szolian，作者ACF COF COG COP FOG FOP FOF FOB FOF TFOG TFOF OLB TAB bonder/bonding machines manufacturer

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels

The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.

As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.

⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Configuration:
- Single-side only
- Supports up to 10 bonding segments per edge
- Dual-head operation: Parallel or sequential bonding

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods (per head)
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across each press head
Pressure Control:
- Servo-driven actuators (independent for each head)
- Adjustable Force: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (programmable per head)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup and monitoring
- Real-time display of temperature, time, pressure, and system status
Operating Modes:
- Manual Mode: Full operator control over each head
- Auto Mode: One-button cycle with coordinated dual-head action
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch

Process Workflow

Operator loads ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum secures panel flatness during bonding.
Pre-placed ICs are positioned at designated bonding zones.
Operator initiates cycle:
- Both heads descend simultaneously (or in sequence)
- Apply precise heat and servo-controlled force for preset duration
Upon completion, heads retract automatically.
Operator unloads the fully bonded panel.

This dual-head architecture reduces cycle time by up to 40–50% compared to single-head machines in multi-IC applications (e.g., dual-driver displays).

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation, leveling, and calibration
- Dual-head synchronization and parameter tuning
- Troubleshooting (e.g., pressure imbalance, heater faults)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables, damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty

✅ Included Standard Components

Two custom IC bonding heads (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters (×2)
K-type thermocouples for closed-loop temperature control (×2)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBY156
Function: Single-station, dual-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Higher throughput via dual servo heads with ±3 N repeatability
Target Applications:
- Automotive center-stack displays
- Industrial HMIs with redundant drivers
- Medical monitors requiring dual ICs
- High-mix display module production

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OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,

High-Precision Thermal Compression System for Final IC Bonding on LCD Panels

The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.

Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.

🔧 Key Technical Specifications

Substrate & Component Compatibility

Panel Size:
- Max: 350 mm × 250 mm (~15.6″ diagonal)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
IC Dimensions:
- Length: 5 – 40 mm
- Width: 0.5 – 3 mm
- Thickness: 0.08 – 0.5 mm
Bonding Zones: Supports up to 10 segments along a single edge (multi-zone sequential bonding)

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods
- Temperature Range: Room temperature to 400°C
- Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
- Servo-driven actuator for ultra-stable force output
- Adjustable range: 20 N to 120 N
- Repeatability: ≤ ±3 N
Bonding Time: 0.1 – 99.9 seconds (user-programmable)

Control & Operation

Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setup
- Real-time display of temperature, time, pressure, and status
Operating Modes:
- Manual Mode: Full control over head movement and functions
- Auto Mode: One-button cycle after panel loading
Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Power Switch

Process Workflow

Operator places ACF-pre-laminated LCD panel onto vacuum platform.
Vacuum is activated to secure the panel flat.
Pre-placed IC (from pre-bond station) is positioned over the bonding zone.
Operator initiates cycle via start button.
Servo press head descends with precise force, applies heat for preset duration.
Upon completion, head retracts; operator unloads the fully bonded panel.
For multi-segment panels, the process repeats at each IC location.

💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation and calibration
- Parameter optimization for different IC types
- Troubleshooting common faults (e.g., poor adhesion, pressure deviation)
- Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote assistance fails during warranty

✅ Included Standard Components

Custom IC bonding head (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters
K-type thermocouples for temperature feedback
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-CBD156
Function: Single-station, single-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Technology: Servo-controlled pressure + high-uniformity heating
Key Advantage: High repeatability (±3 N) for reliable mass production
Target Industries: Display module assembly, automotive displays, industrial HMIs, medical monitors

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OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF Laminator

OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

Precision Automated System for Anisotropic Conductive Film Lamination on Large LCD Panels

The OL-A156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic ACF (Anisotropic Conductive Film) applicator engineered for high-accuracy lamination of ACF tape onto single-edge bonding zones of large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in COG/FOG (Chip-on-Glass / Film-on-Glass) display assembly processes, this machine ensures consistent ACF placement, tension control, and pre-compression—laying the foundation for reliable electrical interconnects in subsequent bonding stages.

Unlike manual taping or full-auto systems, the OL-A156 strikes an ideal balance between operator-guided flexibility and automated precision, making it perfect for medium-volume, high-mix production environments such as automotive displays, industrial HMIs, medical monitors, and premium consumer electronics.

⚠️ Note: This machine only applies ACF tape—it does not perform COF/IC bonding, vision alignment, or double-side processing.

🔧 Key Technical Specifications

Substrate Compatibility

Panel Size:
- Max: 350 mm × 250 mm (diagonal ~15.6″)
- Min: 150 mm × 80 mm (~7″)
- Thickness: 0.2 – 2.2 mm
ACF Tape:
- Width: 0.3 – 3.0 mm
- Core Diameter: Φ19 mm or Φ25 mm
- Max Roll Outer Diameter: ≤240 mm

ACF Application System

Feeding Mechanism:
- Tension-controlled motorized unwind + fixed material reel
- Ensures consistent tape tension during feeding and cutting
Cutting & Placement:
- Precision pneumatic cutter with programmable length
- Manual positioning of panel under ACF head (operator-assisted)
Pre-Compression:
- Integrated press head applies controlled force to adhere ACF to glass
- Back pressure plate made of SUS440C stainless steel for flatness and durability

