The OL-F0712 by Olian Automatic is a high-precision dual-station FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 12 inches. It features dual-side optical alignment—simultaneously viewing both the panel terminals from below and the FPC pads from above—enabling accurate manual registration for demanding display applications.
The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.
Unlike lower-only systems, the OL-F0712 integrates two coaxial LED-lit microscopes:
Both images are visible simultaneously through a split-view optical path or dual eyepieces (as per design), allowing the operator to manually align FPC and panel with higher precision—critical for narrow-pitch or high-density connectors.
This “top-and-bottom” alignment method significantly improves placement accuracy over single-view systems.
The machine is equipped with a 150 mm long hot press head, ideal for:
Standard head thickness is 1.0 mm, with custom profiles available.
Two fully independent stations enable continuous operation:
The thermal cycle is fully automated once initiated.
Heating is delivered via industrial cartridge heaters with real-time temperature feedback.
Each station includes an automatic buffer tape feed system:
This protects the FPC surface during pressing and ensures consistent bond quality.
All parameters are independently configurable per station via the HMI.
Designed for integration into cleanrooms or controlled manufacturing environments.
Ideal for bonding:
Commonly used where dual-side alignment and wide bonding capability are essential.
Olian Automatic provides comprehensive post-sale support:
Model: OL-F0712
Type: Dual-Station Main Bonding Machine with Dual-Side Vision
Max Panel Size: 12 inches (rigid glass)
Key Features: Upper + lower alignment, 150 mm press head, dual independent stations
SEO Keywords:
12-inch FOG bonding machine, OL-F0712, Olian Automatic dual-vision FPC bonder, upper and lower alignment FOG machine, 150mm hot bar bonding system, manual FOG bonder with top-bottom microscope, large-panel FPC to glass bonding equipment, dual-station main bonding press, thermal compression machine for 12-inch displays, high-precision FOG workstation with coaxial lighting.
OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine
The OL-FC005 by Olian Automatic is an integrated dual-station COF(chip on film) FOG (Film-on-Glass) bonding system that combines pre-bonding and main bonding in a single machine. The left station performs pulse pre-bonding to temporarily tack flexible circuits (FPC or COF) onto LCD panels, while the right station executes full main bonding to permanently cure the joint—streamlining workflow and reducing handling errors.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It does not apply ACF, nor does it support IC chip bonding.
Operators first align and pre-bond the panel on the left, then transfer it directly to the right station for final bonding—enabling efficient, two-step processing without leaving the workstation.
Both stations use a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below. The COF /FPC is positioned manually from above using visual estimation.
This “lower-only” method provides a practical balance of simplicity and accuracy for mid-precision applications.
Both stations feature independent temperature and time settings to optimize pre-tack and main-cure profiles separately.
Each station includes an automatic buffer tape feed system to protect the FPC during pressing:
Two independent buffer systems ensure reliable protection at both pre-bond and main bond stages.
All parameters—temperature, time, pressure—are set independently for each station via the HMI.
The compact footprint integrates seamlessly into production lines or R&D labs.
Ideal for two-stage bonding of:
Commonly used where process control, reduced contamination, and workflow efficiency are critical.
Olian Automatic provides comprehensive post-sale support:
Model: OL-FC005
Type: Integrated Dual-Station COF /FOG Machine (Pre-Bond + Main Bond)
Layout: Left = Pre-Bond | Right = Main Bond
Max Panel Size: 7 inches (rigid glass)
Key Advantage: Streamlined two-step bonding in one workstation
SEO Keywords:
Integrated pre-bond and main bond machine, OL-FC005, Olian Automatic dual-function COF FOG bonder, 7-inch left pre-right main bonding system, COF FPC tacking and curing workstation, two-station COF FOG machine with buffer feed, manual COF FOG bonder with pre-main integration, lower-view alignment COF FOG equipment, ACF bonding system for display assembly, dual-station pulse and thermal compression bonder.
OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine with Lower-Side Alignment。
The OL-FS003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine featuring servo-driven press control for high-precision thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Unlike pneumatic systems, its servo mechanism delivers superior pressure accuracy, repeatability, and response—ideal for sensitive or high-reliability bonding applications.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.
