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Author Archive bondingmachine

COG Bonder

COG Bonder

COG Bonder/COF Bonder

COG bonder, also named COG (Chip on glass) machine,Chip ic bonding machine, COF(chip on film) bonder ,COG heat bonder, COG bonding machine, Chip IC heat press machine, Chip on glass bonding machine.It is widely used in the LCD/LED/OLED, LCM/panel/screen/display , for Mobilephone/Watch/pad/notebook/touch panel/Ad Player/bank card/camera/ and all the flat and edge screens. for produce factories and repairing service shops all over the world.

The COG machine may consist of HD Digital Microscope and control system, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process. The bonding press head may press the IC/COF onto the Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time.

According to different LCD/LED/OLED and different screens, there are many ACF tapes models.  ACF tape is the import medium of the bonding process.

Shenzhen Olian is the professional COG bonder manufactury ,we are the LCM Equipment factory solution provider.

COG bonder manufactury
shenzhen olian- COG bonder -China COG bonders factory/ supplers/Provider

COG Bonder/ COF Bonder

The machine has Pre-Bonder and Main-Bonder . They are all constant temperature machines. it maybe have single station bonder ,double stations , three stations, and maybe four stations bonder.

COG/COF Pre-Bonder

Features:

*Suitable for multi variety small batch production

*Constant temperature heating system

*Panasonic PLC Control system

*FAST Visual processing system

*Imported Japanese CCD Automatic Contraposition Configuration

*Manual / automatic switching

*Imported electrical configuration

Specification:

COG Pre-Bonder /COF Pre-Bonder, OL-C003B
COG Bonder
COG Pre-Bonder, OL-C008

COG bonder
OL-C006

Model: OL-C003B/C005/C006

Product Name: Semi-Automatic Mid/High-speed COG/COF Pre-bonding machine

Suitable For: Suitable for IC bonded to the LCD which attached ACF

Size Range: 1~7 inch

Attach Precision: ±2.5UM

IC Size: L:2~40mm,W:0.8~3mm

Machine Capacity: 650pcs/H–1000pcs/H

Power Supply: 220V±10%,50HZ,1000W/1200W

Air Supply: 0.5~0.7MPa,dry air

Platform Size: 140*100MM

Platform Precision: ±0.01MM

Pressure Head Size: 40*2MM Customizable

Temp Range: 1~300℃

Time Range: 1~99.9

N.W: About 300KG/350KG

COG/COF Main-Bonder

Features:

*PID Control Constant Temp Heating System,Automatic temperature compensation to ensure that the temperature of hot pressing is stable.

*Panasonic PLC Control system.

*Use high precision low-friction cylinder control pressure to ensure the accuracy of pressure control.

*High steel structure set, dual ceramic indenter configuration, to ensure the stability of the equipment.

*Imported electrical configuration,

*For OLED high-end products,high quality,high successful rate。

Specification:

OL-C006 Triple station semi-auto high speed COG Main-Bonder

Model: CM006

Product Name: 1-12 inch Triple Stations Semi-Automatic High-speed COG main-bonding machine

Suitable For: Suitable for IC bonded to the LCD which attached ACF

Size Range: 1~12 inch

Attach Precision: ±4.5UM

IC Size: L:2~40mm,W:0.8~3mm

Machine Capacity: 1100pcs/H

Power Supply: 220V±10%,50HZ,2000W

Air Supply: 0.5~0.7MPa,dry air

Platform Size: 150*100MM

Platform Precision: ±0.01MM

Pressure Head Size: 45*5MM Customizable

Temp Range: 1~400℃

Time Range: 1~99.9

Product Size:L1025*W750*H1400 MM

N.W: About 350KG

LCD bonding machine
Servo COG/COF Final-Bonder , OL-C012
OL-C008 Double Stations Mid-speed Servo COG machine 

Model: OL-C008/OL-C012

Product Name: 1-12 inch Double Stations Semi-Automatic Mid-speed Servo COG main-bonding machine

Suitable For: Suitable for IC bonded to the LCD which attached ACF

Size Range: 1~12 inch

Attach Precision: ±4.5UM

IC Size: L:2~40mm,W:0.8~3mm

Machine Capacity: 600pcs/H

Power Supply: 220V±10%,50HZ,1200W

Air Supply: 0.5~0.7MPa,dry air

Platform Size: 150*100MM

Platform Precision: ±0.01MM

Pressure Head Size: 45*5MM Customizable

Temp Range: 1~400℃

Time Range: 1~99.9

Product Size:L640*W700*H1320MM

Full automatic COG bonder

Full automatic COG bonder, include all the glass loading/glass cleaning/IC Loading/ACF pre-attaching/COG pre-bonder/COG main-bonder /COG glass output.

full auto COG bonder
1~7inch Full Automatic COG bonder

Features:

*Constant temperature heating system

*Panasonic PLC Control system

*Human – Machine interface

*Imported electrical configuration

*High Precision contraposition system

*Include the glass loading,glass cleaning,IC loading,ACF pre-attaching,COG pre-bonding,COG main-bonding ,COG output processes,it is COG processes all in one machine.

