Integrated Thermal Compression Platform for Both FOG and FOB Processes with Sequential Rework Capability
The OL-FF-173 by Olian Automatic Equipment Co., Ltd. is a versatile semi-automatic bonding machine designed for medium-sized display modules up to 17.3 inches. It uniquely supports both FOG (Film-on-Glass) and FOB (Film-on-Board) processes—including pre-bonding, main bonding, and rework functions—all within a single integrated platform. This makes it ideal for pilot lines, small-batch production, or repair stations handling mixed product types.
The system features a single-side, multi-segment architecture that can process up to 6 FPCs or 6 PCBs along one edge of a panel in sequence. Operators can configure the machine to run FOG only, FOB only, or FOG followed immediately by FOB—without changing hardware. If both are enabled, the machine automatically completes all FOG steps first, then proceeds to FOB bonding on the same unit.
For FOG mode, the operator places the LCD panel on the glass worktable and activates vacuum suction. They then position the FPC(s) on the FPC stage and perform rough alignment. Using a live monitor feed, they fine-tune alignment visually. After pressing both start buttons, the pre-press head descends to temporarily bond the first segment. The platform then shifts automatically to the next position. This repeats until all pre-press zones are complete. Finally, the platform moves to the main bonding station. The main press head applies full heat and pressure to cure all segments at once.
If FOB mode is also enabled, the machine returns to the FOG pre-press station—but now treats the bonded module as a “panel” for FOB processing. The operator places a PCB on the worktable, aligns it with the existing FPC leads, and initiates another bonding cycle. This seamless transition eliminates manual transfer between machines and reduces handling damage.
All loading, alignment, and unloading occur from the same front position, improving ergonomics and workflow consistency.
Both pre-press and main-press heads operate within a temperature range of room temperature to 400°C, with surface uniformity held to ±5°C—ensuring reliable ACF curing. Bonding time is adjustable from 0.1 to 99.9 seconds.
Force output is independently controlled:
Standard press head dimensions are:
All heads are made of high-wear-resistant material and can be customized to match specific COF or PCB layouts.
The machine uses physical controls including Φ24 mm start and vacuum buttons, plus a Φ22 mm emergency stop switch. A three-color signal lamp indicates operational status (ready, running, fault). While the document does not specify PLC or touchscreen use, the process is fully automated once started—minimizing operator error.
Safety is reinforced by the dual-hand start requirement, preventing accidental activation during alignment.
Olian includes one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, common troubleshooting, and replacement of wear parts. Duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal operating conditions. Consumable parts and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is provided beyond the warranty term.
The OL-FF-173 excels in environments requiring flexibility and rework capability—such as:
Its ability to perform FOG → FOB in one continuous flow significantly reduces cycle time and improves yield compared to using two separate machines.
FOG bonding machine, FOB bonding machine, FOG bonder, FOB bonder, 17.3 inch FOG FOB combo machine, OL-FF-173 Olian, single-side multi-zone FOG bonder, FOB rework bonding equipment, integrated FOG and FOB bonder, 400°C pre-main press bonder, ±5°C uniformity hot press head, sequential COF bonding machine, medium-size display thermal compression system, FOG to FOB inline bonding machine, semi-automatic FOG/FOB rework station, Olian OL-FF-173 technical specs, dual-process FOG FOB bonding machine with vacuum platform, China-made bonding machine for LCD repair, 6-segment FPC bonder, reliable FOG FOB bonder with 1-year warranty, touch panel and driver board bonding system, FOG FOB rework machine for 17.3 inch display, manual alignment bonding machine with dual-hand safety, export-ready FOG FOB bonding machine.
OL-F017 – 17-Inch Dual-Station In/Out Lower-Alignment FOG Bonding Machine (Touch Panel Customized)
High-Precision Semi-Automatic COF Bonding System for Touch Displays
The OL-F017 by Olian Automatic Equipment Co., Ltd. is a high-performance semi-automatic FOG (Film-on-Glass) bonding machine designed specifically for large-format touch panels up to 17 inches. It features a dual-station platform with in-and-out linear motion and lower-side visual alignment, enabling efficient, precise bonding of COF (Chip-on-Film) circuits onto LCD glass edges. This model is optimized for touch panel (TP) manufacturers requiring custom alignment workflows and stable thermal compression.
Unlike top-view alignment systems, the OL-F017 uses a bottom-mounted camera and monitor setup. Operators view alignment marks from below through the transparent glass substrate. This “lower alignment” method reduces parallax error and improves accuracy—especially critical for narrow-pitch COFs used in modern touch displays.
