Precision Automated System for Anisotropic Conductive Film Lamination on Large LCD Panels
The OL-A156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic ACF (Anisotropic Conductive Film) applicator engineered for high-accuracy lamination of ACF tape onto single-edge bonding zones of large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in COG/FOG (Chip-on-Glass / Film-on-Glass) display assembly processes, this machine ensures consistent ACF placement, tension control, and pre-compression—laying the foundation for reliable electrical interconnects in subsequent bonding stages.
Unlike manual taping or full-auto systems, the OL-A156 strikes an ideal balance between operator-guided flexibility and automated precision, making it perfect for medium-volume, high-mix production environments such as automotive displays, industrial HMIs, medical monitors, and premium consumer electronics.
⚠️ Note: This machine only applies ACF tape—it does not perform COF/IC bonding, vision alignment, or double-side processing.
The system supports multi-segment ACF application along a single edge—ideal for panels with multiple COF/IC attachment zones.
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OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine
Precision Thermal Alignment System for COF/IC to LCD Panel Assembly
The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.
Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.
⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.
Cycle time is typically under 20 seconds, depending on operator skill and product complexity.
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OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Long Press Head
High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly
The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.
Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.
⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.
The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:
This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.
These measures ensure compatibility with sensitive electronic assembly environments.
Ideal for bonding:
Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.
Olian Automatic provides end-to-end support:
Model: OL-FFB-156L
Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Advantage: Single-stroke bonding of extended or multi-row terminal zones
Operation: Manual load/align → dual-hand start → auto advance & press → manual unload
Target Industries: Display module manufacturing, automotive electronics, industrial automation, medical devices
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OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Short Press Head,
Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly
The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.
Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.
⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.
The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.
The operator-driven workflow is as follows:
This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.
These features ensure safe operation in ESD-sensitive electronics environments.
Ideal for bonding:
Commonly used where localized, high-force thermal compression is needed on rigid-flex assemblies.
Olian Automatic provides full lifecycle support:
Model: OL-FFB-156S
Type: Semi-Automatic Single-Side Multi-Zone FOB Bonder
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Feature: Front-back sequential bonding with short press head
Operation: Manual load/align → dual-hand start → auto press cycle → manual unload
Target Industries: Display module assembly, automotive electronics, industrial automation, medical device manufacturing
SEO Keywords:
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OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine
Integrated Solvent Wiping + In-Situ Plasma Activation System for High-Reliability Display Bonding
The OL-QX17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic, single-station cleaning system engineered specifically for the pre-bond surface preparation of edge-conductive (EC) terminals on rigid LCD panels up to 15.6 inches in diagonal size. It addresses one of the most critical failure points in display module manufacturing—poor ACF (Anisotropic Conductive Film) adhesion—by delivering a dual-stage cleaning process: precision solvent-based mechanical wiping followed immediately by low-temperature atmospheric plasma activation.
Unlike simple cloth-wipe stations or standalone plasma cleaners, the OL-QX17 integrates both technologies into a single, synchronized motion cycle, ensuring that the freshly wiped surface is activated before recontamination can occur—a key factor in achieving consistent, high-yield bonding in automotive, medical, and industrial display applications.
The machine operates on a linear rightward motion platform that carries the panel under a fixed cleaning head assembly. The full cycle is as follows:
The entire sequence takes approximately 8–15 seconds, depending on panel length and settings.
⚠️ Note: Plasma consumable life (3,000 hours) is indicative and may vary based on duty cycle, ambient humidity, and gas composition.
While the specification does not include test data, typical outcomes of this dual-stage process include:
These improvements are especially critical for automotive displays, where thermal cycling and long-term reliability demand pristine terminal surfaces.
