The EC-600 is a highly efficient fully automatic LCD terminal cleaning machine designed to perform wiping, cleaning, and plasma treatment for LCD products of various sizes (from 20mm x 20mm to 150mm x 90mm). This advanced machine can be integrated with other devices in a production line, making it a valuable addition to modern manufacturing environments where precision and speed are critical.
The EC-600 operates through a series of automated processes. It starts with manual placement of the LCD onto a platform or conveyor belt. Robotic arm 1# picks up the LCD, corrects its position using the CCD (Charge-Coupled Device) system, and places it on the wiping platform. The platform then moves the LCD to the cleaning head for cleaning. After wiping, robotic arm 2# transports the LCD to a plasma cleaning platform for further cleaning. Finally, the cleaned LCD is moved to a discharge station.
In summary, the EC-600 Fully Automatic LCD Terminal Cleaning Machine represents a significant advancement in LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.
The CB-600 is a cutting-edge fully automatic COG (Chip on Glass) bonder designed to meet the precise requirements of modern electronics manufacturing. This advanced machine specializes in automatic ACF (Anisotropic Conductive Film) application, pre-bonding, and main bonding processes for LCD products ranging from 1″ to 6.5″ in size, with single-sided, single IC components. Its innovative design and high-precision features make it an essential tool for manufacturers seeking efficiency, accuracy, and reliability in their production lines.
The CB-600 operates through a series of coordinated mechanical and automated processes. The workflow begins with the loading of the product onto the conveyor belt or platform, either manually or via an automated upstream machine. Mechanical arm 1# picks up the product, corrects its position using the CCD (Charge-Coupled Device) system, and places it on the ACF platform. The ACF platform advances, and the bonding head descends to apply the ACF. After the ACF application, the platform retracts for position detection to ensure proper ACF adhesion. Mechanical arm 3# then picks up the LCD, checks the ACF adhesion, and places it on the pre-bonding stage. Meanwhile, the IC is loaded, and the automatic feeding system visually corrects the IC position. After pre-alignment, the IC is moved to the bonding head position, and the bonding head picks it up for pre-bonding. Mechanical arm 4# moves the product to one of the three main bonding platforms for final bonding. Finally, mechanical arm 5# transfers the bonded product to the downstream conveyor or production line.
In summary, the CB-600 Fully Automatic COG Bonder represents a significant advancement in the field of LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.
The FB-600 Fully Automatic FOG (Film on Glass) Bonder is a cutting-edge device designed for the manufacturing of LCD products. This machine is specifically tailored for 1″-6.5″ vertical screen LCD products, handling single-edge, single-segment ACF (Anisotropic Conductive Film) attachment, pre-bonding, and main bonding processes. It can be integrated with other production line equipment for seamless manufacturing operations.
The FB-600 operates through a series of coordinated mechanical and automated processes:
In summary, the FB-600 Fully Automatic FOG Bonder represents a significant advancement in the field of LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.
5-17.3″ Mid-Size Display Module Automation Solution: LOAD/EC/COG/FOG/FPC Feeding System
This document presents a comprehensive automation solution for the production of mid-size display modules (5-17.3 inches), focusing on the integration of various equipment for high-precision and high-efficiency manufacturing. The solution includes panel loading, terminal cleaning, COG (Chip on Glass) and FOG (FPC on Glass) bonding, as well as FPC (Flexible Printed Circuit) feeding. Each component is designed to work seamlessly with others to ensure smooth production flow and superior product quality.
This automation solution for mid-size display modules offers a comprehensive approach to efficient and precise manufacturing. By integrating advanced technologies and equipment, it ensures high yield, superior quality, and cost-effectiveness, making it ideal for modern display production environments.
TFT displays manufacturing glass cutting laminating bonding dispensing assembling testing packing processes detailed introduction to each process and equipment situation:
Glass loading is the process of placing the cut glass substrates into designated fixtures or carriers to prepare them for subsequent processes such as electronic cleaning and bonding. It ensures the glass substrates are properly positioned and secured for further processing.
The glass loading machine is designed to handle glass substrates with care. It has a precise positioning system to place the glass substrates into the fixtures accurately. The machine may also feature automated arms or conveyors to transport the glass substrates efficiently while minimizing manual handling and potential damage.
Electronic cleaning is used to remove contaminants such as dust, organic residues, and ions from the surface of the glass substrates or polarizing plates. This helps improve the bonding quality and reliability in subsequent processes, preventing issues like poor adhesion or electrical shorts.
The electronic cleaning machine typically uses a combination of ultrasonic waves, deionized water, and chemical cleaning agents to thoroughly clean the glass substrates or polarizing plates. It has a closed cleaning chamber to prevent re – contamination and a drying system to quickly dry the cleaned substrates after cleaning.
The driver IC is directly bonded to the glass substrate of the TFT – LCD panel. This process is characterized by high precision and small bonding area, offering advantages such as fast production speed and good electrical performance.
Equipment – COG Bonding Machine: The COG bonding machine uses a high – precision alignment system to accurately position the driver IC relative to the glass substrate. Its heating and pressing mechanism ensures a stable connection between the driver IC and the glass substrate. The machine also has a vision system for precise alignment and a temperature – and – pressure control system to ensure bonding quality.
The driver IC is first bonded to a flexible film and then connected to the TFT – LCD panel. It offers better flexibility and reliability, suitable for lightweight and thin display devices.
Equipment – FOG Bonding Machine: The FOG bonding machine is designed to handle flexible films and perform high – precision bonding. It has a complex structure and advanced to technology ensure reliable connections between the driver IC and the panel. Its alignment system accurately positions the flexible film and driver IC on the panel.
After the bonding process, automated optical inspection is used to detect defects in the bonding quality, such as misalignment, missing bonds, and insufficient bonding. This helps to promptly identify and correct bonding issues, improving production yield.
Equipment – Bonding AOI Machine: The bonding AOI machine uses high – resolution cameras and advanced image processing software to capture images of the bonding area and compare them with the standard template. It can accurately detect various bonding defects and has a fast inspection speed, capable of meeting the high – speed production requirements of the production line.
Adhesive is applied to the bonding area to enhance bonding the strength and reliability between the driver IC and the panel. The glue dispenser must ensure precise glue – dispensing quantity and uniform glue – dispensing.
Equipment – Glue Dispensing Machine: The glue dispensing machine has a high – precision dispensing system that can accurately control the glue – dispensing quantity and pattern. Its dispensing nozzle can move precisely to dispense adhesive on the designated bonding area. The machine can also adjust the glue – dispensing parameters according to different adhesives and bonding requirements.
This process applies an under – layer adhesive to the bonding area to further enhance the bonding strength and reliability. It also helps to prevent moisture and impurities from invading the bonding area, improving the product’s stability and reliability.
Equipment – ULD Machine: The ULD machine is similar to the glue dispensing machine in structure but specializes in applying under – layer adhesives. It can accurately dispense under – layer adhesives on the bonding area and has a heating and curing system to rapidly cure the adhesive, improving production efficiency.
