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Tag Archive FPC to LCD bonding equipment

OL-FD006 – 7-Inch Single-Station Manual FOG Bonding Machine with Dual-Lens up and down Alignment

OL-FD006 – 7-Inch Single-Station Manual FOG Bonding Machine

OL-FD006 – 7-Inch Single-Station Manual FOG Bonding Machine with Dual-Lens up and down Alignment

The OL-FD006 by Olian Automatic is a single-station manual FOG (Film-on-Glass) bonding machine. It bonds flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches.

This system is designed for high-precision alignment and thermal bonding. It assumes ACF has been pre-applied to the panel or FPC. The machine does not support COF (Chip-on-Flex) bonding.

Alignment System

The unit uses a dual-lens optical system. Operators view panel and FPC marks simultaneously on one screen.
Magnification is 2×. Field of view per lens is 1.9 mm × 1.4 mm.
Lens spacing adjusts from 12 mm to 90 mm to match different mark layouts.
Coaxial LED lighting ensures clear, shadow-free imaging.
Operators manually adjust the panel’s X and Y position using knobs for precise alignment.

Bonding Process

The operator places the panel on the lower stage and activates vacuum hold.
They then place the FPC on the upper stage.
After visual alignment via the display, they press both start buttons with two hands.
The bonding head descends automatically. It applies heat, pressure, and holds for a set time.
Temperature reaches up to 300°C with uniformity within ±5°C.
Pressure ranges from 25 N to 400 N. Time is adjustable from 0.1 to 99.0 seconds.
After bonding, the head retracts. The stage returns to load position. The operator removes the product.

Buffer Tape Handling

The machine includes an automatic buffer tape feed system.
Tape roll inner diameter: ≥33 mm. Outer diameter: ≤80 mm.
Feed pitch: 1–20 mm.
If feeding fails, the system triggers an alarm.

Design & Operation

One operator handles all loading and unloading at the same position.
The machine features a PLC controller and color touchscreen.
Standard bonding head size is 60 mm × 1.0 mm, but custom sizes are available.
Machine dimensions: 830 mm (W) × 900 mm (D) × 1340 mm (H). Weight: ~320 kg.
Power: 220V AC, 2000W. Air: 0.5–0.7 MPa, 250 L/min.

Applications

Ideal for bonding:

  • FPCs for small displays
  • ON-CELL and IN-CELL touch flexes
  • Rigid PCB-to-flex connections

Not suitable for bare ICs or standard COF modules.

Support

Includes one-year warranty (excluding wear parts).
On-site service within 72 hours if phone support fails.
One-day training covers operation, alignment, parameter setup, and maintenance.
Lifetime remote technical support is provided.


Model: OL-FD006
Function: FPC and Touch Flex Bonding Only
Excludes: COF, IC, ACF lamination, EC cleaning
Key Feature: Dual-lens split-screen manual alignment

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