The machine operates with two independent workstations that move linearly between loading and bonding positions. While one station is under compression, the operator can load or unload the other—doubling throughput without extra labor. Both stations share the same bonding head but operate sequentially, ensuring consistent process control.
A single operator handles all steps from one position. They place the LCD panel on the glass platform and activate vacuum hold-down. Then they position the FPC on its dedicated stage. Using the live monitor feed, they manually adjust X/Y/θ alignment until the mark points match. Once confirmed as “OK,” they press both start buttons to begin the cycle.
The platform then moves automatically into the bonding zone. The heated press head descends, applies preset force and time, and completes the main bond. After bonding, the platform returns to the loading position. If enabled, the buffer tape advances once. The operator removes the finished panel and repeats the process.
The OL-F017 supports panels from 5 inches (112 × 65 mm) to 17 inches (380 × 240 mm) with thicknesses from 0.2 mm to 2.2 mm. FPC dimensions range from 12 × 12 mm to 60 × 60 mm, with a minimum mark-to-mark distance of 11 mm. The COF-to-glass step height must be at least 0.4 mm to ensure proper contact.
Bonding parameters are fully adjustable:
The standard FPC press head measures 60 mm × 1.0 mm but can be customized per customer requirements. Heating is fast and stable, using embedded cartridge heaters with real-time feedback.
The machine includes a 2x optical magnification lens with a 1.9 mm × 1.4 mm field of view. Lighting is provided by a coaxial LED source, eliminating shadows and enhancing mark contrast. The two camera lenses can be spaced from 11 mm to 90 mm apart, accommodating various COF layouts.
This lower-alignment design is ideal for transparent substrates like cover glass or OGS (One-Glass Solution) panels. It avoids interference from upper fixtures and provides a direct view of alignment targets.
The LCD platform measures 550 mm (W) × 320 mm (D). The FPC stage is 120 mm × 60 mm. The entire machine weighs approximately 380 kg and stands 1550 mm tall, with a work height of 860 ± 30 mm. Its footprint is 1550 mm (W) × 960 mm (D).
The frame is finished in industrial beige, while functional parts are chrome-plated or anodized for durability. All surfaces are delivered clean and dust-free. Warning labels are affixed near hot or moving components for safety.
Operation requires a cleanroom environment with temperature between 22°C and 27°C and humidity from 40% to 70% RH. The machine must be used in a dust-controlled, static-safe area to protect sensitive display components.
An integrated buffer tape mechanism manages ACF carrier film. It accepts tape with an inner diameter ≥33 mm and outer diameter ≤80 mm. The feed pitch is adjustable from 1 to 20 mm. If the tape fails to advance during operation, the system triggers an audible and visual alarm—preventing missed bonds.
Control is managed via PLC logic, a color touchscreen interface, and physical manual buttons. Emergency stop and dual-hand start functions ensure operator safety. The system also includes status indicators and fault diagnostics.
Olian provides one Chinese-language operation manual. On-site training lasts one day and covers installation, parameter setup, troubleshooting, and replacement of wear parts. Training duration can be adjusted by mutual agreement.
The machine carries a 12-month warranty under normal use. Consumables and damage from misuse or force majeure are excluded. During the warranty period, if remote support fails, an engineer will arrive on-site within 72 hours. Lifelong technical support is available after warranty expiration.
FOG bonder,FOG bonding machine,FOG binding machine,17 inch FOG bonding machine, OL-F017 Olian, dual-station FOG bonder, lower alignment COF bonder, touch panel FOG machine, semi-automatic Film-on-Glass equipment, 400°C FOG bonding equipment, ±5°C uniformity hot press, coaxial light vision FOG system, 2x magnification alignment camera, large LCD COF bonding machine, TP customized FOG bonder, in-out platform FOG machine, Olian OL-F017 technical specs, FOG machine for 17 inch touch display, manual alignment FOG bonding machine with PLC control, buffer tape alarm FOG system, China-made FOG bonder for export, dual-operator FOG machine with single loading position, reliable FOG bonding machine with 1-year warranty.
High-Efficiency Thermal Compression System for Multi-Segment COF-to-PCB Bonding
The OL-FOB156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic FOB (Film-on-Board) bonding machine engineered for the precise thermal compression of multiple COF (Chip-on-Film) or FPC (Flexible Printed Circuit) leads onto a single edge of rigid PCBs used in display modules up to 15.6 inches. Designed with a long main press head, this system supports multi-segment sequential bonding, enabling high-reliability electrical connections across extended or densely populated PCB bonding zones—common in automotive displays, industrial control panels, and smart appliance interfaces.
