OL-ECB800 Automatic EC & COG Bonding Machine: Dual-Process Precision Bonding

The OL-ECB800 Automatic EC & COG Bonding Machine is a fully automated in-line system. It is engineered for high-precision EC and Chip-on-Glass (COG) bonding processes.

Manufactured by Olian Automatic in Shenzhen, China, the OL-ECB800 ensures quality in display manufacturing. It automatically performs ACF attachment, IC pre-bonding, and main bonding with exceptional accuracy.

Why Choose the OL-ECB800 Automatic EC & COG Bonding Machine?

The OL-ECB800 Automatic EC & COG Bonding Machine excels in small to medium-sized display bonding. Its integrated process ensures superior connection quality and high throughput.

• Wide Product Compatibility: Bonds 1″ to 6.5″ vertical screen LCDs. Handles products from 20x20mm to 150x90mm.
• High Bonding Precision: Achieves pre-bonding accuracy of ±3um. Main bonding accuracy is ±5um.
• Fast Production Speed: Tact time is 3.5 seconds for products under 4 inches. It is 4.2 seconds for 4-6.5 inch products.
• High Equipment Yield: Maintains an equipment yield rate of ≥99.5%. Excludes material-related defects.
• Quick Changeover: New model setup takes ≤60 minutes. Returning models take only ≤30 minutes.
• Comprehensive Process: Integrates ACF attachment, pre-bonding, and main bonding. Provides complete EC & COG solution.
• Flexible ACF Handling: Supports 2 or 3 layer tape. ACF width from 0.5 to 5.0mm.
• Automated Operation: Can be used in-line with other equipment. Requires no fixed operator for continuous production.

Advanced EC & COG Bonding Technology

The OL-ECB800 features a sophisticated multi-stage bonding system for reliable IC connection. It combines precise ACF attachment with accurate pre-bonding and main bonding.

Bonding Process:

• ACF Attachment: Uses automatic half-cutting for precise ACF length. Attaches ACF with X: ±0.2mm, Y: ±0.15mm accuracy.
• Pre-bonding: Employs a single thermode for temporary IC bonding. Achieves ±3um bonding precision.
• Main Bonding: Utilizes 3 thermodes for final IC bonding. Ensures ±5um bonding accuracy.

Vision & Control System:

• Image Processing: Uses Boxi (博视) vision system for alignment.
• CCD Cameras: Multiple cameras for LCD correction and pre-bonding alignment.
• PLC Control: Keyence PLC for reliable system control.
• HMI: Weintek touchscreen with Chinese interface for operation.

Handling System:

• Robotic Arms: Four robotic arms with linear motors for X-axis movement.
• Vacuum System: Digital vacuum gauges for monitoring suction pressure.
• Stage: Aluminum platform with anodized hard oxidation treatment.

Optimized Workflow

The OL-ECB800 automates the complex process of EC & COG bonding. The system uses multiple robotic arms for precise product handling between stations.

The Optimized Workflow:

1. Loading: Product is loaded from conveyor or upstream equipment.
2. Transfer 1: Robotic Arm #1 moves product to ACF platform.
3. ACF Attachment: ACF is cut and attached to the LCD terminal.
4. Transfer 2: Robotic Arm #2 moves product to pre-bonding stage.
5. Pre-bonding: IC is pre-bonded to the ACF-attached terminal.
6. Transfer 3: Robotic Arm #3 moves product to main bonding stage.
7. Main Bonding: IC is finally bonded with 3 thermodes.
8. Unloading: Robotic Arm #4 moves product to output conveyor.

The entire process is controlled by a reliable Keyence PLC system. The Weintek HMI provides intuitive operation and parameter setting.

Robust Engineering & Safety Features

Built for demanding production environments, the OL-ECB800 incorporates high-quality components and comprehensive safety systems.

Key Technical Specifications:

• Machine Dimensions: 2100(L) x 1260(W) x 1800(H) mm.
• Machine Weight: Approximately 2200kg.
• Machine Color: White paint, customizable colors available.
• Working Height: 1000mm for ergonomic operation.

Component Brands:

• PLC: Keyence (Japan)
• HMI: Weintek (China)
• Servo Motors: Ruitai (China)
• Linear Motors: Dongxin (China)
• Screws & Rails: THK (Japan), HIWIN/TBI (China)
• Pneumatics: SMC (Japan), Airtac (China), Fujikura (Japan)
• Vision System: Boxi (China)
• Sensors: Moons’ (China)
• Power Supply: Mean Well (China)
• Cable Carrier: Igus (Germany)

Safety Systems: The machine includes an interlock design with warning labels on hazardous areas. Emergency stop buttons have protective covers to prevent accidental activation. Door opening during operation triggers machine pause. Three-color signal tower provides visual status alerts.

Environmental Requirements: The machine requires a Class 1000 or better cleanroom environment. Operating temperature and humidity should be controlled for optimal performance.

Power & Air Requirements:

• Power: 1Phase AC220V±10%, 50Hz, 6KW max
• Compressed Air: 0.5-0.7MPa, ≈150 L/min
• Vacuum: Built-in pump (200L/min) or customer supply (≥-70Kpa)

Warranty and Service: Olian Automatic provides a 1-year warranty with lifetime technical support for all equipment. We provide comprehensive on-site installation, debugging, and operator training to ensure your team can achieve optimal results from day one. For spare parts and service inquiries, please [Contact Us] or visit our [Service Page].

Why Choose Olian Automatic for Your Bonding Needs?

Olian Automatic is a trusted manufacturer of display manufacturing equipment headquartered in Shenzhen, China. With extensive experience in automation, we serve display manufacturers worldwide. Our equipment is designed in ISO-certified facilities and shipped to over 30 countries across Asia, Europe, and North America. Visit our [About Us] page for more information about our company. Explore our [Product Lines] for complete display manufacturing solutions.

Sustainability Commitment: The OL-ECB800 is designed for energy efficiency. Its optimized bonding process reduces power consumption. The machine also features low-noise operation and uses environmentally friendly materials in compliance with RoHS standards.

FAQ

Q: What is an Automatic EC & COG Bonding Machine?
A: It is an automated system that performs ACF attachment, pre-bonding, and main bonding for LCD displays.

Q: What products can the OL-ECB800 bond?
A: The OL-ECB800 bonds 1″ to 6.5″ vertical screen LCDs from 20x20mm to 150x90mm.

Q: What is the bonding precision of the OL-ECB800?
A: Pre-bonding accuracy is ±3um, and main bonding accuracy is ±5um.

Q: What is the production speed of the OL-ECB800?
A: The tact time is 3.5 seconds for products under 4 inches.

Q: How long is the warranty period?
A: Olian Automatic provides a 1-year warranty with lifetime technical support for all equipment.

Q: How long does product changeover take?
A: New model setup takes ≤60 minutes, while returning models take only ≤30 minutes.

Q: What type of environment is required for the OL-ECB800?
A: The machine requires a Class 1000 or better cleanroom environment.

Q: Does the machine have a built-in vacuum system?
A: Yes, it has a built-in vacuum pump (200L/min) or can use customer supply.

Upgrade your display bonding process with the OL-ECB800, the Automatic EC & COG Bonding Machine that combines ACF attachment, pre-bonding, and main bonding for superior results.

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Product Tags

Automatic EC & COG Bonding Machine, EC Bonding, COG Bonding, ACF Attachment, Pre-bonding, Main Bonding, Olian Automatic, Display Manufacturing Equipment, Shenzhen Automation Equipment, LCD Bonding, IC Bonding, Automated Bonding System, OL-ECB800