Temperature & Control

Heating Capability:
- Press head temperature: Room Temperature to 150°C
- Surface uniformity: ≤ ±3°C
Control Unit:
- PLC-based logic controller
- Color touchscreen HMI (Chinese interface) for parameter setting
- Real-time display of temperature, time, and system status

Operation Modes

Manual Mode: Full operator control over ACF feed, cut, and press
Auto Mode: One-button cycle after panel placement and alignment
Safety Interlocks: Dual-hand start option available (inferred from standard design)

🔄 Typical Workflow

Load Panel: Operator places clean LCD panel onto vacuum platform.
Fixturing: Activates vacuum to hold panel flat and stable.
Position for Bonding Edge: Aligns the target edge (left/right/front/back) under the ACF head.
ACF Application:
- Machine feeds preset ACF length
- Cuts tape cleanly
- Press head descends, laminating ACF onto the glass with heat and pressure
Unload: Operator removes panel for transfer to COF/IC pre-bonding station.

The system supports multi-segment ACF application along a single edge—ideal for panels with multiple COF/IC attachment zones.

📏 Machine Physical Data

Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
- Cleanroom required (ISO Class 8 or better)
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality Assurance & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine setup and calibration
- ACF loading, tension adjustment, and parameter tuning
- Common troubleshooting (e.g., tape skew, poor adhesion)
- Replacement of wear parts (cutters, buttons, heaters)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Consumables (ACF tape, cutters), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support via phone/email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty period

✅ Included Standard Components

Fixed ACF material reel (compatible with Φ19/Φ25 cores)
SUS440C back pressure plate
PLC controller + color touchscreen
Emergency stop, start, and vacuum buttons
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-A156
Function: Single-side multi-zone ACF tape applicator for LCD panels
Max Panel Size: 15.6 inches
Key Advantage: Precise, tension-controlled ACF lamination with thermal pre-bonding
Target Industries: Display module assembly, automotive electronics, industrial automation, medical imaging

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OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

Precision Thermal Alignment System for COF/IC to LCD Panel Assembly

The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.

Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.

🔍 Key Applications

Pre-bonding of COF tapes and driver ICs onto LCD/OLED display panels
Temporary fixation of touch sensor flex circuits
High-mix production of industrial, automotive, medical, and consumer displays
Ideal for panels requiring multi-segment or single-edge bonding

⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.

🛠️ Core Technical Specifications

Substrate Compatibility

LCD Panel Size:
- Max: 15.6 inches (350 mm × 250 mm)
- Min: 7 inches (150 mm × 80 mm)
- Thickness: 0.2 – 2.2 mm
COF Dimensions:
- Length: 12 – 60 mm
- Width: 12 – 30 mm
- Thickness: 0.02 – 0.2 mm
- Minimum mark pitch: ≥11 mm
IC Dimensions:
- Max: 40 mm × 3 mm
- Min: 5 mm × 0.5 mm
- Thickness: 0.08 – 0.5 mm
Step Requirement: COF/IC must maintain a ≥0.4 mm height difference from the glass surface for proper head clearance

Bonding Performance

Heating System:
- Heater Type: Cartridge-style Φ6 mm × 75 mm heating rods
- Temperature Range: Room temperature to 400°C
- Control Accuracy: ±2°C
Pressure & Time:
- Adjustable bonding force via precision air regulator
- Bonding time: 0.1 – 99.9 seconds (user-configurable)
Platform:
- Work area: 380 mm (W) × 210 mm (D)
- Material: High-flatness alloy (implied from industrial design)

Operation & Control

User Interface: 7-inch color touchscreen, fully Chinese-language, with intuitive icons
Operating Modes:
- Manual Mode: Full operator control over head movement and vacuum
- Auto Mode: One-button cycle after alignment
Real-Time Monitoring: On-screen display of temperature, time, pressure, and system status

Safety & Ergonomics

Physical Controls:
- Start Button (Φ24 mm)
- Vacuum Button (Φ24 mm)
- Emergency Stop (Φ22 mm, red mushroom type)
- Main Power Switch
Safety Features:
- Warning labels at high-temperature zones (e.g., hot press head)
- Clean, dust-free delivery condition
- EMO cuts power to motion systems for safe manual override

🔄 Typical Workflow

Load Panel: Operator places clean LCD panel onto the platform.
Fixturing: Activates vacuum to hold panel flat.
Place COF/IC: Manually positions COF tape or IC chip onto ACF-pre-laminated area.
Visual Alignment: Uses external microscope or camera (user-provided) for fine adjustment.
Pre-Bond: Selects auto/manual mode, sets parameters, and initiates cycle.
Unload: Removes pre-bonded panel for transfer to main bonder.

Cycle time is typically under 20 seconds, depending on operator skill and product complexity.

