Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly
The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.
Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.
⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.
Bonding Principle & Workflow
The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.
The operator-driven workflow is as follows:
PCB Loading: The rigid PCB is placed manually onto the vacuum-equipped worktable.
PCB Fixturing: The operator presses the vacuum button (Φ24) to securely hold the PCB flat during bonding.
FPC Placement: The ACF-pre-laminated FPC (often with a temporary glass stiffener for handling) is laid onto the PCB and roughly aligned by eye.
FPC Fixturing: Vacuum is activated to gently hold the FPC in place during fine alignment.
Visual Alignment (Manual): The operator views the terminal overlap through an external monitor (camera system implied but not detailed in spec) and makes final positional adjustments by hand.
Bond Initiation: The operator presses two start buttons simultaneously (dual-hand safety). The platform then:
Automatically moves forward to the first bonding position
The short press head descends
Heat and pressure are applied for the preset duration
The head retracts
The platform may advance to subsequent zones if multi-segment bonding is configured
Unloading: After the full cycle, the operator removes the bonded assembly and repeats the process.
This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.
Key Technical Specifications
Maximum Substrate Size: Compatible with 15.6-inch diagonal PCBs (exact dimensions defined by worktable)
Press Head:
Standard length: 55 mm × 2.0 mm (short profile for localized heating)
Customization: Available per customer request for non-standard FPC widths
Temperature Control:
Press head range: Room temperature to 400°C
Uniformity: ≤ ±3°C across the head surface
Back pressure plate: RT to 150°C, uniformity ≤ ±3°C (used to support PCB during bonding)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 25 N to 1000 N, pneumatically regulated for consistent contact
Heating Elements:
Cartridge heaters: Φ9.5 mm × 45 mm
Temperature sensing: K-type thermocouples for closed-loop control
Control & Safety Systems
Operator Interface: Color touchscreen HMI for parameter setting (time, temperature, force)
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