The OL-FS003 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.
This “lower-only” alignment approach offers simplicity and reliability for applications where FPC pads allow moderate placement tolerance.
A key differentiator of the OL-FS003 is its servo motor-driven press system, replacing traditional pneumatic cylinders. Benefits include:
This makes the OL-FS003 suitable for demanding sectors such as automotive displays, medical devices, and aerospace HMIs.
The machine includes two identical, fully independent stations arranged side by side. Each station features:
Operators can alternate between stations for continuous production, maximizing throughput in pilot lines or small-batch manufacturing.
The entire thermal and mechanical cycle is automated once initiated, ensuring repeatable results.
Heating is delivered via industrial cartridge heaters, monitored by high-accuracy sensors for stable thermal profiles.
An integrated buffer tape feed system protects the FPC during pressing:
All critical parameters—temperature, time, pressure profile—are configured via the HMI for process traceability.
Ideal for bonding:
Commonly deployed in Tier-1 automotive supply chains, certified electronics manufacturers, and R&D centers.
Olian Automatic provides full lifecycle support:
Model: OL-FS003
Type: Dual-Station Servo-Controlled FOG Main Bonding Machine
Key Innovation: Servo-driven press for precision pressure control
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
SEO Keywords:
Servo FOG bonding machine, OL-FS003, Olian Automatic servo-controlled FPC bonder, 7-inch dual-station FOG press with servo actuator, precision thermal compression bonder, lower-view alignment FOG machine, servo hot bar bonding system, main bonding machine for automotive displays, high-accuracy FPC to glass bonder, electric press FOG workstation.
The OL-FP003 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for temporary tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses short-duration pulse heating to lightly cure anisotropic conductive film (ACF), holding the FPC in place before final main bonding.
The machine assumes that ACF has already been pre-applied to the panel or FPC. It performs pre-bonding only—not full main bonding—and does not support IC, COF, or ACF lamination functions.
The OL-FP003 employs a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.
This “lower-only” method provides a simple, cost-effective solution for applications where moderate alignment accuracy is sufficient.
The machine features two identical, fully independent stations arranged side by side. Each includes:
Operators can alternate between stations for continuous workflow, improving efficiency in small-batch or R&D environments.
The cycle is semi-automatic—alignment is manual, but heating and pressing are controlled and repeatable.
Rapid-response cartridge heaters enable precise thermal pulses ideal for ACF tacking without over-curing.
An integrated buffer tape feed system protects the FPC during pressing:
All key parameters—temperature, time, pressure—are set via the HMI for consistent pre-bond quality.
Compact and robust, suitable for cleanrooms, pilot lines, and repair workshops.
Ideal for pre-bonding:
Commonly used in display assembly, prototyping labs, and low-volume production.
Olian Automatic provides comprehensive post-sale support:
Model: OL-FP003
Function: Manual Pulse Pre-Bonding Only
Max Panel Size: 7 inches (rigid glass)
Alignment: Lower-side microscope only
Key Advantage: Dual-station efficiency with simple, reliable pre-tacking
SEO Keywords:
Pulse bonding machine, OL-FP003, Olian Automatic FPC bonder, 7-inch dual-station bond press, lower-view alignment bonder, manual FOG tacking system, thermal pulse machine for ACF, FPC tacking equipment for LCD, economical bond workstation, fixed-platform pulse bonder.
The OL-F0715 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This model features an extended 150 mm press head, enabling bonding of wide FPCs or multiple connectors in a single stroke—ideal for automotive displays, industrial HMIs, and large-flex applications.
The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only, fully curing the ACF joint under controlled heat, pressure, and time. It does not apply ACF, nor does it support IC or COF chip bonding.
The OL-F0715 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation and experience.
This “lower-only” alignment approach is straightforward, robust, and well-suited for production environments where FPC pads are sufficiently large or where moderate alignment tolerance is acceptable.
A key differentiator of the OL-F0715 is its 150 mm long press head, significantly longer than standard 60 mm heads. This allows:
The head thickness is 1.0 mm, and custom dimensions are available upon request.