The OL-QX17 is ideal for:
It is not suitable for:
Olian Automatic provides comprehensive lifecycle support:
Model: OL-QX17
Function: Single-side terminal cleaner with integrated wiping + plasma
Max Panel Size: 15.6-inch diagonal rigid LCD
Throughput: ~200–300 panels/hour (operator-dependent)
Core Innovation: Synchronized wiping-plasma sequence prevents recontamination
Target Industries: Automotive displays, industrial HMIs, medical monitors, aerospace electronics
SEO Keywords:
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OL-CC006 – Fully Automatic Offline COF Trimming Machine with Vision-Guided Die Alignment
The OL-CC006 by Olian Automatic is a fully automatic offline trimming machine designed for high-precision die-based cutting of Chip-on-Film (COF) modules. Unlike manual trimmers, it integrates a machine vision system to automatically align the COF to the cutting die before each stroke—ensuring consistent trimming accuracy even with part placement variation.
This machine is used exclusively for post-bonding mechanical finishing. It does not perform bonding, ACF application, or electrical testing, and operates as a standalone workstation.
The core innovation of the OL-CC006 is its integrated vision subsystem for precise registration:
The system captures alignment marks on the COF, calculates positional offset, and either guides the operator or triggers auto-correction (as per configured workflow). This significantly improves trimming yield compared to purely mechanical fixturing.
The entire process—from vision check to cut—is automated after initial loading.
This enables seamless handoff to inspection or packaging stations.
All vision parameters, indexing distance, and cycle settings are configurable through the touchscreen.
(Note: Exact utility specs follow Olian’s standard platform; refer to installation manual for wiring and piping details.)
Ideal for high-volume or high-precision trimming of:
Commonly deployed in Tier-1 display module factories and automotive electronics suppliers.
Olian Automatic provides comprehensive post-sale support:
Model: OL-CC006
Type: Fully Automatic Vision-Guided COF Trimming Machine
Key Features: Die-based cutting + CCD vision alignment + conveyor output
Operation: Manual load → Auto vision check → Auto trim → Auto index
Max Panel Compatibility: Standard COF modules (size defined by die)
SEO Keywords:
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OL-COF-03A – Semi-Automatic Offline COF Trimming Machine (Die-Based)
The OL-COF-03A by Olian Automatic is a semi-automatic offline trimming machine designed for precision die-based cutting of Chip-on-Flex (COF) modules before bonding. It removes excess flex material or trims carrier frames from COF assemblies using custom-made dies, ensuring clean edges and consistent geometry for downstream assembly or packaging.
This machine is intended for post-bonding finishing only—it does not perform bonding, ACF application, or electrical testing.
The OL-COF-03A uses a mechanical press actuated by dual-hand start buttons to drive a custom die set. The operator manually loads the COF module into the die fixture, presses both start buttons simultaneously, and the upper die descends to trim the part in a single stroke.
Each die set is application-specific and must be ordered separately or fabricated per customer drawing.
The dual-hand start ensures hands are clear of the die area during operation, complying with basic machine safety standards.
Ideal for:
Commonly used in LCD, OLED, and automotive display manufacturing.
Olian Automatic provides full lifecycle support:
Model: OL-COF-03A
Function: Semi-Automatic Die-Based COF Trimming
Operation: Manual load → Dual-hand start → Single-stroke trim
Key Advantage: Simple, robust, and cost-effective finishing for COF modules
SEO Keywords:
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The OL-F0712 by Olian Automatic is a high-precision dual-station FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 12 inches. It features dual-side optical alignment—simultaneously viewing both the panel terminals from below and the FPC pads from above—enabling accurate manual registration for demanding display applications.
The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.
Unlike lower-only systems, the OL-F0712 integrates two coaxial LED-lit microscopes:
Both images are visible simultaneously through a split-view optical path or dual eyepieces (as per design), allowing the operator to manually align FPC and panel with higher precision—critical for narrow-pitch or high-density connectors.
This “top-and-bottom” alignment method significantly improves placement accuracy over single-view systems.
The machine is equipped with a 150 mm long hot press head, ideal for:
Standard head thickness is 1.0 mm, with custom profiles available.