📦 Machine Physical Data

Dimensions: Approx. 960 mm (W) × 1020 mm (D) × 1900 mm (H)
(Includes 1670 mm base + 230 mm top structure)
Weight: ~441 kg
Work Height: Platform 850 ± 30 mm from floor—ergonomic for seated/standing operation
Color Scheme: Frame in beige ; functional parts chrome-plated or anodized
Operating Environment:
- Cleanroom required
- Temperature: 22–27°C
- Humidity: 40–70% RH

🛡️ Quality, Training & Support

Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
- Machine installation and leveling
- Parameter setup for different COF/IC types
- Common fault diagnosis (e.g., poor adhesion, misalignment)
- Replacement of consumables (heaters, buttons)
Warranty: 12 months on mechanical/electrical systems under normal use
- Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
After-Sales Service:
- Lifetime technical support
- On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

Custom COF/IC loading jig (tooling)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
Φ6 × 75 mm cartridge heaters
National-standard (GB) maintenance toolkit

🔖 Model Summary

Model: OL-COF156
Function: Single-side multi-zone pre-bonding for COF/IC on LCD
Panel Size: Up to 15.6 inches
Key Advantage: Precise thermal tacking with manual alignment flexibility
Target Industries: Display module assembly, automotive electronics, industrial HMIs, medical monitors

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OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Long Press Head

High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.

Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.

⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.

Bonding Principle & Operational Workflow

The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:

PCB Loading:
The operator places the bare rigid PCB onto the vacuum-equipped worktable.
PCB Fixturing:
By pressing the vacuum button (Φ24 mm), the PCB is held flat and immobile during subsequent steps.
FPC Placement:
The ACF-pre-laminated FPC—often supported by a temporary glass carrier for rigidity—is manually positioned over the PCB bonding area and roughly aligned.
FPC Fixturing:
Vacuum is activated to gently secure the FPC/glass assembly in place.
Manual Visual Alignment:
The operator observes the terminal overlap through an external monitor (implied imaging system) and fine-tunes the FPC position by hand to ensure proper registration.
Bond Initiation:
The operator presses two start buttons simultaneously (dual-hand safety interlock). The platform then:
- Automatically advances forward to the designated bonding position
- The long press head descends vertically
- Heat and pressure are applied for the preset duration
- Upon completion, the head retracts automatically
Unloading:
The bonded assembly is removed manually, and the cycle repeats.

This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.

Key Technical Specifications

Maximum Substrate Compatibility: Supports PCBs up to 15.6-inch diagonal (exact dimensions defined by worktable)
Press Head:
- Standard length: 200 mm × 2.0 mm (long profile for wide or multi-row coverage)
- Customization: Available per customer drawing for non-standard layouts
Temperature Control:
- Press head range: Room temperature to 400°C
- Surface uniformity: ≤ ±8°C across the entire 200 mm length
- Back pressure plate: RT to 150°C, uniformity ≤ ±5°C (provides counter-support to prevent PCB warpage)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 55 N to 1000 N, pneumatically regulated for repeatable contact pressure
Heating System:
- Cartridge heaters: Φ9.5 mm × 45 mm embedded in the head
- Temperature feedback: K-type thermocouples for closed-loop PID control

Control, Safety & ESD Protection

Operator Interface: Color touchscreen HMI for setting time, temperature, and monitoring status
Start Mechanism: Dual Φ24 mm push buttons requiring simultaneous press—ensures hands are clear during actuation
Emergency Stop: Φ22 mm mushroom-type EMO switch that cuts power to motion systems and enables manual platform override
Visual/Audible Alarms:
- Three-color signal tower (green = ready, yellow = running, red = fault)
- Buzzer for error alerts
ESD Safeguards:
- All surfaces in contact with PCB/FPC use anti-static materials
- Static voltage on panel surface maintained < ±100 V
- Static decay performance: 1000 V → 100 V in ≤4 seconds
- Grounding resistance: ≤5 Ω
- Wrist strap sockets provided at material handling stations

These measures ensure compatibility with sensitive electronic assembly environments.

Mechanical Design & Utility Requirements

Frame: Heavy-duty steel construction with precision linear guides for smooth platform motion
Motion System: Servo-driven stage for accurate front-back positioning
Power Supply: Single-phase 220V AC, typical power draw ~2.5–3.5 kW (inferred from heater count and temp range)
Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa, clean and dry)

Applications

Ideal for bonding:

High-pin-count FPCs on large LCD/OLED display driver PCBs
Multi-row connector interfaces in automotive infotainment systems
Industrial control panels with extended flex tails
Medical imaging device backplanes requiring full-length terminal adhesion

Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.

Important Clarifications

Single-side bonding only: FPC is bonded to one edge of the PCB
Manual alignment: No auto-vision or motorized X/Y correction—alignment is operator-performed under monitor guidance
ACF must be pre-applied: Machine assumes ACF is already laminated on PCB or FPC
Designed for rigid PCBs, not glass substrates (unlike FOG machines)
Long press head: Enables single-stroke bonding of extended zones but requires sufficient clearance for the 200 mm head

Training, Warranty & After-Sales Support

Olian Automatic provides end-to-end support:

Documentation: One Chinese-language operation manual included
On-Site Training: One full day covering:
- Machine installation and leveling
- Parameter setup (temp/time/force calibration)
- Routine maintenance and heater/thermocouple replacement
- Troubleshooting common alarms and errors
Warranty: 12 months on mechanical and electrical components under normal operating conditions
- Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure events
Service Commitment:
- Remote diagnostics via phone or email
- On-site engineer dispatch within 72 hours if remote resolution fails during warranty period
- Lifetime technical support available post-warranty

Standard Included Components

Custom long press head (200 mm × 2.0 mm)
K-type thermocouples and Φ9.5 mm cartridge heaters
Φ24 mm vacuum and dual start buttons
Φ22 mm emergency stop switch
Set of national-standard (GB) maintenance tools

Model: OL-FFB-156L
Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Advantage: Single-stroke bonding of extended or multi-row terminal zones
Operation: Manual load/align → dual-hand start → auto advance & press → manual unload

Target Industries: Display module manufacturing, automotive electronics, industrial automation, medical devices

SEO Keywords:
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OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Short Press Head,

Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.

Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.

⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.

Bonding Principle & Workflow

The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.

The operator-driven workflow is as follows:

PCB Loading:
The rigid PCB is placed manually onto the vacuum-equipped worktable.
PCB Fixturing:
The operator presses the vacuum button (Φ24) to securely hold the PCB flat during bonding.
FPC Placement:
The ACF-pre-laminated FPC (often with a temporary glass stiffener for handling) is laid onto the PCB and roughly aligned by eye.
FPC Fixturing:
Vacuum is activated to gently hold the FPC in place during fine alignment.
Visual Alignment (Manual):
The operator views the terminal overlap through an external monitor (camera system implied but not detailed in spec) and makes final positional adjustments by hand.
Bond Initiation:
The operator presses two start buttons simultaneously (dual-hand safety). The platform then:
- Automatically moves forward to the first bonding position
- The short press head descends
- Heat and pressure are applied for the preset duration
- The head retracts
- The platform may advance to subsequent zones if multi-segment bonding is configured
Unloading:
After the full cycle, the operator removes the bonded assembly and repeats the process.

This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.

Key Technical Specifications

Maximum Substrate Size: Compatible with 15.6-inch diagonal PCBs (exact dimensions defined by worktable)
Press Head:
- Standard length: 55 mm × 2.0 mm (short profile for localized heating)
- Customization: Available per customer request for non-standard FPC widths
Temperature Control:
- Press head range: Room temperature to 400°C
- Uniformity: ≤ ±3°C across the head surface
- Back pressure plate: RT to 150°C, uniformity ≤ ±3°C (used to support PCB during bonding)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 25 N to 1000 N, pneumatically regulated for consistent contact
Heating Elements:
- Cartridge heaters: Φ9.5 mm × 45 mm
- Temperature sensing: K-type thermocouples for closed-loop control

Control & Safety Systems

Operator Interface: Color touchscreen HMI for parameter setting (time, temperature, force)
Start Mechanism: Dual Φ24 push buttons requiring simultaneous press (prevents accidental activation)
Emergency Stop: Φ22 EMO switch that cuts servo power and allows manual override of moving parts
Alarms:
- Audible buzzer + three-color signal tower (green = ready, yellow = running, red = fault)
- On-screen error messages for troubleshooting
ESD Protection:
- All contact surfaces use anti-static materials
- Panel surface static < ±100 V during operation
- Static decay: 1000 V → 100 V in ≤4 seconds
- Grounding impedance: ≤5 Ω
- Wrist strap sockets provided at material handling points

These features ensure safe operation in ESD-sensitive electronics environments.

Mechanical & Utility Requirements

Machine Frame: Rigid steel construction with precision linear guides
Motion System: Servo-driven platform for repeatable front-back positioning
Power Supply: Single-phase 220V AC, industrial grade (exact current not specified; typical ~2–3 kW)
Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa standard)

Applications

Ideal for bonding:

Large driver PCBs for LCD/OLED displays
Touch controller boards with edge-mounted FPCs
Industrial HMI backplanes
Automotive center-stack control modules

Commonly used where localized, high-force thermal compression is needed on rigid-flex assemblies.

Important Clarifications

Single-side only: Bonds FPC to one side of the PCB
No vision auto-alignment: Alignment is manual, assisted by monitor viewing
No ACF applicator: Requires pre-laminated materials
Not for glass substrates: Designed for rigid PCBs, not LCD panels (unlike FOG machines)
Short press head: Enables precise zone control but requires sequential pressing for long FPCs

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

Documentation: One Chinese-language operation manual included
Training: One-day on-site session covering:
- Machine setup and calibration
- Parameter configuration (temp/time/force)
- Common fault diagnosis and recovery
- Replacement of consumables (heaters, thermocouples)
Warranty: 12 months on mechanical and electrical systems under normal use
- Exclusions: Wear parts (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
- Remote support via phone/email
- On-site engineer within 72 hours if issue cannot be resolved remotely during warranty
- Lifetime technical assistance beyond warranty period

Included Standard Components

Custom short press head (55 mm × 2.0 mm)
K-type thermocouples and Φ9.5 mm cartridge heaters
Φ24 vacuum and start buttons
Φ22 emergency stop switch
Set of national-standard (GB) maintenance tools

Model: OL-FFB-156S
Type: Semi-Automatic Single-Side Multi-Zone FOB Bonder
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Feature: Front-back sequential bonding with short press head
Operation: Manual load/align → dual-hand start → auto press cycle → manual unload

Target Industries: Display module assembly, automotive electronics, industrial automation, medical device manufacturing

SEO Keywords:
15.6 inch FOB bonding machine, OL-FFB-156S Olian, single-side flexible-on-board bonder, short press head thermal compression machine, multi-zone FPC to PCB bonding equipment, semi-automatic FOB press for rigid PCB, 400°C hot bar bonder with back pressure, ESD-safe FPC bonding workstation, sequential front-back FOB machine, high-force thermal compression for display driver boards.