The machine includes two identical, fully independent stations arranged side by side. Each station features:
Operators can alternate between stations for continuous workflow, maximizing uptime in small-batch or pilot-line production.
The thermal cycle is fully automated once initiated, ensuring consistent results.
Heating is achieved via high-efficiency cartridge heaters, with temperature monitored by industrial-grade sensors for process stability.
An integrated buffer tape feed system protects the FPC during pressing:
All critical parameters—temperature, time, pressure—are configured via the HMI for repeatability across shifts.
The compact footprint integrates easily into cleanrooms or production lines.
Ideal for bonding:
Commonly used in automotive electronics, medical displays, and heavy-equipment HMI manufacturing.
Olian Automatic provides full lifecycle support:
Model: OL-F0715
Type: Dual-Station Manual FOG Main Bonding Machine
Key Feature: 150 mm extended press head
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
SEO Keywords:
150mm FOG bonding machine, OL-F0715, Olian Automatic wide-head FPC bonder, 7-inch dual-station FOG press with long hot bar, manual FPC to glass bonding equipment, extended press head FOG machine, thermal compression bonder for wide flex, lower-view alignment FOG workstation, main bonding machine for automotive displays, 150mm hot bar FOG system.
OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine with Lower-Side Fixed Alignment
The OL-F003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses lower-side visual alignment only, where operators view panel terminals from below through a single microscope while manually positioning the FPC from above.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to either the panel or the FPC. It performs main bonding only—fully curing the ACF joint under heat and pressure. It does not apply ACF, nor does it support IC or COF bonding.
Unlike dual-lens systems, the OL-F003 employs a single lower-view microscope. The operator places the panel on a transparent glass stage. They look through the microscope from below to see the panel’s terminal marks. Then, they manually place and adjust the FPC from above using visual estimation and experience.
This “lower-only” method is simple, cost-effective, and suitable for applications where ultra-high precision is not required or where FPC pads are large enough for manual placement tolerance.
The machine features two identical, fully independent bonding stations side by side. Each station includes:
Operators can work on one station while the other is idle, enabling continuous production. All loading, unloading, and alignment are performed manually at the front.
The entire bonding cycle is semi-automatic—alignment is manual, but pressing is controlled and repeatable.
Heating is delivered via embedded cartridge heaters, monitored by K-type thermocouples for stable thermal control.
An integrated buffer tape feed system protects the FPC during bonding:
All critical parameters—temperature, time, pressure—are set via the HMI for consistent results.
Compact footprint suits cleanrooms, pilot lines, and repair workshops.
Suitable for bonding:
Commonly used in:
Olian Automatic provides complete post-sale support:
Model: OL-F003
Type: Dual-Station Manual FOG Bonding Machine
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
Core Advantage: Simple, reliable, cost-effective manual bonding with dual-station throughput
SEO Keywords:
FOG bonding machine, OL-F003, Olian Automatic manual FPC bonder, 7-inch dual-station FOG press, single-microscope FOG machine, manual FPC to glass bonding equipment, thermal compression bonder for IN-CELL flex, fixed-alignment FOG workstation, economical FOG bonding system, main bonding machine with lower-side vision.
The OL-FP005 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for precise thermal tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system enables operators to perform high-accuracy pre-bonding—a critical step that temporarily fixes FPCs in place and final main bonding.
The machine assumes that anisotropic conductive film (ACF) has already been applied to the panel or FPC. It does not apply ACF, nor does it perform main bonding, IC attachment, or COF processing.
bonding ensures the FPC remains aligned during transfer to the main bonder. The OL-FP005 uses short-duration pulse heating to lightly cure the ACF without full compression—just enough to hold position. This is distinct from main bonding and requires lower energy and shorter time.
The OL-FP005 features two identical, fully independent stations arranged side by side. Each includes:
Operators can alternate between stations for continuous workflow, or two technicians can work simultaneously—doubling throughput in small-batch production or R&D environments.
Alignment is achieved through a dual-optical-path microscope that provides simultaneous views of the panel terminals (from below) and FPC pads (from above) on a single split-screen monitor.
