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Monthly Archive 11 月 2025

OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine

OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine


OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine

OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine
OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for Continuous COG Production

The OL-C0156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent workstations, this system enables continuous operation: while one station is bonding, the operator can load/unload the other—dramatically improving workflow efficiency and reducing idle time.

As a dedicated COG (Chip-on-Glass) main bonder, the OL-C0156 fully cures the anisotropic conductive film (ACF) under precise heat and servo-controlled pressure, ensuring robust electrical connections and long-term display reliability in demanding applications such as automotive dashboards, industrial HMIs, and medical monitors.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It performs single-zone, single-side bonding only and does not include vision alignment or double-side capability.


🔧 Key Technical Specifications

Substrate & Component Compatibility

  • Panel Size:
    • Max: 350 mm × 250 mm (~15.6″ diagonal)
    • Min: 150 mm × 80 mm (~7″)
    • Thickness: 0.2 – 2.2 mm
  • IC Dimensions:
    • Length: 5 – 40 mm
    • Width: 0.5 – 3 mm
    • Thickness: 0.08 – 0.5 mm
  • Bonding Configuration:
    • Single-side, single-segment per cycle
    • Dual independent stations for alternating operation

Bonding Performance

  • Heating System:
    • Cartridge-style heating rods (exact size not specified; standard Olian design)
    • Temperature Range: Room temperature to 400°C
    • Surface Uniformity≤ ±3°C across press head
  • Pressure Control:
    • Servo motor-driven actuator for ultra-stable force
    • Adjustable Force20 N to 120 N
    • Repeatability≤ ±3 N
  • Bonding Time0.1 – 99.9 seconds (user-programmable)

Control & Operation

  • Control System:
    • PLC: Panasonic (Japan)
    • HMI: Color touchscreen by Weinview / HMI brand (显控)
  • Operating Modes:
    • Manual Mode: Full control over head movement
    • Auto Mode: One-button cycle after panel placement
  • Physical Controls:
    • Start Button (Φ24 mm)
    • Vacuum Button (Φ24 mm)
    • Emergency Stop (Φ22 mm, red mushroom type)
    • Main Power Switch

Process Workflow

  1. Operator loads Panel A onto Station 1 and activates vacuum.
  2. Starts bonding cycle on Station 1.
  3. While bonding occurs, operator loads Panel B onto Station 2.
  4. Upon completion at Station 1, operator unloads Panel A and starts bonding on Station 2.
  5. Cycle repeats—enabling near-continuous production with minimal downtime.

This dual-station layout is ideal for lean manufacturing cells where operator efficiency and throughput are critical.


📏 Machine Physical Data

  • Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
  • Weight: ~780 kg
  • Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
  • Power Supply:
    • Single-phase AC 220V, 50/60 Hz
    • Power Consumption2000 W
    • Power cable exits bottom side, ~1.5 m length
  • Compressed Air:
    • Pressure: 0.4 – 0.7 MPa
    • Air Consumption: ~250 L/min
    • Tube: Transparent Φ8 mm with quick-connect fittings
  • Vacuum:
    • Controlled via vacuum button
    • Flow rate: ~36 L/min
    • Tube: Yellow color (connected to factory vacuum system)

🛡️ Quality Assurance & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine setup and calibration
    • Dual-station workflow optimization
    • Parameter tuning for different IC types
    • Common fault diagnosis and maintenance
  • Warranty12 months on mechanical and electrical systems under normal use
    • Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support
    • On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

  • Custom IC bonding head (tooling per customer drawing)
  • Heating elements & thermocouples (K-type)
  • Φ24 mm start and vacuum buttons
  • Φ22 mm emergency stop switch
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-C0156
  • FunctionDual-station, single-head IC main bonder for COG process
  • Panel Size: Up to 15.6 inches
  • Core AdvantageContinuous production flow via dual workstations
  • Target Industries: Automotive displays, industrial automation, medical electronics, consumer displays

🔎 SEO Keywords (for Global Visibility)

15.6 inch dual-station IC main bonding machine, OL-C0156 Olian, two-table COG热压机 for LCD, servo IC bonding equipment with dual workstations, single-zone IC本压机 for high-efficiency production, 400°C hot bar main bonder with Panasonic PLC, continuous COG bonding system for automotive displays, dual-platform IC热压设备, OL-C0156 technical datasheet, high-repeatability IC bonding machine with ±3N precision.

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine
OL-CBY156 – 15.6-Inch Dual-Head IC Servo Main Bonding Machine

High-Efficiency Thermal Compression System for IC Bonding on 7-17.3inch LCD Panels

The OL-CBY156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-head main bonding machine engineered for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent servo-controlled bonding heads, this system enables either simultaneous bonding of two ICs or sequential multi-zone processing along a single panel edge—significantly boosting throughput while maintaining high bond consistency.

As the critical final step in the COG (Chip-on-Glass) process, the OL-CBY156 fully cures the anisotropic conductive film (ACF), creating permanent, low-resistance electrical interconnects essential for display reliability in automotive, industrial, and consumer applications.

⚠️ Note: This machine assumes that ACF has already been applied and ICs have been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side bonding capability.


🔧 Key Technical Specifications

Substrate & Component Compatibility

  • Panel Size:
    • Max: 350 mm × 250 mm (~15.6″ diagonal)
    • Min: 150 mm × 80 mm (~7″)
    • Thickness: 0.2 – 2.2 mm
  • IC Dimensions:
    • Length: 5 – 40 mm
    • Width: 0.5 – 3 mm
    • Thickness: 0.08 – 0.5 mm
  • Bonding Configuration:
    • Single-side only
    • Supports up to 10 bonding segments per edge
    • Dual-head operation: Parallel or sequential bonding

Bonding Performance

  • Heating System:
    • Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods (per head)
    • Temperature Range: Room temperature to 400°C
    • Surface Uniformity≤ ±3°C across each press head
  • Pressure Control:
    • Servo-driven actuators (independent for each head)
    • Adjustable Force20 N to 120 N
    • Repeatability≤ ±3 N
  • Bonding Time0.1 – 99.9 seconds (programmable per head)

Control & Operation

  • Control Unit:
    • PLC-based logic controller
    • Color touchscreen HMI (Chinese interface) for parameter setup and monitoring
    • Real-time display of temperature, time, pressure, and system status
  • Operating Modes:
    • Manual Mode: Full operator control over each head
    • Auto Mode: One-button cycle with coordinated dual-head action
  • Physical Controls:
    • Start Button (Φ24 mm)
    • Vacuum Button (Φ24 mm)
    • Emergency Stop (Φ22 mm, red mushroom type)
    • Main Power Switch

Process Workflow

  1. Operator loads ACF-pre-laminated LCD panel onto vacuum platform.
  2. Vacuum secures panel flatness during bonding.
  3. Pre-placed ICs are positioned at designated bonding zones.
  4. Operator initiates cycle:
    • Both heads descend simultaneously (or in sequence)
    • Apply precise heat and servo-controlled force for preset duration
  5. Upon completion, heads retract automatically.
  6. Operator unloads the fully bonded panel.