Unlike single-point bonders, the OL-FOB156L allows operators to process up to 10 individual FPCs along one side of a PCB in a single workflow, significantly improving throughput while maintaining consistent bond quality.
The machine operates through a well-defined manual-assisted process..
The operator begins by placing the PCB onto the dedicated worktable and activating vacuum suction via a Φ24 mm button to ensure flatness and stability.
Next, the FPCs are positioned on their respective stage and roughly aligned with the PCB pads. Using a live monitor feed, the operator performs fine visual alignment before initiating the cycle with a dual-hand start mechanism—a critical safety feature that prevents accidental activation.
Once started, the machine automatically executes a pre-press step at the first bonding position using a compact 55 mm × 2 mm tungsten carbide press head.
After completion, the platform shifts horizontally to the next segment, repeating the pre-press until all designated positions are processed.
If the system is configured for automatic alignment (e.g., with optional vision), pre-press may be skipped, proceeding directly to main bonding.
Following pre-press, the platform moves to the main bonding station,
where two long (200 mm × 2 mm standard) tungsten carbide press heads descend simultaneously.
These heads deliver a precisely controlled force ranging from 55 N to 1000 N,
with temperature maintained between room temperature and 400°C.
The surface temperature uniformity across the press head is guaranteed within ±8°C, ensuring consistent ACF (Anisotropic Conductive Film) curing. Bonding time is fully adjustable from 0.1 to 99.9 seconds.
Both pre-press and main press units utilize pneumatic cylinders with linear guides for smooth vertical.
motion and precision pressure regulators for repeatable force control.
The press heads are made of tungsten steel, offering exceptional wear resistance and surface flatness within ±5 microns. The main press heads also feature push-pull adjustment screws for fine-tuning parallelism relative to the PCB surface.
The PCB platform is constructed from hard anodized magnesium aluminum alloy, providing excellent rigidity and thermal stability. It incorporates a dense array of 1 mm vacuum holes and channels to secure panels firmly during bonding.
Platform flatness is maintained within ±0.008 mm per 100 mm, and it supports four-axis manual adjustment (X, Y, θ, and Z) via micrometer-style knobs with ±3 mm (X/Y/θ) and ±4 mm (Z) travel—enabling precise registration even with panel tolerances.
The machine is designed for single-operator use, with all loading, alignment. and unloading performed.
from the same front position, enhancing ergonomics and workflow efficiency.
Operation is managed through physical controls: a Φ24 mm start button, a Φ24 mm vacuum switch.
and a Φ22 mm emergency stop.
A three-color signal lamp provides real-time status feedback (ready, running, fault). The system does not include a PLC or touchscreen, prioritizing simplicity and reliability in production environments.
Olian includes a Chinese-language operation manual and provides one-day on-site training covering.
installation, parameter setup, routine maintenance, and replacement of consumable parts.
The machine is covered by a 12-month warranty under normal operating conditions.
During the warranty period, if remote troubleshooting fails, Olian guarantees on-site technical support within 72 hours. Lifelong technical assistance is available beyond the warranty term.
While the standard main press head measures 200 mm × 2 mm, Olian offers customization to match specific PCB layouts. This model is particularly suited for applications requiring long-edge, multi-chip COF bonding, such as driver boards for large-format LCDs where multiple flex circuits must be reliably connected in sequence.
In summary, the OL-FOB156L delivers a robust, efficient, and operator-friendly solution for medium-to-high volume FOB production—combining precision mechanics, thermal stability, and flexible multi-zone capability in a single platform.
FOB bonder,FOB bonding machine, FOB binding machine, FOB hot press machine, FOB machine, FOB equipment, FOB machinery,FOB fpc on pcb bonding machine, FOB bond, COF on PCB bonding machine, 15.6 inch FOB bonding machine, OL-FOB156L Olian, long press head COF to PCB bonder, multi-segment FOB bonder, semi-automatic Film-on-Board machine, COF bonding equipment for display modules.400°C FOB bonder, high-force FPC bonding machine 1000N.tungsten carbide press head FOB machine, multi-zone COF bonding system, automotive display FOB bonder.industrial HMI PCB bonding machine, manual FOB bonding machine with vacuum platform.Olian OL-FOB156L technical specifications, FOB machine for 15.6 inch LCD driver board, sequential COF bonding equipment.ACF thermal compression machine, FOB press head with dual-hand safety start, China-made FOB bonder for export, reliable FOB bonding machine with 1-year warranty.
