In the competitive landscape of display and electronics manufacturing, precision, speed, and flexibility are critical. OLIAN ( bonding-machine.com) stands as a leading provider of automatic bonding solutions. Catering to a wide range of applications from small wearable devices to large automotive displays, OLIAN’s product lineup—from the 600 Series to the advanced 6000 Series—ensures high efficiency and reliability on the production floor.
For manufacturers requiring robust solutions for standard display sizes, the 600 Series and 800 Series offer an excellent balance of performance and value.
As product complexity increases, the 900 Series and 1500 Series provide enhanced capabilities for larger formats and integrated processes.
For the most demanding production environments, OLIAN presents the 2000 Series and 3000 Series, representing the pinnacle of their technology.
Now available, the 6000 Series enhances the capabilities of the 3000 Series by introducing dual-station handling. This next-generation line effectively doubles the throughput for high-volume manufacturing of large displays, ensuring OLIAN remains at the forefront of automation technology.
Whether you are assembling small wearable screens or large automotive displays, the OLIAN range of bonding machines offers a tailored solution. From the speed-optimized 600 Series to the highly flexible 2000 Series and the high-throughput 6000 Series, these machines are built to ensure precision, efficiency, and reliability in your 2026 production line and beyond.
OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,
High-Precision Thermal Compression System for Final IC Bonding on LCD Panels
The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.
Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.
⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.
💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.
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In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.
COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel
. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices
. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.
COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces
. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices
. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing
.
COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays
. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices
.
FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices
. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications
.
FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics
. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes
.
FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays
. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.
ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG
. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines
.
TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities
. These machines are ideal for applications requiring high-density interconnections and compact designs
.
FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications
. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics
.
In addition to the above technologies, we also offer specialized bonding machines for various applications, including:
Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:
Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.