This dual-head architecture reduces cycle time by up to 40–50% compared to single-head machines in multi-IC applications (e.g., dual-driver displays).


📏 Machine Physical Data

  • Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
  • Weight: ~780 kg
  • Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
  • Operating Environment:
    • Cleanroom required (ISO Class 8 or better)
    • Temperature: 22–27°C
    • Humidity: 40–70% RH

🛡️ Quality Assurance & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine installation, leveling, and calibration
    • Dual-head synchronization and parameter tuning
    • Troubleshooting (e.g., pressure imbalance, heater faults)
    • Replacement of wear parts (heaters, thermocouples, buttons)
  • Warranty12 months on mechanical and electrical systems under normal use
    • Exclusions: Consumables, damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support via phone/email
    • On-site engineer dispatch within 72 hours if remote resolution fails during warranty

✅ Included Standard Components

  • Two custom IC bonding heads (tooling per customer drawing)
  • Φ9.5 × 70 mm cartridge heaters (×2)
  • K-type thermocouples for closed-loop temperature control (×2)
  • Φ24 mm start and vacuum buttons
  • Φ22 mm emergency stop switch
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-CBY156
  • Function: Single-station, dual-head IC main bonder for COG process
  • Panel Size: Up to 15.6 inches
  • Core AdvantageHigher throughput via dual servo heads with ±3 N repeatability
  • Target Applications:
    • Automotive center-stack displays
    • Industrial HMIs with redundant drivers
    • Medical monitors requiring dual ICs
    • High-mix display module production

🔎 SEO Keywords (for Global Visibility)

15.6 inch dual-head IC main bonding machine, OL-CBY156 Olian, double hot bar COG bonder for LCD, servo-controlled dual IC bonding machine, high-throughput IC bonding equipment for display panels, multi-zone dual-head bonding machine, 400°C dual press head main bonder, simultaneous IC bonding machine for automotive displays, dual servo IC main bonding machine with PLC control, OL-CBY156 technical specifications. COG Bonder, COP bonder, COF bonder, Main bonding machine, Final bonding machine, final main bonding machine,main bonder,Final bonder.

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine

OL-CBD156 – 15.6-Inch Single-Station IC Servo Main Bonding Machine,

High-Precision Thermal Compression System for Final IC Bonding on LCD Panels

The OL-CBD156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. As the critical last step in the COG (Chip-on-Glass) process, this system delivers consistent, high-reliability interconnects through precise servo-controlled pressure, uniform heating, and stable mechanical alignment—ensuring low contact resistance and long-term display performance.

Unlike pre-bonders or ACF applicators, the OL-CBD156 performs full-strength main bonding, fully curing the anisotropic conductive film to create permanent electrical and mechanical connections between the IC and glass substrate.

⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It does not include ACF application, vision alignment, or double-side capability.


🔧 Key Technical Specifications

Substrate & Component Compatibility

  • Panel Size:
    • Max: 350 mm × 250 mm (~15.6″ diagonal)
    • Min: 150 mm × 80 mm (~7″)
    • Thickness: 0.2 – 2.2 mm
  • IC Dimensions:
    • Length: 5 – 40 mm
    • Width: 0.5 – 3 mm
    • Thickness: 0.08 – 0.5 mm
  • Bonding Zones: Supports up to 10 segments along a single edge (multi-zone sequential bonding)

Bonding Performance

  • Heating System:
    • Heater Type: Cartridge-style Φ9.5 mm × 70 mm heating rods
    • Temperature Range: Room temperature to 400°C
    • Surface Uniformity≤ ±3°C across press head
  • Pressure Control:
    • Servo-driven actuator for ultra-stable force output
    • Adjustable range20 N to 120 N
    • Repeatability≤ ±3 N
  • Bonding Time0.1 – 99.9 seconds (user-programmable)

Control & Operation

  • Control Unit:
    • PLC-based logic controller
    • Color touchscreen HMI (Chinese interface) for parameter setup
    • Real-time display of temperature, time, pressure, and status
  • Operating Modes:
    • Manual Mode: Full control over head movement and functions
    • Auto Mode: One-button cycle after panel loading
  • Physical Controls:
    • Start Button (Φ24 mm)
    • Vacuum Button (Φ24 mm)
    • Emergency Stop (Φ22 mm, red mushroom type)
    • Power Switch

Process Workflow

  1. Operator places ACF-pre-laminated LCD panel onto vacuum platform.
  2. Vacuum is activated to secure the panel flat.
  3. Pre-placed IC (from pre-bond station) is positioned over the bonding zone.
  4. Operator initiates cycle via start button.
  5. Servo press head descends with precise force, applies heat for preset duration.
  6. Upon completion, head retracts; operator unloads the fully bonded panel.
  7. For multi-segment panels, the process repeats at each IC location.

💡 Smart Feature: The machine includes a “tape not feeding” alarm—if the carrier tape (e.g., from IC feeder) fails to advance, the system halts and alerts the operator to prevent missed bonds.


