OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,
High-Precision Thermal Compression System for Final IC Bonding on LCD Panels
The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.
Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.
⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.
🔧 Key Technical Specifications
Substrate & Component Compatibility
Panel Size:
Max: 350 mm × 250 mm (~15.6″ diagonal)
Min: 150 mm × 80 mm (~7″)
Thickness: 0.2 – 2.2 mm
IC Dimensions:
Length: 5 – 40 mm
Width: 0.5 – 3 mm
Thickness: 0.08 – 0.5 mm
Bonding Zones: Supports up to 10 segments along a single edge (multi-zone sequential bonding)
Bonding Performance
Heating System:
Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods
Temperature Range: Room temperature to 400°C
Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
Servo-driven actuator for ultra-stable force output
Pre-placed IC (from pre-bond station) is positioned over the bonding zone.
Operator initiates cycle via start button.
Servo press head descends with precise force, applies heat for preset duration.
Upon completion, head retracts; operator unloads the fully bonded panel.
For multi-segment panels, the process repeats at each IC location.
💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.
📏 Machine Physical Data
Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Operating Environment:
Cleanroom required (ISO Class 8 or better)
Temperature: 22–27°C
Humidity: 40–70% RH
🛡️ Quality Assurance & Support
Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
Machine installation and calibration
Parameter optimization for different IC types
Troubleshooting common faults (e.g., poor adhesion, pressure deviation)
Replacement of wear parts (heaters, thermocouples, buttons)
Warranty: 12 months on mechanical and electrical systems under normal use
Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure
After-Sales Service:
Lifetime technical support
On-site engineer within 72 hours if remote assistance fails during warranty
✅ Included Standard Components
Custom IC bonding head (tooling per customer drawing)
Φ9.5 × 70 mm cartridge heaters
K-type thermocouples for temperature feedback
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit
🔖 Model Summary
Model: OL-CBD156
Function: Single-station, single-head IC main bonder for COG process
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