Products news

5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line

5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line.

Engineered for High-Mix, High-Precision Display Manufacturing

This document details Olian Automatic’s turnkey solution for mid-size display module assembly (5″–17.3″), focusing on LOAD (Panel Handling), EC (End-to-end Cleaning), COG (Chip-on-Glass), COF (Chip-on-Film), FOG (Film-on-Glass), and FPC (Flexible Printed Circuit) loading processes. Designed for rigid and flexible panel substrates, this production line integrates robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and support high-mix production environments.

1. Production Line Overview

Core Capabilities

• Size Range: Supports 5″ to 17.3″ displays (16:9 aspect ratio) with substrate thicknesses from 0.15mm to 0.7mm and (warpage) ≤0.2mm.
• High-Mix Flexibility: Accommodates up to 4 ICs (adjacent sides) and 2 FPCs per panel, with dual material loading for non-stop loading.
• Throughput: Achieves 4–20 seconds per unit, depending on configuration (e.g., 6.5 sec for single IC on 12″ panels).
• Precision Standards:
  • ACF (Anisotropic Conductive Film) placement: ±0.15mm
  • COG bonding: ±5μm
  • FOG bonding: ±15–20μm

Process Flow

The production line follows a sequential workflow:

1. Panel Loading (OL-LLD3000): Automated tray handling with Z-axis servo stacking.
2. Terminal Cleaning (OL-EC3000): Dual-side ITO cleaning via alcohol wiping + plasma activation.
3. COG/COF Bonding (OL-CB3000): ACF dispensing, IC pre-bonding, and main bonding with vision-guided alignment.
4. FOG Bonding (OL-FB3000): FPC alignment, ACF application, and thermal compression.
5. FPC Loading (OL-FLD3000): Dual-channel FPC feeding for 1–2 FPC types.
6. COF Punching (Optional): Servo-driven die-cutting with ±50μm accuracy for COF tape reels.

2. Equipment Specifications

2.1 Panel Loader (LLD3000)

Function: Automated loading of panel trays (400×460mm max) with Y-axis pneumatic correction.

• Capacity: Handles 80×80mm to 380×380mm panels, supporting full-pallet width limits.
• Throughput: 4 seconds for 7″ panels (with >4 units per tray).
• Design: Dual (material wells) for pre-stocked panels and empty tray storage.

2.2 Terminal Cleaner (EC3000)

Function: Fully automated multi-edge plasma terminal cleaning.

• Cleaning Process: Pneumatic double sides cleaning with alcohol dispensing and PT300 plasma units.
• Vision System: Beijing Boshii CCD cameras for positional accuracy (X: ±0.5mm, Y: ±0.1mm).
• Plasma Specifications:
  • Power: 120–200W
  • Frequency: 18kHz–60kHz
  • Temperature: 60°C–100°C (adjustable via line speed).

2.3 COG Bonder (CB3000)

Function: Full-process IC bonding with ACF application, pre-press, and main press.

• IC Handling: Supports MIN: 4×0.5mm to MAX: 45×2mm ICs, with dual materials wells for non-stop loading.
• Bonding Heads:
  • ACF head: SUS440C (HRC 52–58), 5.0×70mm
  • Pre-press head: SUS440C, 2×60mm (dual sets)
  • Main press heads: Tungsten steel, 5×50mm (dual Short Bar groups)
• Vision Alignment: 300k-pixel cameras with 0.5× lenses for input correction and 1300k-pixel cameras with 6× lenses for pre-press alignment.

2.4 COF Punching Machine (Optional)

Function: Servo-driven COF tape feeding with CCD-guided punching.

• Accuracy: ±50μm (requires qccuracy ≤±15μm and mode accuracy ≤±5μm).
• Cycle Time: 3.5–4.5 seconds per unit.
• Reel Compatibility: φ405–600mm outer diameter with φ25.4mm inner diameter.

2.5 FOG Bonder (FB3000)

Function: FPC-to-glass bonding with Long Bar bonding heads and dual-channel FPC feeding.

• FPC Support: Standard/U-shaped FPCs up to 200×165mm.
• Bonding Heads:
  • ACF head: SUS440C, 5.0×165mm
  • Pre-press head: SUS440C, 1.8×165mm
  • Main press heads: SUS440C, 1×200mm (dual Long Bar groups)
• Platform Design: Molybdenum alloy with super-hard oxidation for durability.

2.6 FPC Loader (FLD3000)

Function: Dual-channel FPC feeding with tray-to-bonder transfer.

• Tray Compatibility: 250×220mm to 400×460mm trays.
• Accuracy: ±0.03mm handling precision with below-arm vacuum pickup.
• Cycle Time: 4 seconds (single FPC type) or 6 seconds (dual loading one by one).

3. Technical Advantages

3.1 Automation & Integration

• Robotic Handling: Linear motor-driven arms for panel/FPC transfer between stations.
• Modular Design: Stations support standalone operation or inline integration via interface ports.
• Scalability: Optional USC (Ultrasonic Cleaning) modules and plasma units for enhanced adhesion.

3.2 Precision Engineering

• Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (20–500N) and temperature (200°C max).
• Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment, with torque motor tension control for ACF/COF feeding.