OL-FOG156 Series – 15.6-Inch Single-Side Multi-Zone FOG Bonding Machines
Flexible Thermal Compression Systems for High-Density COF Bonding on LCD Panels
The OL-FOG156 Series by Olian Automatic Equipment Co., Ltd. comprises two variants of semi-automatic single-station FOG (Film-on-Glass) bonding machines, engineered for multi-segment thermal compression of COF (Chip-on-Film) circuits onto one edge of large-format rigid LCD panels up to 15.6 inches.
Both models support sequential pre-bonding and main bonding in a single workflow, with operator-assisted visual alignment via monitor. The key difference lies in the press head length, enabling optimization for either long continuous COF arrays (OL-FOG156L) or shorter, discrete COF segments (OL-FOG156S).
⚠️ Note: These machines assume that ACF has already been applied. They perform thermal compression only, not ACF lamination or automated vision alignment.
| Feature | Specification |
|---|---|
| Panel Size | Max: 350 mm × 250 mm (~15.6″) Min: 150 mm × 80 mm (~7″) Thickness: 0.2–2.2 mm |
| Temperature Range | RT to 400°C (both pre-press & main press) |
| Press Head Uniformity | ≤ ±8°C across surface |
| Bonding Time | 0.1 – 99.9 seconds (programmable) |
| Pre-Press Force | 25 – 400 N |
| Main Press Force | OL-FOG156L: 55 – 1000 N OL-FOG156S: 25 – 400 N |
| Max FPCs per Edge | ≤10 pcs (OL-FOG156L) ≤ Number of main press heads (OL-FOG156S) |
| Operation | Manual loading → Vacuum fixation → Visual alignment → Dual-hand start → Auto sequential bonding |
| Control | Manual buttons + indicator lights (no PLC/touchscreen) |
| Safety | Emergency stop, dual-hand start, three-color status lamp |
| Parameter | OL-FOG156L (Long Head) | OL-FOG156S (Short Head) |
|---|---|---|
| Pre-Press Head Length | 55 mm × 1 mm (standard) | 55 mm × 1 mm (standard) |
| Main Press Head Length | 200 mm × 2 mm (standard) | 220 mm × 1 mm (standard) |
| Typical Use Case | Bonding long, continuous COF ribbons (e.g., single wide driver IC or multi-chip array spanning >150 mm) | Bonding multiple short, discrete COFs (e.g., 2–10 separate flex circuits along one edge) |
| Force Capability | Higher main press force (up to 1000 N) for robust bonding of wide areas | Moderate force (up to 400 N), sufficient for standard COF segments |
| Customization | Both heads customizable per customer layout |
💡 Design Insight: Despite the name “short,” the OL-FOG156S actually has a slightly longer nominal main head (220 mm vs. 200 mm), but it is thinner (1 mm vs. 2 mm) and optimized for modular, segmented pressure application—not continuous wide-area bonding.
This semi-automated multi-zone approach ensures consistent bonding quality across complex edge layouts without full automation cost.
FOG BONDER,FOG bonding machine,15.6 inch multi-zone FOG bonder, OL-FOG156L vs OL-FOG156S, long press head COF bonder, short press head FOG bonding machine, single-side multi-segment COF bonding machine, Olian FOG156 series, 400°C FOG bonder for LCD, manual FOG machine with visual alignment, customizable press head FOG system.
OL-TAB173 – 15.6-Inch Dual-Station Integrated FOG & FOB Bonding Machine,
All-in-One Thermal Compression System for COF (FOG) and COB (FOB) Bonding in a Single Platform
The OL-TAB173 by Olian Automatic Equipment Co., Ltd. is an innovative dual-station integrated bonding machine that combines FOG (Film-on-Glass) and FOB (Film-on-Board) processes in one compact system—left station for FOG, right station for FOB. Designed for panels up to 15.6 inches, it enables seamless production of display modules requiring both COF-to-LCD and COF-to-PCB connections, such as automotive displays, industrial HMIs, and smart appliances.
This integrated approach eliminates the need for separate machines, reduces footprint, minimizes handling, and ensures process consistency between FOG and FOB steps—critical for yield and reliability in high-end applications.
⚠️ Note: This machine assumes that ACF has already been applied to both the LCD panel and PCB. It performs final main bonding only, not ACF lamination or pre-alignment.
💡 Note: Unlike some FOG-only models (e.g., OL-F0712), this unit does not include vision alignment—it is intended for pre-aligned COF from upstream processes.