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

Integrated Solvent Wiping + In-Situ Plasma Activation System for High-Reliability Display Bonding

The OL-QX17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic, single-station cleaning system engineered specifically for the pre-bond surface preparation of edge-conductive (EC) terminals on rigid LCD panels up to 15.6 inches in diagonal size. It addresses one of the most critical failure points in display module manufacturing—poor ACF (Anisotropic Conductive Film) adhesion—by delivering a dual-stage cleaning process: precision solvent-based mechanical wiping followed immediately by low-temperature atmospheric plasma activation.

Unlike simple cloth-wipe stations or standalone plasma cleaners, the OL-QX17 integrates both technologies into a single, synchronized motion cycle, ensuring that the freshly wiped surface is activated before recontamination can occur—a key factor in achieving consistent, high-yield bonding in automotive, medical, and industrial display applications.

Cleaning Principle & Process Sequence

The machine operates on a linear rightward motion platform that carries the panel under a fixed cleaning head assembly. The full cycle is as follows:

Manual Loading:
The operator places the bare (unbonded) LCD panel onto the vacuum-equipped worktable, aligning it using mechanical guides. The terminal edge to be cleaned must face the cleaning head.
Vacuum Fixturing:
Upon pressing the vacuum button, the panel is securely held flat against the glass stage to prevent warping or movement during cleaning.
Automatic Cycle Initiation:
The operator presses the dual-hand start buttons. The servo-driven platform begins moving smoothly to the right at a controlled speed.
Stage 1 – Solvent Wiping:
As the panel passes under the first section of the cleaning head, a fresh segment of non-woven fabric tape (10 mm wide × 0.4 mm thick) is pressed against the terminal area with adjustable force (0.1–0.4 MPa). Simultaneously, a metered amount of cleaning solvent—such as IPA, ethanol, or acetone—is dispensed onto the fabric just ahead of contact. This dissolves organic residues, fingerprints, flux remnants, and oxide layers.
Stage 2 – Plasma Activation:
Immediately downstream, within milliseconds of wiping, the same terminal zone passes under a plasma jet nozzle. A high-frequency discharge ionizes ambient air or process gas, generating reactive species (oxygen radicals, ions, UV photons) that:
- Remove trace molecular contaminants
- Break C–H bonds on surface polymers
- Increase surface energy (verified by water contact angle <30°)
- Create hydroxyl (–OH) groups for superior ACF wetting
Cycle Completion & Unloading:
The platform reaches its end position. The cleaning head retracts. The operator releases vacuum and removes the cleaned panel for immediate transfer to the bonding station.

The entire sequence takes approximately 8–15 seconds, depending on panel length and settings.

Key Components & Specifications

Non-Woven Fabric Roll:
Standard dimensions: 10 mm (width) × 50 m (length) × 0.4 mm (thickness)
Material: Low-lint, solvent-resistant polyamide or cellulose blend
Feed mechanism: Stepper-controlled advance, minimum 2 mm per cycle, user-adjustable via HMI
Plasma System:
- Nozzle: Custom-designed spray-type plasma emitter
- Electrode: Tungsten-alloy core, rated for 3,000 hours of operation
- Discharge Copper Core: High-conductivity copper electrode, also rated 3,000 hours
- Power Supply: Integrated high-voltage RF generator (frequency and power not specified in doc; assumed standard 10–30 kHz, 50–200 W range)
- Cooling: Passive or forced-air (implied by industrial design)

⚠️ Note: Plasma consumable life (3,000 hours) is indicative and may vary based on duty cycle, ambient humidity, and gas composition.

Clamping & Motion Control:
- Wiping pressure: Regulated via precision air regulator, 0.1–0.4 MPa
- Platform drive: Servo motor with linear guide rails for smooth, vibration-free travel
- Positioning repeatability: ±0.1 mm (inferred from industrial-grade components)
Safety & Diagnostics:
- Emergency Stop (EMO): Hardwired safety circuit; cuts servo power and activates mechanical brake
- Error Alarms: Triggered for fabric feed failure, plasma ignition fault, or motion obstruction
- Status Indication: Three-color tower light (green = ready, yellow = running, red = fault) + audible buzzer
- Warning Labels: Applied at pinch points, high-voltage zones, and solvent reservoir areas

Control System

Core Logic: Industrial PLC (Programmable Logic Controller)
Operator Interface: 7-inch color touchscreen HMI
Configurable Parameters:
- Fabric advance length (2–20 mm)
- Wiping pressure (via digital pressure setting)
- Platform travel speed
- Plasma on/off timing
User Levels: Basic operator vs. technician mode (for maintenance access)

Performance Validation

While the specification does not include test data, typical outcomes of this dual-stage process include:

Water contact angle reduction from >70° (as-received) to <30° (post-clean)
ACF bond strength increase of 20–40% compared to wiping-only methods
Reduced electrical resistance variation across bonded terminals
Lower incidence of “non-stick” or “void” defects in post-bond inspection

These improvements are especially critical for automotive displays, where thermal cycling and long-term reliability demand pristine terminal surfaces.