3.3 Process Reliability

• ACF Quality Control: Inline vision inspection verifies film placement before bonding.
• Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 15°–30°.

4. Applications & Industry Impact

This solution targets high-mix manufacturing of:

• Automotive Displays: Ensures reliability under 85°C/85% RH conditions with multi-segment ACF application.
• Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding for foldable OLEDs.
• Industrial Panels: Supports ruggedized designs with redundant IC bonding for mission-critical systems.

By integrating LOAD, EC, COG, FOG, and FPC processes into a single line, manufacturers reduce handling errors by 40% and achieve 25% faster changeover times for batch switching.

5. Future-Proof Design

The production line accommodates emerging trends:

• AI Integration: Vision systems support machine learning for defect prediction (e.g., void prediction via thermal imaging).
• Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.

6. After-Sales Support & Quality Assurance

• VIP Service: 30-minute response time, 24/7 support, and lifetime maintenance.
• Quality system: DQA (Design Quality Assurance) protocols, ESD protection, and whole-machine acceptance testing.
• Certifications: ISO 9001, National High-Tech Enterprise, and Specialized SME.

SEO Keywords: Mid-size display production line, COG bonding machine, FOG bonding equipment, ACF application system, plasma cleaning for displays, high-precision display assembly, FPC loading system, COF punching machine.COG FOG Bonding production line.

OL-WB215A Automatic 4CCD Mesh Plate Laminating Machine

OL-WB215A Automatic 4CCD Mesh Plate Laminating Machine

High-Precision Lamination for 21.5-Inch Displays

Engineered by Olian Automaic

• Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
• Designed for precision laminating of glass/film (G+F) and film-to-glass products, including touch panels and display modules.
• Supports screen sizes from 7 inches (160×88 mm) to 21.5 inches (443×350 mm) with material thicknesses of 0.1–0.3 mm.

Core Functionality

• Mesh Box Lamination: Uses a mesh box structure with roller-based lamination for soft-to-hard material bonding.
• 4CCD Vision Alignment: Four cameras capture edge markers on glass and film for sub-millimeter alignment accuracy.
• Manual Loading/Automatic Process: Operators load materials; the system automates alignment, flipping, and roller lamination.

Key Specifications

• Platform Size:
  • Flip plate: 480×360 mm.
  • Mesh box: 645×465 mm.
• Display Compatibility:
  • Max: 21.5″ (443×350 mm).
  • Min: 7″ (160×88 mm).
  • Thickness: 0.1–0.3 mm.
• Roller Specifications:
  • Diameter: θ34 mm.
  • Width: 380 mm.
  • Hardness: 45 Shore (customizable).
• Production Capacity:
  • Cycle time: ～21 seconds per unit.
  • Output: >50 mm/s (equipment motion only).

Technical Features

1. 4CCD Vision System:
   • 4× 1.3-megapixel cameras with coaxial and ring lighting.
   • Field of view: 10.0×7.4 mm.
   • Alignment accuracy: ±0.1 mm (excluding material defects).
2. Adjustable Platforms:
   • Flip Plate:
     • Pneumatic flip mechanism with gear-rack drive.
     • Platform flatness: ±0.01 mm/100 mm.
   • Mesh Box:
     • Vacuum fixation (1 mm holes, 1.5 mm grooves).
     • Step motor + ball screw + linear guide drives (X/Y/Q axes).
3. Lamination System:
   • Servo-driven roller with precision pressure control (0.1–0.6 MPa).
   • Roller speed: Adjustable up to 50 mm/s.

Performance Metrics

• Yield Rate: ≥99% (excluding human error and material defects).
• Failure Rate: ≤2% under normal conditions.
• Changeover Time:
  • New models: ≤60 minutes.
  • Existing models: ≤30 minutes.

Operational Environment

• Cleanroom Requirements: Class 100 (ISO 5).
• Temperature: 23°C ±5°C.
• Humidity: 60% ±15%.
• Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
• Air Supply: 0.5–0.7 MPa, 250 L/min (φ8 mm yellow tubing).
• Vacuum System:
  • Flip plate: Vacuum generator.
  • Mesh box: Blower.
  • Consumption: 200 L/min.

Safety and Compliance

• ESD Protection:
  • Static elimination at material contact points.
  • Grounding impedance: ≤5 Ω.
  • Surface static: <±100 V.
• Safety Features:
  • Interlock design with buzzer and alarm alerts.
  • EMO (Emergency Stop) halts all motion.
  • Warning labels at high-temperature and pinch points.

After-Sales Support

• Warranty: 1 year (excludes wear parts and human-induced damage).
• Training: 1-day on-site program covering operation, calibration, and troubleshooting.
• Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

• Smartphone and tablet displays (G+F lamination).
• Touchscreen panels and optical film modules.
• Industrial control screens and automotive displays.

SEO Keywords

OL-WB215A, mesh plate laminating machine, 21.5-inch display laminator, 4CCD alignment laminator, G+F lamination equipment, automatic roller laminator, Olian Automaic, display module assembly, glass-to-film bonding, precision lamination system, touch panel equipment, soft-hard material laminator, industrial display machinery, China automation equipment, cleanroom-compatible laminator, high-yield display manufacturing, display production line, optical film laminator,