FOG Bonding machine, FOB bonding machine, FOG bonder, FOB bonder, COF bonder ,COF bonding machine,15.6 inch FOG-FOB integrated bonding machine, OL-TAB173 Olian, dual-station COF bonder for LCD and PCB, left FOG right FOB bonder, all-in-one Film-on-Glass and Film-on-Board machine, servo COF bonding system for automotive displays, OL-TAB173 technical datasheet, dual-function bonding equipment for display module assembly, FOG+FOB 2 in 1, high-repeatability COF bonding machine with PLC control. COF repairing machine for laptop, COF repairing machine for notebook,
Ultra-High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-F0712 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. What sets it apart is its dual-camera vision system—featuring simultaneous top-view and bottom-view alignment—enabling unparalleled registration accuracy between COF terminals and ITO pads, even on multi-layer, opaque, or high-density interconnect (HDI) panels.
Combined with dual independent workstations, the OL-F0712 delivers both micron-level precision and continuous production throughput, making it ideal for demanding applications in automotive displays, medical imaging, avionics, and premium consumer electronics.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
This stereo alignment capability eliminates parallax and layer-shift errors—critical for panels with black matrix, touch sensors, or embedded layers.
FOG bonding machine,FOB bonding machine, 15.6 inch dual-vision FOG bonding machine, OL-F0712 Olian, top and bottom alignment fog bonding machine, dual-camera FOG bonder for LCD, front and rear COF bonding equipment, 2x magnification stereo vision COF aligner, coaxial LED top-bottom FOG machine, high-precision Film-on-Glass system for automotive displays, OL-F0712 technical datasheet, dual-station COF bonding machine with buffer tape alarm.
OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
FOG bonding machine, FOG bonder, FOG Binding machine, FOG equipment,15.6 inch dual-station FOG bonding machine, OL-FP156 Olian, bottom alignment COF bonding machine, front and rear FOG bonder for LCD, dual-platform Film-on-Glass machine with vision system, 2x magnification bottom camera COF aligner, coaxial LED FOG bonding equipment, high-precision COF main bonder for automotive displays, OL-FP156 technical specifications, servo FOG bonder with buffer tape alarm.
High-Efficiency Thermal Compression System for Continuous COG Production
The OL-C0156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent workstations, this system enables continuous operation: while one station is bonding, the operator can load/unload the other—dramatically improving workflow efficiency and reducing idle time.
As a dedicated COG (Chip-on-Glass) main bonder, the OL-C0156 fully cures the anisotropic conductive film (ACF) under precise heat and servo-controlled pressure, ensuring robust electrical connections and long-term display reliability in demanding applications such as automotive dashboards, industrial HMIs, and medical monitors.
⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It performs single-zone, single-side bonding only and does not include vision alignment or double-side capability.
This dual-station layout is ideal for lean manufacturing cells where operator efficiency and throughput are critical.
15.6 inch dual-station IC main bonding machine, OL-C0156 Olian, two-table COG热压机 for LCD, servo IC bonding equipment with dual workstations, single-zone IC本压机 for high-efficiency production, 400°C hot bar main bonder with Panasonic PLC, continuous COG bonding system for automotive displays, dual-platform IC热压设备, OL-C0156 technical datasheet, high-repeatability IC bonding machine with ±3N precision.
OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine
High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels
The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.
As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.
⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.
This dual-head architecture reduces cycle time by up to 40–50% compared to single-head machines in multi-IC applications (e.g., dual-driver displays).
15.6 inch dual-head IC main bonding machine, OL-CBY156 Olian, double hot bar COG bonder for LCD, servo-controlled dual IC bonding machine, high-throughput IC bonding equipment for display panels, multi-zone dual-head bonding machine, 400°C dual press head main bonder, simultaneous IC bonding machine for automotive displays, dual servo IC main bonding machine with PLC control, OL-CBY156 technical specifications. COG Bonder, COP bonder, COF bonder, Main bonding machine, Final bonding machine, final main bonding machine,main bonder,Final bonder.
OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,
High-Precision Thermal Compression System for Final IC Bonding on LCD Panels
The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.
Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.
⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.
💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.
IC Bonder,ACF IC bonder,IC bonding machine, COF bonding machine, COG bonding machine, IC final main bonding machine, IC main bonder,IC final bonder,COG ,COF,COP bonding machine, COP bonder, 15.6 inch IC main bonding machine, OL-CBD156 Olian, single-head COG bonder for LCD, servo-controlled thermal compression machine, multi-zone IC bonding equipment for display panels, high-precision IC main bonding machine with ±3N repeatability, 400°C hot bar main bonder for driver ICs, single-station COG bonding system, IC main bonding machine for automotive and industrial displays, servo IC final bonder with PLC and touchscreen.