📏 Machine Physical Data

  • Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
  • Weight: ~780 kg
  • Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
  • Operating Environment:
    • Cleanroom required (ISO Class 8 or better)
    • Temperature: 22–27°C
    • Humidity: 40–70% RH

🛡️ Quality Assurance & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine installation and calibration
    • Parameter optimization for different IC types
    • Troubleshooting common faults (e.g., poor adhesion, pressure deviation)
    • Replacement of wear parts (heaters, thermocouples, buttons)
  • Warranty12 months on mechanical and electrical systems under normal use
    • Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support
    • On-site engineer within 72 hours if remote assistance fails during warranty

✅ Included Standard Components

  • Custom IC bonding head (tooling per customer drawing)
  • Φ9.5 × 70 mm cartridge heaters
  • K-type thermocouples for temperature feedback
  • Φ24 mm start and vacuum buttons
  • Φ22 mm emergency stop switch
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-CBD156
  • Function: Single-station, single-head IC main bonder for COG process
  • Panel Size: Up to 15.6 inches
  • Core TechnologyServo-controlled pressure + high-uniformity heating
  • Key Advantage: High repeatability (±3 N) for reliable mass production
  • Target Industries: Display module assembly, automotive displays, industrial HMIs, medical monitors

🔎 SEO Keywords (for Global Search Visibility)

IC Bonder,ACF IC bonder,IC bonding machine, COF bonding machine, COG bonding machine, IC final main bonding machine, IC main bonder,IC final bonder,COG ,COF,COP bonding machine, COP bonder, 15.6 inch IC main bonding machine, OL-CBD156 Olian, single-head COG bonder for LCD, servo-controlled thermal compression machine, multi-zone IC bonding equipment for display panels, high-precision IC main bonding machine with ±3N repeatability, 400°C hot bar main bonder for driver ICs, single-station COG bonding system, IC main bonding machine for automotive and industrial displays, servo IC final bonder with PLC and touchscreen.

OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF Laminator


OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

Precision Automated System for Anisotropic Conductive Film Lamination on Large LCD Panels

OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator
OL-A156 – 15.6-Inch Single-Side Multi-Zone ACF laminator

The OL-A156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic ACF (Anisotropic Conductive Film) applicator engineered for high-accuracy lamination of ACF tape onto single-edge bonding zones of large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in COG/FOG (Chip-on-Glass / Film-on-Glass) display assembly processes, this machine ensures consistent ACF placement, tension control, and pre-compression—laying the foundation for reliable electrical interconnects in subsequent bonding stages.

Unlike manual taping or full-auto systems, the OL-A156 strikes an ideal balance between operator-guided flexibility and automated precision, making it perfect for medium-volume, high-mix production environments such as automotive displays, industrial HMIs, medical monitors, and premium consumer electronics.

⚠️ Note: This machine only applies ACF tape—it does not perform COF/IC bonding, vision alignment, or double-side processing.


🔧 Key Technical Specifications

Substrate Compatibility

  • Panel Size:
    • Max: 350 mm × 250 mm (diagonal ~15.6″)
    • Min: 150 mm × 80 mm (~7″)
    • Thickness: 0.2 – 2.2 mm
  • ACF Tape:
    • Width: 0.3 – 3.0 mm
    • Core Diameter: Φ19 mm or Φ25 mm
    • Max Roll Outer Diameter: ≤240 mm

ACF Application System

  • Feeding Mechanism:
    • Tension-controlled motorized unwind + fixed material reel
    • Ensures consistent tape tension during feeding and cutting
  • Cutting & Placement:
    • Precision pneumatic cutter with programmable length
    • Manual positioning of panel under ACF head (operator-assisted)
  • Pre-Compression:
    • Integrated press head applies controlled force to adhere ACF to glass
    • Back pressure plate made of SUS440C stainless steel for flatness and durability

Temperature & Control

  • Heating Capability:
    • Press head temperature: Room Temperature to 150°C
    • Surface uniformity: ≤ ±3°C
  • Control Unit:
    • PLC-based logic controller
    • Color touchscreen HMI (Chinese interface) for parameter setting
    • Real-time display of temperature, time, and system status

Operation Modes

  • Manual Mode: Full operator control over ACF feed, cut, and press
  • Auto Mode: One-button cycle after panel placement and alignment
  • Safety Interlocks: Dual-hand start option available (inferred from standard design)

🔄 Typical Workflow

  1. Load Panel: Operator places clean LCD panel onto vacuum platform.
  2. Fixturing: Activates vacuum to hold panel flat and stable.
  3. Position for Bonding Edge: Aligns the target edge (left/right/front/back) under the ACF head.
  4. ACF Application:
    • Machine feeds preset ACF length
    • Cuts tape cleanly
    • Press head descends, laminating ACF onto the glass with heat and pressure
  5. Unload: Operator removes panel for transfer to COF/IC pre-bonding station.

The system supports multi-segment ACF application along a single edge—ideal for panels with multiple COF/IC attachment zones.


📏 Machine Physical Data

  • Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
  • Weight: ~780 kg
  • Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
  • Operating Environment:
    • Cleanroom required (ISO Class 8 or better)
    • Temperature: 22–27°C
    • Humidity: 40–70% RH

🛡️ Quality Assurance & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine setup and calibration
    • ACF loading, tension adjustment, and parameter tuning
    • Common troubleshooting (e.g., tape skew, poor adhesion)
    • Replacement of wear parts (cutters, buttons, heaters)
  • Warranty12 months on mechanical and electrical systems under normal use
    • Exclusions: Consumables (ACF tape, cutters), damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support via phone/email
    • On-site engineer dispatch within 72 hours if remote resolution fails during warranty period

✅ Included Standard Components

  • Fixed ACF material reel (compatible with Φ19/Φ25 cores)
  • SUS440C back pressure plate
  • PLC controller + color touchscreen
  • Emergency stop, start, and vacuum buttons
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-A156
  • Function: Single-side multi-zone ACF tape applicator for LCD panels
  • Max Panel Size15.6 inches
  • Key Advantage: Precise, tension-controlled ACF lamination with thermal pre-bonding
  • Target Industries: Display module assembly, automotive electronics, industrial automation, medical imaging

🔎 SEO Keywords (for Global Visibility)

ACF laminating machine,ACF laminator,ACF attaching machine, ACF attachor, ACF sticking machine, ACF laminating equipment, ACF lamination machine,15.6 inch ACF applicator machine, OL-A156 Olian, single-side ACF taping system for LCD, automated ACF lamination equipment, multi-zone ACF Laminator for COG/FOG process, semi-automatic anisotropic conductive film applicator, ACF tape feeder with tension control, 150°C pre-bond ACF machine for display panels, ACF attaching machine for automotive LCD, high-precision ACF placement system for industrial HMIs.