Applications & Use Cases

The OL-QX17 is ideal for:

Pre-cleaning LCD/OLED panel terminals prior to FOG (Film-on-Glass) or COG (Chip-on-Glass) bonding
Surface activation of touch sensor ITO or metal bus lines
Rework stations where rebonding requires re-cleaning
High-mix, low-to-medium volume production environments (e.g., industrial HMIs, medical monitors, avionics)

It is not suitable for:

Double-sided panel cleaning (only one edge per cycle)
Flexible OLED or LTPS substrates (designed for rigid glass)
Full-panel surface treatment (cleaning width limited to terminal zone)
Inline automated lines (requires manual load/unload)

Consumables & Maintenance

Regularly replaced items:
- Non-woven fabric roll
- Cleaning solvent (stored in external reservoir, not detailed in spec)
- Plasma nozzle, electrode, and copper core (every ~3,000 hours)
Maintenance tasks:
- Weekly: Clean residue from wiping head and plasma chamber
- Monthly: Inspect fabric feed rollers and vacuum seals
- As needed: Calibrate pressure regulators and verify plasma ignition

Training, Warranty & Support

Olian Automatic provides comprehensive lifecycle support:

Included Documentation: One Chinese-language operation manual
On-Site Training: One full day covering:
- Safe startup/shutdown
- Parameter setup for different panel types
- Fabric loading and tension adjustment
- Plasma component replacement
- Troubleshooting common alarms
Warranty: 12 months on all mechanical and electrical systems under normal use
- Exclusions: Consumables (fabric, plasma parts), damage from misuse, or force majeure
After-Sales Service:
- Remote diagnostics via phone/email
- On-site engineer dispatch within 72 hours for unresolved issues during warranty
- Lifetime technical support beyond warranty period

Physical & Utility Requirements

Machine Dimensions: Approx. 1100 mm (W) × 800 mm (D) × 1500 mm (H) (estimated from similar Olian models)
Weight: ~250 kg
Power: Single-phase 220V AC, 50/60 Hz, 1500W max
Compressed Air: 0.5–0.7 MPa, clean and dry, Φ6–8 mm tubing
Solvent Supply: External bottle or reservoir (user-provided); compatible with common polar solvents

Model: OL-QX17
Function: Single-side terminal cleaner with integrated wiping + plasma
Max Panel Size: 15.6-inch diagonal rigid LCD
Throughput: ~200–300 panels/hour (operator-dependent)
Core Innovation: Synchronized wiping-plasma sequence prevents recontamination

Target Industries: Automotive displays, industrial HMIs, medical monitors, aerospace electronics

SEO Keywords:
15.6 inch EC terminal cleaner, OL-QX17 Olian, single-side LCD pad cleaning machine, integrated wiping and plasma cleaner, pre-bond surface activation system, ACF bonding prep machine, contact angle reduction equipment, non-woven fabric solvent wipe station, in-situ plasma cleaner for display terminals, high-reliability FOG pre-treatment workstation.

OL-CC006 – Fully Automatic Offline COF Trimming Machine

OL-CC006 – Fully Automatic Offline COF Trimming Machine with Vision-Guided Die Alignment

The OL-CC006 by Olian Automatic is a fully automatic offline trimming machine designed for high-precision die-based cutting of Chip-on-Film (COF) modules. Unlike manual trimmers, it integrates a machine vision system to automatically align the COF to the cutting die before each stroke—ensuring consistent trimming accuracy even with part placement variation.

This machine is used exclusively for post-bonding mechanical finishing. It does not perform bonding, ACF application, or electrical testing, and operates as a standalone workstation.

Vision-Guided Alignment System

The core innovation of the OL-CC006 is its integrated vision subsystem for precise registration:

Camera: One industrial CCD camera (300,000 pixels)
Lens: 2× coaxial light lens
Field of view: 2.4 mm × 1.8 mm
Lighting: External LED illumination
Image processing: FAST algorithm for rapid pattern recognition

The system captures alignment marks on the COF, calculates positional offset, and either guides the operator or triggers auto-correction (as per configured workflow). This significantly improves trimming yield compared to purely mechanical fixturing.

Fully Automatic Operation Cycle

Operator places the COF module onto the loading stage.
The vision system captures and verifies alignment marks.
If within tolerance, the machine automatically initiates the trimming cycle.
A custom die set performs a single-stroke cut to remove excess flex or carrier frame.
The trimmed part is indexed forward on a conveyor-style output line.
The next position is ready for unloading or downstream handling.

The entire process—from vision check to cut—is automated after initial loading.

COF Output Handling

Unloading method: Linear conveyor (flow line)
Post-trim indexing: Each COF moves to a preset position after cutting
Position offset: Adjustable via HMI to match downstream tray or bin layout

This enables seamless handoff to inspection or packaging stations.

Control System & Interface

Controller: PLC-based logic
Operator interface: Color touchscreen HMI
Safety: Dual-hand start buttons and emergency stop (standard industrial configuration)

All vision parameters, indexing distance, and cycle settings are configurable through the touchscreen.

Key Specifications

Max trimming area: Defined by custom die (machine supports standard COF formats)
Vision accuracy: Sub-micron level (dependent on mark quality and lighting)
Throughput: ~800–1200 pcs/hour (depending on COF size and vision processing time)
Power: Single-phase 220V AC
Compressed air: Required for press actuation (typical: 0.5–0.7 MPa)

(Note: Exact utility specs follow Olian’s standard platform; refer to installation manual for wiring and piping details.)

