Tag Archive ESD-safe FPC bonding workstation

OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Long Press Head

High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.

Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.

⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.

Bonding Principle & Operational Workflow

The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:

1. PCB Loading:
   The operator places the bare rigid PCB onto the vacuum-equipped worktable.
2. PCB Fixturing:
   By pressing the vacuum button (Φ24 mm), the PCB is held flat and immobile during subsequent steps.
3. FPC Placement:
   The ACF-pre-laminated FPC—often supported by a temporary glass carrier for rigidity—is manually positioned over the PCB bonding area and roughly aligned.
4. FPC Fixturing:
   Vacuum is activated to gently secure the FPC/glass assembly in place.
5. Manual Visual Alignment:
   The operator observes the terminal overlap through an external monitor (implied imaging system) and fine-tunes the FPC position by hand to ensure proper registration.
6. Bond Initiation:
   The operator presses two start buttons simultaneously (dual-hand safety interlock). The platform then:
   • Automatically advances forward to the designated bonding position
   • The long press head descends vertically
   • Heat and pressure are applied for the preset duration
   • Upon completion, the head retracts automatically
7. Unloading:
   The bonded assembly is removed manually, and the cycle repeats.

This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.

Key Technical Specifications

• Maximum Substrate Compatibility: Supports PCBs up to 15.6-inch diagonal (exact dimensions defined by worktable)
• Press Head:
  • Standard length: 200 mm × 2.0 mm (long profile for wide or multi-row coverage)
  • Customization: Available per customer drawing for non-standard layouts
• Temperature Control:
  • Press head range: Room temperature to 400°C
  • Surface uniformity: ≤ ±8°C across the entire 200 mm length
  • Back pressure plate: RT to 150°C, uniformity ≤ ±5°C (provides counter-support to prevent PCB warpage)
• Bonding Time: Adjustable from 0.1 to 99.9 seconds
• Bonding Force: 55 N to 1000 N, pneumatically regulated for repeatable contact pressure
• Heating System:
  • Cartridge heaters: Φ9.5 mm × 45 mm embedded in the head
  • Temperature feedback: K-type thermocouples for closed-loop PID control

Control, Safety & ESD Protection

• Operator Interface: Color touchscreen HMI for setting time, temperature, and monitoring status
• Start Mechanism: Dual Φ24 mm push buttons requiring simultaneous press—ensures hands are clear during actuation
• Emergency Stop: Φ22 mm mushroom-type EMO switch that cuts power to motion systems and enables manual platform override
• Visual/Audible Alarms:
  • Three-color signal tower (green = ready, yellow = running, red = fault)
  • Buzzer for error alerts
• ESD Safeguards:
  • All surfaces in contact with PCB/FPC use anti-static materials
  • Static voltage on panel surface maintained < ±100 V
  • Static decay performance: 1000 V → 100 V in ≤4 seconds
  • Grounding resistance: ≤5 Ω
  • Wrist strap sockets provided at material handling stations

These measures ensure compatibility with sensitive electronic assembly environments.

Mechanical Design & Utility Requirements

• Frame: Heavy-duty steel construction with precision linear guides for smooth platform motion
• Motion System: Servo-driven stage for accurate front-back positioning
• Power Supply: Single-phase 220V AC, typical power draw ~2.5–3.5 kW (inferred from heater count and temp range)
• Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa, clean and dry)

Applications

Ideal for bonding:

• High-pin-count FPCs on large LCD/OLED display driver PCBs
• Multi-row connector interfaces in automotive infotainment systems
• Industrial control panels with extended flex tails
• Medical imaging device backplanes requiring full-length terminal adhesion

Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.

Important Clarifications

• Single-side bonding only: FPC is bonded to one edge of the PCB
• Manual alignment: No auto-vision or motorized X/Y correction—alignment is operator-performed under monitor guidance
• ACF must be pre-applied: Machine assumes ACF is already laminated on PCB or FPC
• Designed for rigid PCBs, not glass substrates (unlike FOG machines)
• Long press head: Enables single-stroke bonding of extended zones but requires sufficient clearance for the 200 mm head

Training, Warranty & After-Sales Support

Olian Automatic provides end-to-end support:

• Documentation: One Chinese-language operation manual included
• On-Site Training: One full day covering:
  • Machine installation and leveling
  • Parameter setup (temp/time/force calibration)
  • Routine maintenance and heater/thermocouple replacement
  • Troubleshooting common alarms and errors
• Warranty: 12 months on mechanical and electrical components under normal operating conditions
  • Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure events
• Service Commitment:
  • Remote diagnostics via phone or email
  • On-site engineer dispatch within 72 hours if remote resolution fails during warranty period
  • Lifetime technical support available post-warranty

Standard Included Components

• Custom long press head (200 mm × 2.0 mm)
• K-type thermocouples and Φ9.5 mm cartridge heaters
• Φ24 mm vacuum and dual start buttons
• Φ22 mm emergency stop switch
• Set of national-standard (GB) maintenance tools

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Model: OL-FFB-156L
Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Advantage: Single-stroke bonding of extended or multi-row terminal zones
Operation: Manual load/align → dual-hand start → auto advance & press → manual unload

Target Industries: Display module manufacturing, automotive electronics, industrial automation, medical devices

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