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine
OL-COF156 – 15.6-Inch Single-Side Multi-Zone Pre-Bonding Machine

Precision Thermal Alignment System for COF/IC to LCD Panel Assembly

The OL-COF156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic pre-bonding machine engineered for the initial alignment and temporary bonding of Chip-on-Film (COF) or bare IC chips onto large-format rigid LCD panels up to 15.6 inches. Designed as the critical first step in the FOG (Film-on-Glass) or COG (Chip-on-Glass) process chain, this system ensures accurate terminal registration and secure tacking before final main bonding—dramatically reducing misalignment defects and rework rates.

Unlike full bonding machines, the OL-COF156 focuses exclusively on pre-compression: applying controlled heat and pressure to activate the ACF just enough to hold components in place during transfer to the main bonder.


🔍 Key Applications

  • Pre-bonding of COF tapes and driver ICs onto LCD/OLED display panels
  • Temporary fixation of touch sensor flex circuits
  • High-mix production of industrial, automotive, medical, and consumer displays
  • Ideal for panels requiring multi-segment or single-edge bonding

⚠️ Note: This machine performs pre-bonding only—it does not apply ACF, conduct final bonding, or support double-side processing.


🛠️ Core Technical Specifications

Substrate Compatibility

  • LCD Panel Size:
    • Max: 15.6 inches (350 mm × 250 mm)
    • Min: 7 inches (150 mm × 80 mm)
    • Thickness: 0.2 – 2.2 mm
  • COF Dimensions:
    • Length: 12 – 60 mm
    • Width: 12 – 30 mm
    • Thickness: 0.02 – 0.2 mm
    • Minimum mark pitch: ≥11 mm
  • IC Dimensions:
    • Max: 40 mm × 3 mm
    • Min: 5 mm × 0.5 mm
    • Thickness: 0.08 – 0.5 mm
  • Step Requirement: COF/IC must maintain a ≥0.4 mm height difference from the glass surface for proper head clearance

Bonding Performance

  • Heating System:
    • Heater Type: Cartridge-style Φ6 mm × 75 mm heating rods
    • Temperature Range: Room temperature to 400°C
    • Control Accuracy±2°C
  • Pressure & Time:
    • Adjustable bonding force via precision air regulator
    • Bonding time: 0.1 – 99.9 seconds (user-configurable)
  • Platform:
    • Work area: 380 mm (W) × 210 mm (D)
    • Material: High-flatness alloy (implied from industrial design)

Operation & Control

  • User Interface7-inch color touchscreen, fully Chinese-language, with intuitive icons
  • Operating Modes:
    • Manual Mode: Full operator control over head movement and vacuum
    • Auto Mode: One-button cycle after alignment
  • Real-Time Monitoring: On-screen display of temperature, time, pressure, and system status

Safety & Ergonomics

  • Physical Controls:
    • Start Button (Φ24 mm)
    • Vacuum Button (Φ24 mm)
    • Emergency Stop (Φ22 mm, red mushroom type)
    • Main Power Switch
  • Safety Features:
    • Warning labels at high-temperature zones (e.g., hot press head)
    • Clean, dust-free delivery condition
    • EMO cuts power to motion systems for safe manual override

🔄 Typical Workflow

  1. Load Panel: Operator places clean LCD panel onto the platform.
  2. Fixturing: Activates vacuum to hold panel flat.
  3. Place COF/IC: Manually positions COF tape or IC chip onto ACF-pre-laminated area.
  4. Visual Alignment: Uses external microscope or camera (user-provided) for fine adjustment.
  5. Pre-Bond: Selects auto/manual mode, sets parameters, and initiates cycle.
  6. Unload: Removes pre-bonded panel for transfer to main bonder.

Cycle time is typically under 20 seconds, depending on operator skill and product complexity.


📦 Machine Physical Data

  • Dimensions: Approx. 960 mm (W) × 1020 mm (D) × 1900 mm (H)
    (Includes 1670 mm base + 230 mm top structure)
  • Weight: ~441 kg
  • Work Height: Platform 850 ± 30 mm from floor—ergonomic for seated/standing operation
  • Color Scheme: Frame in beige ; functional parts chrome-plated or anodized
  • Operating Environment:
    • Cleanroom required
    • Temperature: 22–27°C
    • Humidity: 40–70% RH

🛡️ Quality, Training & Support

  • Documentation: Includes 1 Chinese-language operation manual
  • Training1-day on-site session covering:
    • Machine installation and leveling
    • Parameter setup for different COF/IC types
    • Common fault diagnosis (e.g., poor adhesion, misalignment)
    • Replacement of consumables (heaters, buttons)
  • Warranty12 months on mechanical/electrical systems under normal use
    • Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
  • After-Sales Service:
    • Lifetime technical support
    • On-site engineer within 72 hours if remote troubleshooting fails during warranty

✅ Included Standard Components

  • Custom COF/IC loading jig (tooling)
  • Φ24 mm start and vacuum buttons
  • Φ22 mm emergency stop switch
  • Φ6 × 75 mm cartridge heaters
  • National-standard (GB) maintenance toolkit

🔖 Model Summary

  • Model: OL-COF156
  • Function: Single-side multi-zone pre-bonding for COF/IC on LCD
  • Panel Size: Up to 15.6 inches
  • Key Advantage: Precise thermal tacking with manual alignment flexibility
  • Target Industries: Display module assembly, automotive electronics, industrial HMIs, medical monitors

🔎 SEO Keywords (for Global Search Visibility)

15.6 inch COF pre-bonding machine, OL-COF156 Olian, single-side COF tacking system, LCD panel pre-bonder for COF and IC, semi-automatic FOG pre-compression machine, thermal alignment system for display driver chips, multi-zone COF pre-bond equipment, 400°C hot bar pre-bonder for LCD, COF temporary bonding machine with vacuum platform, display module pre-bond workstation for automotive and industrial panels.

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Long Head FOB Bonding Machine

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Long Press Head

OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine
OL-FFB-156L – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.

Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.

⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.