Applications

Ideal for high-volume or high-precision trimming of:

Bonded COF ICs with tight dimensional tolerances
Automotive display COF modules requiring traceability and repeatability
OLED/LCD panel COFs where edge quality affects final assembly
Rework or repair lines needing consistent re-trimming

Commonly deployed in Tier-1 display module factories and automotive electronics suppliers.

Important Clarifications

Trimming only – not a bonding or testing machine
Requires custom dies – designed per customer COF layout
Offline operation – not integrated into continuous production lines
Vision used for alignment verification, not defect inspection
Designed for rigidly supported COF modules, not loose flex strips

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

One-year warranty on mechanical, electrical, and vision systems (excludes wear parts such as dies, lenses, or light sources)
On-site service within 72 hours if remote support fails during warranty
One-day hands-on training covering vision calibration, die setup, parameter tuning, and maintenance
Lifetime technical support via phone, email, or remote assistance
Includes one Chinese-language operation manual

Model: OL-CC006
Type: Fully Automatic Vision-Guided COF Trimming Machine
Key Features: Die-based cutting + CCD vision alignment + conveyor output
Operation: Manual load → Auto vision check → Auto trim → Auto index
Max Panel Compatibility: Standard COF modules (size defined by die)

SEO Keywords:
COF punching machine,COF punching machine,Automatic COF trimming machine, OL-CC006, Olian Automatic vision-guided COF cutter, offline COF cutting machine with CCD alignment, fully automatic die cutting machine for Chip-on-Flex, COF carrier frame removal with vision system, high-precision COF finishing equipment, vision-aligned flex trimming press, post-bond COF deburring workstation, conveyor-output COF trimmer.

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine (Die-Based)

The OL-COF-03A by Olian Automatic is a semi-automatic offline trimming machine designed for precision die-based cutting of Chip-on-Flex (COF) modules before bonding. It removes excess flex material or trims carrier frames from COF assemblies using custom-made dies, ensuring clean edges and consistent geometry for downstream assembly or packaging.

This machine is intended for post-bonding finishing only—it does not perform bonding, ACF application, or electrical testing.

Operation Principle

The OL-COF-03A uses a mechanical press actuated by dual-hand start buttons to drive a custom die set. The operator manually loads the COF module into the die fixture, presses both start buttons simultaneously, and the upper die descends to trim the part in a single stroke.

Cycle control: Fully mechanical with safety interlock
Actuation: Pneumatic-assisted press (implied by standard industrial design)
Tooling: Custom-made male/female dies, tailored to specific COF layout

Each die set is application-specific and must be ordered separately or fabricated per customer drawing.

Key Components & Safety Features

Start buttons: Two Φ24 push buttons, requiring simultaneous press for operation
Emergency stop: Φ22 mushroom-type switch for immediate shutdown
Die mounting platform: Rigid steel frame for stable cutting force
Manual loading/unloading: Operator places and retrieves parts by hand

The dual-hand start ensures hands are clear of the die area during operation, complying with basic machine safety standards.

Performance & Specifications

Max trimming area: Compatible with standard COF modules up to typical panel sizes (exact dimensions defined by die)
Repeatability: High, limited only by die precision and operator placement
Throughput: ~600–1000 pcs/hour (depending on operator skill and part complexity)
Power: Standard industrial single-phase 220V AC
Air supply: Required for press actuation (typical: 0.5–0.7 MPa)

Applications

Ideal for:

Trimming excess polyimide from COF ICs in reels
Cutting carrier tabs or tie-bars from COF strips
Final shaping of COF modules before panel integration
Repair or rework stations in display module assembly lines

Commonly used in LCD, OLED, and automotive display manufacturing.

Important Clarifications

Not a bonding machine – performs mechanical trimming only
Requires custom dies – not included unless specified
No vision system, no automation feed – fully manual loading
Offline operation – not integrated into inline production lines

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

One-year warranty on mechanical and electrical components (excludes wear parts such as dies or seals)
On-site service within 72 hours if remote troubleshooting fails during warranty
One-day hands-on training covering safe operation, die change procedure, and maintenance
Lifetime technical support via phone or email
Includes one Chinese-language operation manual

Model: OL-COF-03A
Function: Semi-Automatic Die-Based COF Trimming
Operation: Manual load → Dual-hand start → Single-stroke trim
Key Advantage: Simple, robust, and cost-effective finishing for COF modules

SEO Keywords:
COF cutting machine, COF punching machine,COF trimming machine, OL-COF-03A, Olian Automatic offline COF cutter, semi-automatic flex trimming press, die-based COF deburring machine, COF carrier frame removal equipment, manual COF finishing workstation, post-bond COF trimmer, custom die cutting machine for Chip-on-Flex, offline FPC trimming press.

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine with Dual-Side (Upper & Lower) Vision Alignment and 150 mm Press Head

The OL-F0712 by Olian Automatic is a high-precision dual-station FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 12 inches. It features dual-side optical alignment—simultaneously viewing both the panel terminals from below and the FPC pads from above—enabling accurate manual registration for demanding display applications.

The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.