Specification:

Model: FAC001

Product Name: 1~7inch Full Automatic COG bonder

Suitable For: Suitable for IC Bonding to the LCD, ACF attach, IC preload and pre-bonding, main-bonding,output, completed in one machine.

Size Range: 1~7 inch

Attach Precision: ±2.5UM

IC Size: L:2~40mm,W:0.8~3mm

Machine Capacity: 1000pcs/H

Power Supply: 220V±10%,50HZ,5000W

Air Supply: 0.5~0.7MPa,dry air

Platform Size: 150*100MM

Platform Precision: ±0.01MM

Pressure Head Size: 45*5MM Customizable

Temp Range: 1~300℃

Time Range: 1~99.9

Product Size: W1500*D2300*H1700MM

Semi Automatic LCM produce line

Semi Automatic LCM Making produce include: ACF attaching  ,COG pre-bonding, COG final-bonding , FOG(FOB) bonding, as below:

LCD bonding machine
High speed produce line 7 sets bonders
ACF semi-auto Bonders
ACF semi-auto Bonders

Full Automatic FOG bonder

Full automatic FOG bonder, It include the ACF attaching on the glass, FPC loading, FPC bonding on the glass and output to testing..

LCM full automatic Bonder: ACF attaching/COG Bonding/FOG bonding

LCM full automatic bonder include all the process of the COG and FOG bonding : the LCD loading,LCD cleaning, IC loading, IC cleaning,ACF attaching on the glass, IC pre-bonding, IC bonding cheking, and IC main-bonding processes. then the ACF attaching for FPC, FPC loading, FPC bonding on the glass and output to testing…

We design and make the standard COG/COF/ACF Bonders and customized ACF bonder for your personalized product requirements, also design and manufacture other automation equipment for your requirements, and welcome OEM&ODM machines.

COF bonder for TV Repairing,LCD bonder

COF bonder
COF bonder

COF bonder, also name TAB bonderACF bonderOLB Bonder Chip on Film bonder. COF(Chip on Film, Chip on Flex).COF bonder is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The COF Bonder also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the COF bonder for TV Repairing is Pulse heating bonding machine with Titanium alloy press bonding head.

COF bonder for TV Repairing accessories

Our COF bonder and all the accessories list for TV/laptop panel repairing as below:

COF bonder

We also offer all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.

Please contact us feel free to  purchase the COF bonder for TV Repairing accessories.

COF bonder
COF bonder and accessories

Welcome to buy the COF bonder for TV Repairing and all the COF bonder accessories.

COF Bonder for cellphone

COF bonders for full screen /edge screen/OLED screen mobilephone

COF bonder

COF Bonder for cellphone – ACF attaching bonder

ACF bonder

COF Bonder for cellphone – COF Pre-bonder

COG bonder
cof bonder
cof bonder
COF Bonder
COF pre-bonder

COF Bonder for cellphone – COF Final-bonder

COG bonder

Welcome  you visit us if you do the  OLED edge screen/curved screen/full screen(Huawei Mate10,Mate 20,8X,OPPO/VIVO/MI/Samsung S6 S8 S9/Apple X MAX R etc.) repairing and produce business ,please contact us and test our COF bonder for cellphones.

ic bonder

All the ACF/COG/COF/COB/FOG/FOB/FOF/OLB/TAB/PCB/FPC/TCP/ bonders ,welcome you visit us-Shenzhen Olian(LCM Equipments factory solution provider/supplier/manufactury)

cog bonder
COG bonder
Shenzhen Olian ACF/COG/COF/COB/FOG/FOB/OLB/FOF/TAB/OGS/PCB/FPC bonder manufactory

Shenzhen Olian ACF/COG/COF/COB/FOG/FOB/OLB/FOF/TAB/OGS/PCB/FPC bonder manufactory. Welcome you to be our partner and dealers all over the world.

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