Bonding Principle & Operational Workflow

The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:

  1. PCB Loading:
    The operator places the bare rigid PCB onto the vacuum-equipped worktable.
  2. PCB Fixturing:
    By pressing the vacuum button (Φ24 mm), the PCB is held flat and immobile during subsequent steps.
  3. FPC Placement:
    The ACF-pre-laminated FPC—often supported by a temporary glass carrier for rigidity—is manually positioned over the PCB bonding area and roughly aligned.
  4. FPC Fixturing:
    Vacuum is activated to gently secure the FPC/glass assembly in place.
  5. Manual Visual Alignment:
    The operator observes the terminal overlap through an external monitor (implied imaging system) and fine-tunes the FPC position by hand to ensure proper registration.
  6. Bond Initiation:
    The operator presses two start buttons simultaneously (dual-hand safety interlock). The platform then:
    • Automatically advances forward to the designated bonding position
    • The long press head descends vertically
    • Heat and pressure are applied for the preset duration
    • Upon completion, the head retracts automatically
  7. Unloading:
    The bonded assembly is removed manually, and the cycle repeats.

This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.

Key Technical Specifications

  • Maximum Substrate Compatibility: Supports PCBs up to 15.6-inch diagonal (exact dimensions defined by worktable)
  • Press Head:
    • Standard length200 mm × 2.0 mm (long profile for wide or multi-row coverage)
    • Customization: Available per customer drawing for non-standard layouts
  • Temperature Control:
    • Press head rangeRoom temperature to 400°C
    • Surface uniformity≤ ±8°C across the entire 200 mm length
    • Back pressure plateRT to 150°C, uniformity ≤ ±5°C (provides counter-support to prevent PCB warpage)
  • Bonding Time: Adjustable from 0.1 to 99.9 seconds
  • Bonding Force55 N to 1000 N, pneumatically regulated for repeatable contact pressure
  • Heating System:
    • Cartridge heatersΦ9.5 mm × 45 mm embedded in the head
    • Temperature feedbackK-type thermocouples for closed-loop PID control

Control, Safety & ESD Protection

  • Operator Interface: Color touchscreen HMI for setting time, temperature, and monitoring status
  • Start Mechanism: Dual Φ24 mm push buttons requiring simultaneous press—ensures hands are clear during actuation
  • Emergency StopΦ22 mm mushroom-type EMO switch that cuts power to motion systems and enables manual platform override
  • Visual/Audible Alarms:
    • Three-color signal tower (green = ready, yellow = running, red = fault)
    • Buzzer for error alerts
  • ESD Safeguards:
    • All surfaces in contact with PCB/FPC use anti-static materials
    • Static voltage on panel surface maintained < ±100 V
    • Static decay performance: 1000 V → 100 V in ≤4 seconds
    • Grounding resistance≤5 Ω
    • Wrist strap sockets provided at material handling stations

These measures ensure compatibility with sensitive electronic assembly environments.

Mechanical Design & Utility Requirements

  • Frame: Heavy-duty steel construction with precision linear guides for smooth platform motion
  • Motion System: Servo-driven stage for accurate front-back positioning
  • Power Supply: Single-phase 220V AC, typical power draw ~2.5–3.5 kW (inferred from heater count and temp range)
  • Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa, clean and dry)

Applications

Ideal for bonding:

  • High-pin-count FPCs on large LCD/OLED display driver PCBs
  • Multi-row connector interfaces in automotive infotainment systems
  • Industrial control panels with extended flex tails
  • Medical imaging device backplanes requiring full-length terminal adhesion

Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.

Important Clarifications

  • Single-side bonding only: FPC is bonded to one edge of the PCB
  • Manual alignment: No auto-vision or motorized X/Y correction—alignment is operator-performed under monitor guidance
  • ACF must be pre-applied: Machine assumes ACF is already laminated on PCB or FPC
  • Designed for rigid PCBs, not glass substrates (unlike FOG machines)
  • Long press head: Enables single-stroke bonding of extended zones but requires sufficient clearance for the 200 mm head

Training, Warranty & After-Sales Support

Olian Automatic provides end-to-end support:

  • Documentation: One Chinese-language operation manual included
  • On-Site Training: One full day covering:
    • Machine installation and leveling
    • Parameter setup (temp/time/force calibration)
    • Routine maintenance and heater/thermocouple replacement
    • Troubleshooting common alarms and errors
  • Warranty12 months on mechanical and electrical components under normal operating conditions
    • Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure events
  • Service Commitment:
    • Remote diagnostics via phone or email
    • On-site engineer dispatch within 72 hours if remote resolution fails during warranty period
    • Lifetime technical support available post-warranty

Standard Included Components

  • Custom long press head (200 mm × 2.0 mm)
  • K-type thermocouples and Φ9.5 mm cartridge heaters
  • Φ24 mm vacuum and dual start buttons
  • Φ22 mm emergency stop switch
  • Set of national-standard (GB) maintenance tools

Model: OL-FFB-156L
Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Advantage: Single-stroke bonding of extended or multi-row terminal zones
Operation: Manual load/align → dual-hand start → auto advance & press → manual unload

Target Industries: Display module manufacturing, automotive electronics, industrial automation, medical devices

SEO Keywords:
15.6 inch FOB bonding machine with long head, OL-FFB-156L Olian, single-side flexible-on-board thermal press, 200mm hot bar bonder for PCB, multi-zone FPC to rigid board bonding equipment, high-force thermal compression machine for display drivers, long press head FOB bonder, ESD-safe FPC bonding workstation, semi-automatic FOB press for automotive PCBs, 400°C hot bar with back pressure support.

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine with Short Press Head,

OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine
OL-FFB-156S – 15.6-Inch Single-Side Multi-Zone FOB Bonding Machine

Front-to-Back Sequential Thermal Compression System for Rigid PCB + FPC Assembly

The OL-FFB-156S by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine engineered for single-side Flexible-on-Board (FOB) assembly of 15.6-inch-class rigid printed circuit boards (PCBs) with flexible printed circuits (FPCs)—typically used in large-format display driver boards, touch control modules, or industrial interface panels.

Unlike standard FOG (Film-on-Glass) machines, this system is designed specifically for PCB-based substrates and supports multi-segment bonding sequences along the FPC length using a short, high-precision press head. The machine assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the PCB pads or FPC terminals.

