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Tag Archive COF pickup and bond equipment

OL-COF003 – 7-Inch Medium-Speed Semi-Automatic Pre-Bonding Machine for IC and COF

OL-COF003 – 7-Inch Medium-Speed Semi-Automatic Pre-Bonding Machine for IC and COF

OL-COF003 – 7-Inch Medium-Speed Semi-Automatic Pre-Bonding Machine for IC and COF

OL-COF003 – 7-Inch Medium-Speed Semi-Automatic Pre-Bonding Machine for IC and COF
OL-COF003 – 7-Inch Medium-Speed Semi-Automatic Pre-Bonding Machine for IC and COF

The OL-COF003 by Olian Automatic is a medium-speed semi-automatic pre-bonding machine. It bonds ICs or COFs onto ACF-pre-applied panels. The system supports both rigid glass and flexible displays up to 7 inches.

This machine is designed for high-precision alignment and thermal pre-compression. Operators load and unload panels manually. All other steps—IC/COF pickup, vision alignment, and pre-bonding—are automated.

Key Functions

The OL-COF003 handles two main workflows: IC pre-bonding and COF pre-bonding.

For IC bonding, the operator loads IC trays (2-inch, 3-inch, or 4-inch). The machine uses a servo motor, lead screw, and linear guide to move the IC stage. A vacuum nozzle picks up the IC. A dedicated jig corrects IC position from both sides. The head then moves down for CCD imaging of IC marks. After vision alignment with the panel mark, the machine performs pre-bonding automatically.

For COF bonding, the operator places COF on a PEEK adsorption platform. The COF stage is driven by a cylinder for left-right motion. Vacuum holds the COF in place. A quartz back-pressure unit ensures flatness during pickup. The bonding head adsorbs the COF, retracts the stage, and moves down for CCD imaging. The system then aligns the COF with the panel and completes pre-bonding.

Panel loading is manual. The operator places the panel on the stage and presses a vacuum button. The stage then moves automatically to the alignment position. After bonding, it returns to the loading position for easy removal.

Technical Performance

Temperature control ranges from room temperature to 150°C. Surface uniformity stays within ±5°C.
Bonding time is adjustable from 0.1 to 99.0 seconds.
Pressure is precisely controlled between 20 N and 120 N.

The machine uses industrial-grade components for reliability. It includes safety interlocks and user-friendly controls.

Physical & Utility Specs

The unit measures 650 mm wide, 660 mm deep, and 1340 mm tall. It weighs about 230 kg.
It runs on single-phase 220V AC at 1500W.
Compressed air must be 0.5–0.7 MPa with a flow rate of 450 L/min, using 8 mm tubing.

Applications

Ideal for small-batch production, pilot lines, and R&D.
Supports:

  • Rigid LCD panels with IC or COF
  • Flexible displays with IC or COF

Note: ACF must be pre-applied before use. This machine does not apply ACF.

Support & Training

Olian Automatic provides one year of warranty (excluding wear parts).
On-site service is available within 72 hours if phone support fails.
One day of training covers setup, operation, troubleshooting, and part replacement.
Lifetime technical support is included.


Model: OL-COF003
Type: Semi-Automatic Pre-Bonding Machine
Max Panel Size: 7 inches
Processes: IC Pre-Bonding, COF Pre-Bonding
Substrates: Rigid Glass, Flexible Displays
Operation: Manual panel load/unload; automatic alignment and bonding


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