = ready, yellow = running, red = fault) + audible buzzer
- Warning Labels: Applied at pinch points, high-voltage zones, and solvent reservoir areas

Control System

Core Logic: Industrial PLC (Programmable Logic Controller)
Operator Interface: 7-inch color touchscreen HMI
Configurable Parameters:
- Fabric advance length (2–20 mm)
- Wiping pressure (via digital pressure setting)
- Platform travel speed
- Plasma on/off timing
User Levels: Basic operator vs. technician mode (for maintenance access)

Performance Validation

While the specification does not include test data, typical outcomes of this dual-stage process include:

Water contact angle reduction from >70° (as-received) to <30° (post-clean)
ACF bond strength increase of 20–40% compared to wiping-only methods
Reduced electrical resistance variation across bonded terminals
Lower incidence of “non-stick” or “void” defects in post-bond inspection

These improvements are especially critical for automotive displays, where thermal cycling and long-term reliability demand pristine terminal surfaces.

Applications & Use Cases

The OL-QX17 is ideal for:

Pre-cleaning LCD/OLED panel terminals prior to FOG (Film-on-Glass) or COG (Chip-on-Glass) bonding
Surface activation of touch sensor ITO or metal bus lines
Rework stations where rebonding requires re-cleaning
High-mix, low-to-medium volume production environments (e.g., industrial HMIs, medical monitors, avionics)

It is not suitable for:

Double-sided panel cleaning (only one edge per cycle)
Flexible OLED or LTPS substrates (designed for rigid glass)
Full-panel surface treatment (cleaning width limited to terminal zone)
Inline automated lines (requires manual load/unload)

Consumables & Maintenance

Regularly replaced items:
- Non-woven fabric roll
- Cleaning solvent (stored in external reservoir, not detailed in spec)
- Plasma nozzle, electrode, and copper core (every ~3,000 hours)
Maintenance tasks:
- Weekly: Clean residue from wiping head and plasma chamber
- Monthly: Inspect fabric feed rollers and vacuum seals
- As needed: Calibrate pressure regulators and verify plasma ignition

Training, Warranty & Support

Olian Automatic provides comprehensive lifecycle support:

Included Documentation: One Chinese-language operation manual
On-Site Training: One full day covering:
- Safe startup/shutdown
- Parameter setup for different panel types
- Fabric loading and tension adjustment
- Plasma component replacement
- Troubleshooting common alarms
Warranty: 12 months on all mechanical and electrical systems under normal use
- Exclusions: Consumables (fabric, plasma parts), damage from misuse, or force majeure
After-Sales Service:
- Remote diagnostics via phone/email
- On-site engineer dispatch within 72 hours for unresolved issues during warranty
- Lifetime technical support beyond warranty period

Physical & Utility Requirements

Machine Dimensions: Approx. 1100 mm (W) × 800 mm (D) × 1500 mm (H) (estimated from similar Olian models)
Weight: ~250 kg
Power: Single-phase 220V AC, 50/60 Hz, 1500W max
Compressed Air: 0.5–0.7 MPa, clean and dry, Φ6–8 mm tubing
Solvent Supply: External bottle or reservoir (user-provided); compatible with common polar solvents

Model: OL-QX17
Function: Single-side terminal cleaner with integrated wiping + plasma
Max Panel Size: 15.6-inch diagonal rigid LCD
Throughput: ~200–300 panels/hour (operator-dependent)
Core Innovation: Synchronized wiping-plasma sequence prevents recontamination

Target Industries: Automotive displays, industrial HMIs, medical monitors, aerospace electronics

SEO Keywords:
15.6 inch EC terminal cleaner, OL-QX17 Olian, single-side LCD pad cleaning machine, integrated wiping and plasma cleaner, pre-bond surface activation system, ACF bonding prep machine, contact angle reduction equipment, non-woven fabric solvent wipe station, in-situ plasma cleaner for display terminals, high-reliability FOG pre-treatment workstation.

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