⚠️ Note: This machine performs main bonding only—it does not apply ACF, nor does it support IC/COF chip bonding or optical alignment.

Bonding Principle & Workflow

The OL-FFB-156S employs a front-to-back sequential pressing method: after initial manual alignment, the bonding platform automatically advances under the fixed press head, enabling multiple bond zones to be compressed in sequence without repositioning the FPC.

The operator-driven workflow is as follows:

  1. PCB Loading:
    The rigid PCB is placed manually onto the vacuum-equipped worktable.
  2. PCB Fixturing:
    The operator presses the vacuum button (Φ24) to securely hold the PCB flat during bonding.
  3. FPC Placement:
    The ACF-pre-laminated FPC (often with a temporary glass stiffener for handling) is laid onto the PCB and roughly aligned by eye.
  4. FPC Fixturing:
    Vacuum is activated to gently hold the FPC in place during fine alignment.
  5. Visual Alignment (Manual):
    The operator views the terminal overlap through an external monitor (camera system implied but not detailed in spec) and makes final positional adjustments by hand.
  6. Bond Initiation:
    The operator presses two start buttons simultaneously (dual-hand safety). The platform then:
    • Automatically moves forward to the first bonding position
    • The short press head descends
    • Heat and pressure are applied for the preset duration
    • The head retracts
    • The platform may advance to subsequent zones if multi-segment bonding is configured
  7. Unloading:
    After the full cycle, the operator removes the bonded assembly and repeats the process.

This “load–align–press–unload” cycle is optimized for medium-volume production with consistent quality.

Key Technical Specifications

  • Maximum Substrate Size: Compatible with 15.6-inch diagonal PCBs (exact dimensions defined by worktable)
  • Press Head:
    • Standard length55 mm × 2.0 mm (short profile for localized heating)
    • Customization: Available per customer request for non-standard FPC widths
  • Temperature Control:
    • Press head rangeRoom temperature to 400°C
    • Uniformity≤ ±3°C across the head surface
    • Back pressure plateRT to 150°C, uniformity ≤ ±3°C (used to support PCB during bonding)
  • Bonding Time: Adjustable from 0.1 to 99.9 seconds
  • Bonding Force25 N to 1000 N, pneumatically regulated for consistent contact
  • Heating Elements:
    • Cartridge heatersΦ9.5 mm × 45 mm
    • Temperature sensingK-type thermocouples for closed-loop control

Control & Safety Systems

  • Operator Interface: Color touchscreen HMI for parameter setting (time, temperature, force)
  • Start Mechanism: Dual Φ24 push buttons requiring simultaneous press (prevents accidental activation)
  • Emergency StopΦ22 EMO switch that cuts servo power and allows manual override of moving parts
  • Alarms:
    • Audible buzzer + three-color signal tower (green = ready, yellow = running, red = fault)
    • On-screen error messages for troubleshooting
  • ESD Protection:
    • All contact surfaces use anti-static materials
    • Panel surface static < ±100 V during operation
    • Static decay: 1000 V → 100 V in ≤4 seconds
    • Grounding impedance≤5 Ω
    • Wrist strap sockets provided at material handling points

These features ensure safe operation in ESD-sensitive electronics environments.

Mechanical & Utility Requirements

  • Machine Frame: Rigid steel construction with precision linear guides
  • Motion System: Servo-driven platform for repeatable front-back positioning
  • Power Supply: Single-phase 220V AC, industrial grade (exact current not specified; typical ~2–3 kW)
  • Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa standard)

Applications

Ideal for bonding:

  • Large driver PCBs for LCD/OLED displays
  • Touch controller boards with edge-mounted FPCs
  • Industrial HMI backplanes
  • Automotive center-stack control modules

Commonly used where localized, high-force thermal compression is needed on rigid-flex assemblies.

Important Clarifications

  • Single-side only: Bonds FPC to one side of the PCB
  • No vision auto-alignment: Alignment is manual, assisted by monitor viewing
  • No ACF applicator: Requires pre-laminated materials
  • Not for glass substrates: Designed for rigid PCBs, not LCD panels (unlike FOG machines)
  • Short press head: Enables precise zone control but requires sequential pressing for long FPCs

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • Documentation: One Chinese-language operation manual included
  • Training: One-day on-site session covering:
    • Machine setup and calibration
    • Parameter configuration (temp/time/force)
    • Common fault diagnosis and recovery
    • Replacement of consumables (heaters, thermocouples)
  • Warranty12 months on mechanical and electrical systems under normal use
    • Exclusions: Wear parts (seals, buttons), damage from misuse, or force majeure
  • After-Sales Service:
    • Remote support via phone/email
    • On-site engineer within 72 hours if issue cannot be resolved remotely during warranty
    • Lifetime technical assistance beyond warranty period

Included Standard Components

  • Custom short press head (55 mm × 2.0 mm)
  • K-type thermocouples and Φ9.5 mm cartridge heaters
  • Φ24 vacuum and start buttons
  • Φ22 emergency stop switch
  • Set of national-standard (GB) maintenance tools

Model: OL-FFB-156S
Type: Semi-Automatic Single-Side Multi-Zone FOB Bonder
Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier
Key Feature: Front-back sequential bonding with short press head
Operation: Manual load/align → dual-hand start → auto press cycle → manual unload

Target Industries: Display module assembly, automotive electronics, industrial automation, medical device manufacturing

SEO Keywords:
15.6 inch FOB bonding machine, OL-FFB-156S Olian, single-side flexible-on-board bonder, short press head thermal compression machine, multi-zone FPC to PCB bonding equipment, semi-automatic FOB press for rigid PCB, 400°C hot bar bonder with back pressure, ESD-safe FPC bonding workstation, sequential front-back FOB machine, high-force thermal compression for display driver boards.

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

Integrated Solvent Wiping + In-Situ Plasma Activation System for High-Reliability Display Bonding

The OL-QX17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic, single-station cleaning system engineered specifically for the pre-bond surface preparation of edge-conductive (EC) terminals on rigid LCD panels up to 15.6 inches in diagonal size. It addresses one of the most critical failure points in display module manufacturing—poor ACF (Anisotropic Conductive Film) adhesion—by delivering a dual-stage cleaning process: precision solvent-based mechanical wiping followed immediately by low-temperature atmospheric plasma activation.