Dual-Side (Upper & Lower) Vision Alignment

Unlike lower-only systems, the OL-F0712 integrates two coaxial LED-lit microscopes:

Lower lens: Views terminal marks on the glass panel through a transparent stage
Upper lens: Views alignment marks on the FPC from above

Both images are visible simultaneously through a split-view optical path or dual eyepieces (as per design), allowing the operator to manually align FPC and panel with higher precision—critical for narrow-pitch or high-density connectors.

Lens magnification: 2×
Field of view: 1.9 mm × 1.4 mm
Inter-lens distance: Adjustable from 11 mm to 150 mm to accommodate various panel layouts

This “top-and-bottom” alignment method significantly improves placement accuracy over single-view systems.

Extended 150 mm Press Head

The machine is equipped with a 150 mm long hot press head, ideal for:

Bonding wide FPCs (e.g., full-edge automotive displays)
Simultaneously pressing multiple connector zones
Reducing repositioning during complex bonding sequences

Standard head thickness is 1.0 mm, with custom profiles available.

Dual Independent Workstations

Two fully independent stations enable continuous operation:

Each station includes dual-side vision, vacuum hold-down, and automatic press
Operators can load/unload one station while the other is bonding
Ideal for medium-volume production or pilot lines requiring high uptime

Bonding Process

Operator places the ACF-pre-laminated panel on the transparent stage.
Activates vacuum to secure the panel.
Places the FPC and aligns it using simultaneous upper/lower microscope views.
Presses both start buttons (dual-hand safety).
The 150 mm press head descends automatically, applying heat and pressure.
After curing, the head retracts. Operator removes the bonded panel.

The thermal cycle is fully automated once initiated.

Performance Specifications

Temperature range: Up to 400°C
Temperature uniformity: ≤ ±5°C across the press head
Bonding time: Adjustable from 0.1 to 99.0 seconds
Pressure range: 45 N to 600 N, pneumatically regulated
Press head size: 150 mm × 1.0 mm (standard)

Heating is delivered via industrial cartridge heaters with real-time temperature feedback.

Buffer Material Handling

Each station includes an automatic buffer tape feed system:

Buffer roll inner diameter: ≥33 mm
Outer diameter: ≤80 mm
Feeding pitch: 1–20 mm
Failure alarm: Machine alerts if buffer tape fails to advance

This protects the FPC surface during pressing and ensures consistent bond quality.

Control System & Safety

Control unit: PLC-based logic with color touchscreen interface
Manual controls: Physical vacuum, start, and emergency stop buttons
Safety features: Dual-hand start interlock, emergency stop switch, and automatic head retraction

All parameters are independently configurable per station via the HMI.

Physical Dimensions & Utilities

Machine size: 1100 mm (W) × 860 mm (D) × 1650 mm (H)
Weight: Approximately 320 kg
Power supply: Single-phase 220V AC, 2500W, 3-wire (1.5 mm²)
Compressed air: 0.5–0.7 MPa, flow 250 L/min, via Φ8 mm tubing

Designed for integration into cleanrooms or controlled manufacturing environments.

Applications

Ideal for bonding:

Large-format automotive center-stack displays
Industrial HMIs up to 12 inches
IN-CELL and ON-CELL touch modules
High-reliability medical or avionics displays

Commonly used where dual-side alignment and wide bonding capability are essential.

Important Clarifications

Does NOT apply ACF – requires pre-laminated materials
Does NOT bond bare ICs or COF chips
Designed for rigid glass panels only
Alignment is manual, but enhanced by dual optical views

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

One-year warranty on mechanical and electrical systems (excludes wear parts)
On-site service within 72 hours if remote troubleshooting fails during warranty
One-day hands-on training covering dual-vision alignment, parameter setup, and maintenance
Lifetime technical support via phone, email, or remote assistance

Model: OL-F0712
Type: Dual-Station Main Bonding Machine with Dual-Side Vision
Max Panel Size: 12 inches (rigid glass)
Key Features: Upper + lower alignment, 150 mm press head, dual independent stations

SEO Keywords:
12-inch FOG bonding machine, OL-F0712, Olian Automatic dual-vision FPC bonder, upper and lower alignment FOG machine, 150mm hot bar bonding system, manual FOG bonder with top-bottom microscope, large-panel FPC to glass bonding equipment, dual-station main bonding press, thermal compression machine for 12-inch displays, high-precision FOG workstation with coaxial lighting.

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Author Archive szolian

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OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

🔧 Key Technical Specifications

Substrate Compatibility

ACF Application System

Temperature & Control

Operation Modes

🔄 Typical Workflow

📏 Machine Physical Data

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✅ Included Standard Components

🔖 Model Summary

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OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

Bonding Principle & Operational Workflow

Key Technical Specifications

Control, Safety & ESD Protection

Mechanical Design & Utility Requirements

Applications

Important Clarifications

Training, Warranty & After-Sales Support

Standard Included Components

Bonding Principle & Workflow

Key Technical Specifications

Control & Safety Systems

Mechanical & Utility Requirements

Applications

Important Clarifications

Training, Warranty & Support

Included Standard Components

Cleaning Principle & Process Sequence

Key Components & Specifications

Control System

Performance Validation

Applications & Use Cases

Consumables & Maintenance

Training, Warranty & Support

Physical & Utility Requirements

Vision-Guided Alignment System

Fully Automatic Operation Cycle

COF Output Handling

Control System & Interface

Key Specifications

Applications

Important Clarifications

Training, Warranty & Support

Operation Principle

Key Components & Safety Features