Key optical specifications:
The operator places the panel on the lower stage and activates vacuum. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs, they shift the panel until fiducial marks align perfectly on screen—ensuring micron-level accuracy before pre-bonding.
After alignment, the operator initiates the cycle. The entire bonding platform automatically moves forward into the press zone. The heated head descends, applies a brief pulse of heat and light pressure, then retracts. The platform then returns backward to the original loading position—keeping the operator’s hands safely away from hot components during actuation.
Heating is delivered via high-response cartridge elements, enabling rapid thermal pulses ideal for pre-tacking ACF without over-curing.
The machine includes an automatic buffer tape feed system to protect the FPC during pressing:
Ideal for pre-bonding:
Commonly used in:
Olian Automatic provides full lifecycle support:
Model: OL-FP005
Function: Manual Pulse Pre-Bonding Only
Max Panel Size: 7 inches (rigid glass)
Key Innovation: Dual-lens upper-lower alignment + front-rear motion + dual stations
Operation: Manual alignment, semi-automatic pulse cycle
SEO Keywords:
Pulse bonding machine, OL-FP005, Olian Automatic FPC bonder, 7-inch dual-station bond press, manual FOG bonding equipment, upper-lower alignment bonder, split-screen vision bond machine, FPC tacking system for LCD, thermal pulse bonder for touch flex, dual-lens pre-alignment workstation.
OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine with Dual-Lens Upper-Lower Alignment
The OL-F006 by Olian Automatic is a high-precision manual FOG (Fpc-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Featuring dual independent workstations, this system enables efficient, repeatable bonding for small-batch production, pilot lines, and display repair applications.
Unlike standard bonders, the OL-F006 integrates simultaneous upper-lower optical alignment with front-rear platform motion, allowing operators to achieve micron-level accuracy through direct visual matching of panel and FPC fiducial marks—without automated vision software.
This machine performs final main bonding only. It assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the glass panel or the FPC. The OL-F006 does not apply ACF, nor does it support IC or COF bonding. Its sole purpose is the thermal curing of pre-aligned FPC-to-glass or touch-flex-to-glass assemblies.
The OL-F006 features two identical, fully independent bonding stations arranged side by side. Each station includes its own:
Operators can work on both stations alternately to maximize throughput, or two technicians can operate simultaneously. All loading, unloading, and alignment are performed manually at the front of the machine.
The heart of the OL-F006 is its dual optical path alignment system. Two high-resolution lenses—one viewing the panel from below, the other viewing the FPC from above—project real-time images onto a single split-screen monitor. This allows the operator to see both sets of alignment marks simultaneously.
Key optical specs:
The operator places the panel on the lower glass stage and activates vacuum hold. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs beneath the panel stage, they shift the glass until the panel marks align perfectly with the FPC marks on screen. This “upper-lower” visual method ensures high alignment fidelity without complex software calibration.
Once alignment is confirmed:
This front-rear motion keeps the operator’s hands safely away from the hot zone during pressing while maintaining ergonomic access during setup.
Heating is achieved via embedded cartridge heaters, with temperature monitored by industrial-grade sensors to ensure process stability.
The machine includes an integrated buffer tape feeding system to protect the FPC during bonding:
All critical parameters—temperature, time, pressure—are set and monitored via the HMI, ensuring consistent results across shifts and operators.
The compact footprint fits easily into most cleanroom or workshop environments.
Ideal for bonding:
Commonly used in:
Olian Automatic provides comprehensive post-sale support:
Model: OL-F006
Type: Dual-Station Manual FOG Main Bonding Machine
Max Panel Size: 7 inches (rigid glass)
Core Innovation: Upper-lower dual-lens visual alignment + front-rear platform motion
Operation: Manual alignment, semi-automatic bonding cycle
SEO Keywords:
Dual-station FOG bonding machine, OL-F006, Olian Automatic manual FPC bonder, 7-inch Film-on-Glass press with dual-lens alignment, upper-lower mark alignment system, front-rear motion FOG machine, manual FPC to glass bonding equipment, thermal compression bonder for touch flex, high-precision manual FOG workstation, split-screen vision FOG press.
OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine with CCD Alignment
The OL-C012C by Olian Automatic is a dual-station manual main bonding machine with CCD vision alignment. It performs final thermal compression bonding of bare ICs onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied to the panel. The operator places the IC roughly by hand. The built-in CCD system then enables fine visual alignment before main bonding.
The operator loads an ACF-pre-laminated panel onto either station.
They place the IC near the terminal area by hand.
Using the CCD display, they adjust the IC position visually for alignment.
After alignment, they press both start buttons with two hands.
The servo-driven hot bar descends automatically.
It applies heat, pressure, and time to complete the main bond.
The head retracts after cooling. The operator removes the panel.
Both stations can be used alternately by one operator or simultaneously by two.
Bonding temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: 0.1 to 99.0 seconds, adjustable
Pressure range: 20 N to 400 N, servo-regulated
Standard hot bar size: 40 mm × 4.0 mm (custom sizes available)
Heating elements: Φ9.5 × 70 mm cartridge heaters
Temperature sensing: K-type thermocouples
Control system: PLC + touchscreen interface
Manual backup: physical start and emergency stop buttons
Safety: dual-hand start prevents accidental activation
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approx. 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, Φ8 mm tubing
Designed exclusively for main bonding of bare driver ICs on:
This machine does not perform:
Its role is final IC/COF/FPC curing with visual alignment aid.
Model: OL-C012C
Type: Dual-Station Main Bonding Machine with CCD
Function: Final IC Thermal Bonding with Visual Alignment
Max Panel Size: 7 inches (rigid glass only)
Core Advantage: Combines manual flexibility with CCD-assisted precision
SEO Keywords:
CCD main bonding machine, OL-C012C, Olian Automatic IC bonder with vision, 7-inch dual-station hot bar press, servo main bonder with CCD alignment, COG final bonding equipment, thermal compression machine for LCD IC, manual IC aligner with camera, rigid display main bonding system, hot bar bonder with visual alignment.
OL-C012 – 7-Inch Dual-Station Servo Main Bonding Machine
The OL-C012 by Olian Automatic is a dual-station manual main bonding machine. It performs final thermal compression bonding of ICs/COF/FPC onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied and ICs have been pre-aligned on the panel. The machine executes only the main bonding (final curing) step.
The operator places an ACF-pre-laminated LCD with pre-positioned IC onto either station.
They press a vacuum button to secure the panel.
Then they press both start buttons with two hands.
The servo-driven bonding head descends smoothly.
It applies precise heat, pressure, and time to fully cure the bond.
After cooling, the head retracts automatically.
The operator removes the bonded panel manually.
Both left and right stations operate independently. Two operators can work simultaneously, or one operator can alternate between stations.
Bonding head temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: adjustable from 0.1 to 99.0 seconds
Pressure range: 20 N to 400 N, controlled by servo motor
Standard head size: 40 mm × 4.0 mm (custom sizes available)
Heating uses high-efficiency Φ9.5×70 mm, 220V, 220W cartridge heaters.
Temperature is monitored by K-type thermocouples.
Machine frame: industrial-grade steel
Control system: servo motor + PLC logic
Safety features: dual-hand start buttons, emergency stop switch
All manual operations occur at the same front position for ergonomic workflow
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approximately 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, tubing Φ8 mm
Designed exclusively for main bonding of bare ICs on:
Not suitable for pre-bonding.
This machine does not include:
It is a dedicated main bonder for final IC curing only.
Includes one-year warranty (excluding wear parts like heating tubes).
On-site service within 72 hours if phone support fails during warranty.
One day of training covers installation, operation, parameter setup, and maintenance.
Lifetime remote technical support is provided.
Model: OL-C012
Type: Dual-Station Manual Main Bonding Machine
Function: Final IC Thermal Compression Only
Substrate: Rigid Glass Panels (≤7 inches)
Core Tech: Servo-controlled pressure, precise thermal management
SEO Keywords:
Servo main bonding machine, OL-C012, Olian Automatic IC bonder, 7-inch dual-station hot bar press, manual main bonding for COG, thermal compression machine for LCD IC, final curing bonder for rigid displays, servo-controlled hot bar system, IC main bonding equipment, COG main bonder without vision.
