High-Efficiency Thermal Compression System for Multi-Segment COF-to-PCB Bonding
The OL-FOB156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic FOB (Film-on-Board) bonding machine engineered for the precise thermal compression of multiple COF (Chip-on-Film) or FPC (Flexible Printed Circuit) leads onto a single edge of rigid PCBs used in display modules up to 15.6 inches. Designed with a long main press head, this system supports multi-segment sequential bonding, enabling high-reliability electrical connections across extended or densely populated PCB bonding zones—common in automotive displays, industrial control panels, and smart appliance interfaces.
Unlike single-point bonders, the OL-FOB156L allows operators to process up to 10 individual FPCs along one side of a PCB in a single workflow, significantly improving throughput while maintaining consistent bond quality.
The machine operates through a well-defined manual-assisted process..
The operator begins by placing the PCB onto the dedicated worktable and activating vacuum suction via a Φ24 mm button to ensure flatness and stability.
Next, the FPCs are positioned on their respective stage and roughly aligned with the PCB pads. Using a live monitor feed, the operator performs fine visual alignment before initiating the cycle with a dual-hand start mechanism—a critical safety feature that prevents accidental activation.
Once started, the machine automatically executes a pre-press step at the first bonding position using a compact 55 mm × 2 mm tungsten carbide press head.
After completion, the platform shifts horizontally to the next segment, repeating the pre-press until all designated positions are processed.
If the system is configured for automatic alignment (e.g., with optional vision), pre-press may be skipped, proceeding directly to main bonding.
Following pre-press, the platform moves to the main bonding station,
where two long (200 mm × 2 mm standard) tungsten carbide press heads descend simultaneously.
These heads deliver a precisely controlled force ranging from 55 N to 1000 N,
with temperature maintained between room temperature and 400°C.
The surface temperature uniformity across the press head is guaranteed within ±8°C, ensuring consistent ACF (Anisotropic Conductive Film) curing. Bonding time is fully adjustable from 0.1 to 99.9 seconds.
Both pre-press and main press units utilize pneumatic cylinders with linear guides for smooth vertical.
motion and precision pressure regulators for repeatable force control.
The press heads are made of tungsten steel, offering exceptional wear resistance and surface flatness within ±5 microns. The main press heads also feature push-pull adjustment screws for fine-tuning parallelism relative to the PCB surface.
The PCB platform is constructed from hard anodized magnesium aluminum alloy, providing excellent rigidity and thermal stability. It incorporates a dense array of 1 mm vacuum holes and channels to secure panels firmly during bonding.
Platform flatness is maintained within ±0.008 mm per 100 mm, and it supports four-axis manual adjustment (X, Y, θ, and Z) via micrometer-style knobs with ±3 mm (X/Y/θ) and ±4 mm (Z) travel—enabling precise registration even with panel tolerances.
The machine is designed for single-operator use, with all loading, alignment. and unloading performed.
from the same front position, enhancing ergonomics and workflow efficiency.
Operation is managed through physical controls: a Φ24 mm start button, a Φ24 mm vacuum switch.
and a Φ22 mm emergency stop.
A three-color signal lamp provides real-time status feedback (ready, running, fault). The system does not include a PLC or touchscreen, prioritizing simplicity and reliability in production environments.
Olian includes a Chinese-language operation manual and provides one-day on-site training covering.
installation, parameter setup, routine maintenance, and replacement of consumable parts.
The machine is covered by a 12-month warranty under normal operating conditions.
During the warranty period, if remote troubleshooting fails, Olian guarantees on-site technical support within 72 hours. Lifelong technical assistance is available beyond the warranty term.
While the standard main press head measures 200 mm × 2 mm, Olian offers customization to match specific PCB layouts. This model is particularly suited for applications requiring long-edge, multi-chip COF bonding, such as driver boards for large-format LCDs where multiple flex circuits must be reliably connected in sequence.
In summary, the OL-FOB156L delivers a robust, efficient, and operator-friendly solution for medium-to-high volume FOB production—combining precision mechanics, thermal stability, and flexible multi-zone capability in a single platform.
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OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Short Press Head,
Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly
The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.
Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.
⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.
The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.
The operator-driven workflow is as follows:
This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.
These features ensure safe operation in ESD-sensitive electronics environments.
Ideal for bonding:
Commonly used where localized, high-force thermal compression is needed on rigid-flex assemblies.
Olian Automatic provides full lifecycle support:
Model: OL-FFB-156S
Type: Semi-Automatic Single-Side Multi-Zone FOB Bonder
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Feature: Front-back sequential bonding with short press head
Operation: Manual load/align → dual-hand start → auto press cycle → manual unload
Target Industries: Display module assembly, automotive electronics, industrial automation, medical device manufacturing
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