Two fully independent stations enable continuous operation:
The thermal cycle is fully automated once initiated.
Heating is delivered via industrial cartridge heaters with real-time temperature feedback.
Each station includes an automatic buffer tape feed system:
This protects the FPC surface during pressing and ensures consistent bond quality.
All parameters are independently configurable per station via the HMI.
Designed for integration into cleanrooms or controlled manufacturing environments.
Ideal for bonding:
Commonly used where dual-side alignment and wide bonding capability are essential.
Olian Automatic provides comprehensive post-sale support:
Model: OL-F0712
Type: Dual-Station Main Bonding Machine with Dual-Side Vision
Max Panel Size: 12 inches (rigid glass)
Key Features: Upper + lower alignment, 150 mm press head, dual independent stations
SEO Keywords:
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OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine
The OL-FC005 by Olian Automatic is an integrated dual-station COF(chip on film) FOG (Film-on-Glass) bonding system that combines pre-bonding and main bonding in a single machine. The left station performs pulse pre-bonding to temporarily tack flexible circuits (FPC or COF) onto LCD panels, while the right station executes full main bonding to permanently cure the joint—streamlining workflow and reducing handling errors.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It does not apply ACF, nor does it support IC chip bonding.
Operators first align and pre-bond the panel on the left, then transfer it directly to the right station for final bonding—enabling efficient, two-step processing without leaving the workstation.
Both stations use a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below. The COF /FPC is positioned manually from above using visual estimation.
This “lower-only” method provides a practical balance of simplicity and accuracy for mid-precision applications.
Both stations feature independent temperature and time settings to optimize pre-tack and main-cure profiles separately.
Each station includes an automatic buffer tape feed system to protect the FPC during pressing:
Two independent buffer systems ensure reliable protection at both pre-bond and main bond stages.
All parameters—temperature, time, pressure—are set independently for each station via the HMI.
The compact footprint integrates seamlessly into production lines or R&D labs.
Ideal for two-stage bonding of:
Commonly used where process control, reduced contamination, and workflow efficiency are critical.
Olian Automatic provides comprehensive post-sale support:
Model: OL-FC005
Type: Integrated Dual-Station COF /FOG Machine (Pre-Bond + Main Bond)
Layout: Left = Pre-Bond | Right = Main Bond
Max Panel Size: 7 inches (rigid glass)
Key Advantage: Streamlined two-step bonding in one workstation
SEO Keywords:
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OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine with Lower-Side Alignment。
The OL-FS003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine featuring servo-driven press control for high-precision thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Unlike pneumatic systems, its servo mechanism delivers superior pressure accuracy, repeatability, and response—ideal for sensitive or high-reliability bonding applications.
The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.
The OL-FS003 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.
This “lower-only” alignment approach offers simplicity and reliability for applications where FPC pads allow moderate placement tolerance.
A key differentiator of the OL-FS003 is its servo motor-driven press system, replacing traditional pneumatic cylinders. Benefits include:
This makes the OL-FS003 suitable for demanding sectors such as automotive displays, medical devices, and aerospace HMIs.
The machine includes two identical, fully independent stations arranged side by side. Each station features:
Operators can alternate between stations for continuous production, maximizing throughput in pilot lines or small-batch manufacturing.
The entire thermal and mechanical cycle is automated once initiated, ensuring repeatable results.
Heating is delivered via industrial cartridge heaters, monitored by high-accuracy sensors for stable thermal profiles.
An integrated buffer tape feed system protects the FPC during pressing:
All critical parameters—temperature, time, pressure profile—are configured via the HMI for process traceability.
Ideal for bonding:
Commonly deployed in Tier-1 automotive supply chains, certified electronics manufacturers, and R&D centers.
Olian Automatic provides full lifecycle support:
Model: OL-FS003
Type: Dual-Station Servo-Controlled FOG Main Bonding Machine
Key Innovation: Servo-driven press for precision pressure control
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
SEO Keywords:
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