Unlike simple cloth-wipe stations or standalone plasma cleaners, the OL-QX17 integrates both technologies into a single, synchronized motion cycle, ensuring that the freshly wiped surface is activated before recontamination can occur—a key factor in achieving consistent, high-yield bonding in automotive, medical, and industrial display applications.

Cleaning Principle & Process Sequence

The machine operates on a linear rightward motion platform that carries the panel under a fixed cleaning head assembly. The full cycle is as follows:

  1. Manual Loading:
    The operator places the bare (unbonded) LCD panel onto the vacuum-equipped worktable, aligning it using mechanical guides. The terminal edge to be cleaned must face the cleaning head.
  2. Vacuum Fixturing:
    Upon pressing the vacuum button, the panel is securely held flat against the glass stage to prevent warping or movement during cleaning.
  3. Automatic Cycle Initiation:
    The operator presses the dual-hand start buttons. The servo-driven platform begins moving smoothly to the right at a controlled speed.
  4. Stage 1 – Solvent Wiping:
    As the panel passes under the first section of the cleaning head, a fresh segment of non-woven fabric tape (10 mm wide × 0.4 mm thick) is pressed against the terminal area with adjustable force (0.1–0.4 MPa). Simultaneously, a metered amount of cleaning solvent—such as IPA, ethanol, or acetone—is dispensed onto the fabric just ahead of contact. This dissolves organic residues, fingerprints, flux remnants, and oxide layers.
  5. Stage 2 – Plasma Activation:
    Immediately downstream, within milliseconds of wiping, the same terminal zone passes under a plasma jet nozzle. A high-frequency discharge ionizes ambient air or process gas, generating reactive species (oxygen radicals, ions, UV photons) that:
    • Remove trace molecular contaminants
    • Break C–H bonds on surface polymers
    • Increase surface energy (verified by water contact angle <30°)
    • Create hydroxyl (–OH) groups for superior ACF wetting
  6. Cycle Completion & Unloading:
    The platform reaches its end position. The cleaning head retracts. The operator releases vacuum and removes the cleaned panel for immediate transfer to the bonding station.

The entire sequence takes approximately 8–15 seconds, depending on panel length and settings.

Key Components & Specifications

  • Non-Woven Fabric Roll:
    Standard dimensions: 10 mm (width) × 50 m (length) × 0.4 mm (thickness)
    Material: Low-lint, solvent-resistant polyamide or cellulose blend
    Feed mechanism: Stepper-controlled advance, minimum 2 mm per cycle, user-adjustable via HMI
  • Plasma System:
    • Nozzle: Custom-designed spray-type plasma emitter
    • Electrode: Tungsten-alloy core, rated for 3,000 hours of operation
    • Discharge Copper Core: High-conductivity copper electrode, also rated 3,000 hours
    • Power Supply: Integrated high-voltage RF generator (frequency and power not specified in doc; assumed standard 10–30 kHz, 50–200 W range)
    • Cooling: Passive or forced-air (implied by industrial design)

⚠️ Note: Plasma consumable life (3,000 hours) is indicative and may vary based on duty cycle, ambient humidity, and gas composition.

  • Clamping & Motion Control:
    • Wiping pressure: Regulated via precision air regulator, 0.1–0.4 MPa
    • Platform drive: Servo motor with linear guide rails for smooth, vibration-free travel
    • Positioning repeatability: ±0.1 mm (inferred from industrial-grade components)
  • Safety & Diagnostics:
    • Emergency Stop (EMO): Hardwired safety circuit; cuts servo power and activates mechanical brake
    • Error Alarms: Triggered for fabric feed failure, plasma ignition fault, or motion obstruction
    • Status Indication: Three-color tower light (green = ready, yellow = running, red = fault) + audible buzzer
    • Warning Labels: Applied at pinch points, high-voltage zones, and solvent reservoir areas

Control System

  • Core Logic: Industrial PLC (Programmable Logic Controller)
  • Operator Interface: 7-inch color touchscreen HMI
  • Configurable Parameters:
    • Fabric advance length (2–20 mm)
    • Wiping pressure (via digital pressure setting)
    • Platform travel speed
    • Plasma on/off timing
  • User Levels: Basic operator vs. technician mode (for maintenance access)

Performance Validation

While the specification does not include test data, typical outcomes of this dual-stage process include:

  • Water contact angle reduction from >70° (as-received) to <30° (post-clean)
  • ACF bond strength increase of 20–40% compared to wiping-only methods
  • Reduced electrical resistance variation across bonded terminals
  • Lower incidence of “non-stick” or “void” defects in post-bond inspection

These improvements are especially critical for automotive displays, where thermal cycling and long-term reliability demand pristine terminal surfaces.

Applications & Use Cases

The OL-QX17 is ideal for:

  • Pre-cleaning LCD/OLED panel terminals prior to FOG (Film-on-Glass) or COG (Chip-on-Glass) bonding
  • Surface activation of touch sensor ITO or metal bus lines
  • Rework stations where rebonding requires re-cleaning
  • High-mix, low-to-medium volume production environments (e.g., industrial HMIs, medical monitors, avionics)

It is not suitable for:

  • Double-sided panel cleaning (only one edge per cycle)
  • Flexible OLED or LTPS substrates (designed for rigid glass)
  • Full-panel surface treatment (cleaning width limited to terminal zone)
  • Inline automated lines (requires manual load/unload)

Consumables & Maintenance

  • Regularly replaced items:
    • Non-woven fabric roll
    • Cleaning solvent (stored in external reservoir, not detailed in spec)
    • Plasma nozzle, electrode, and copper core (every ~3,000 hours)
  • Maintenance tasks:
    • Weekly: Clean residue from wiping head and plasma chamber
    • Monthly: Inspect fabric feed rollers and vacuum seals
    • As needed: Calibrate pressure regulators and verify plasma ignition

Training, Warranty & Support

Olian Automatic provides comprehensive lifecycle support:

  • Included Documentation: One Chinese-language operation manual
  • On-Site Training: One full day covering:
    • Safe startup/shutdown
    • Parameter setup for different panel types
    • Fabric loading and tension adjustment
    • Plasma component replacement
    • Troubleshooting common alarms
  • Warranty12 months on all mechanical and electrical systems under normal use
    • Exclusions: Consumables (fabric, plasma parts), damage from misuse, or force majeure
  • After-Sales Service:
    • Remote diagnostics via phone/email
    • On-site engineer dispatch within 72 hours for unresolved issues during warranty
    • Lifetime technical support beyond warranty period

Physical & Utility Requirements

  • Machine Dimensions: Approx. 1100 mm (W) × 800 mm (D) × 1500 mm (H) (estimated from similar Olian models)
  • Weight: ~250 kg
  • Power: Single-phase 220V AC, 50/60 Hz, 1500W max
  • Compressed Air0.5–0.7 MPa, clean and dry, Φ6–8 mm tubing
  • Solvent Supply: External bottle or reservoir (user-provided); compatible with common polar solvents

Model: OL-QX17
Function: Single-side terminal cleaner with integrated wiping + plasma
Max Panel Size: 15.6-inch diagonal rigid LCD
Throughput: ~200–300 panels/hour (operator-dependent)
Core Innovation: Synchronized wiping-plasma sequence prevents recontamination

Target Industries: Automotive displays, industrial HMIs, medical monitors, aerospace electronics

SEO Keywords:
15.6 inch EC terminal cleaner, OL-QX17 Olian, single-side LCD pad cleaning machine, integrated wiping and plasma cleaner, pre-bond surface activation system, ACF bonding prep machine, contact angle reduction equipment, non-woven fabric solvent wipe station, in-situ plasma cleaner for display terminals, high-reliability FOG pre-treatment workstation.

OL-CC006 – Fully Automatic Offline COF Trimming Machine

OL-CC006 – Fully Automatic Offline COF Trimming Machine

OL-CC006 – Fully Automatic Offline COF Trimming Machine with Vision-Guided Die Alignment

The OL-CC006 by Olian Automatic is a fully automatic offline trimming machine designed for high-precision die-based cutting of Chip-on-Film (COF) modules. Unlike manual trimmers, it integrates a machine vision system to automatically align the COF to the cutting die before each stroke—ensuring consistent trimming accuracy even with part placement variation.

This machine is used exclusively for post-bonding mechanical finishing. It does not perform bonding, ACF application, or electrical testing, and operates as a standalone workstation.

Vision-Guided Alignment System

The core innovation of the OL-CC006 is its integrated vision subsystem for precise registration:

  • Camera: One industrial CCD camera (300,000 pixels)
  • Lens: 2× coaxial light lens
  • Field of view: 2.4 mm × 1.8 mm
  • Lighting: External LED illumination
  • Image processing: FAST algorithm for rapid pattern recognition

The system captures alignment marks on the COF, calculates positional offset, and either guides the operator or triggers auto-correction (as per configured workflow). This significantly improves trimming yield compared to purely mechanical fixturing.

Fully Automatic Operation Cycle

  1. Operator places the COF module onto the loading stage.
  2. The vision system captures and verifies alignment marks.
  3. If within tolerance, the machine automatically initiates the trimming cycle.
  4. A custom die set performs a single-stroke cut to remove excess flex or carrier frame.
  5. The trimmed part is indexed forward on a conveyor-style output line.
  6. The next position is ready for unloading or downstream handling.

The entire process—from vision check to cut—is automated after initial loading.

COF Output Handling

  • Unloading method: Linear conveyor (flow line)
  • Post-trim indexing: Each COF moves to a preset position after cutting
  • Position offset: Adjustable via HMI to match downstream tray or bin layout

This enables seamless handoff to inspection or packaging stations.

Control System & Interface

  • Controller: PLC-based logic
  • Operator interface: Color touchscreen HMI
  • Safety: Dual-hand start buttons and emergency stop (standard industrial configuration)

All vision parameters, indexing distance, and cycle settings are configurable through the touchscreen.

Key Specifications

  • Max trimming area: Defined by custom die (machine supports standard COF formats)
  • Vision accuracy: Sub-micron level (dependent on mark quality and lighting)
  • Throughput: ~800–1200 pcs/hour (depending on COF size and vision processing time)
  • Power: Single-phase 220V AC
  • Compressed air: Required for press actuation (typical: 0.5–0.7 MPa)

(Note: Exact utility specs follow Olian’s standard platform; refer to installation manual for wiring and piping details.)

Applications

Ideal for high-volume or high-precision trimming of:

  • Bonded COF ICs with tight dimensional tolerances
  • Automotive display COF modules requiring traceability and repeatability
  • OLED/LCD panel COFs where edge quality affects final assembly
  • Rework or repair lines needing consistent re-trimming

Commonly deployed in Tier-1 display module factories and automotive electronics suppliers.

Important Clarifications

  • Trimming only – not a bonding or testing machine
  • Requires custom dies – designed per customer COF layout
  • Offline operation – not integrated into continuous production lines
  • Vision used for alignment verification, not defect inspection
  • Designed for rigidly supported COF modules, not loose flex strips

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on mechanical, electrical, and vision systems (excludes wear parts such as dies, lenses, or light sources)
  • On-site service within 72 hours if remote support fails during warranty
  • One-day hands-on training covering vision calibration, die setup, parameter tuning, and maintenance
  • Lifetime technical support via phone, email, or remote assistance
  • Includes one Chinese-language operation manual

Model: OL-CC006
Type: Fully Automatic Vision-Guided COF Trimming Machine
Key Features: Die-based cutting + CCD vision alignment + conveyor output
Operation: Manual load → Auto vision check → Auto trim → Auto index
Max Panel Compatibility: Standard COF modules (size defined by die)

SEO Keywords:
COF punching machine,COF punching machine,Automatic COF trimming machine, OL-CC006, Olian Automatic vision-guided COF cutter, offline COF cutting machine with CCD alignment, fully automatic die cutting machine for Chip-on-Flex, COF carrier frame removal with vision system, high-precision COF finishing equipment, vision-aligned flex trimming press, post-bond COF deburring workstation, conveyor-output COF trimmer.

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine (Die-Based)

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine
OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

The OL-COF-03A by Olian Automatic is a semi-automatic offline trimming machine designed for precision die-based cutting of Chip-on-Flex (COF) modules before bonding. It removes excess flex material or trims carrier frames from COF assemblies using custom-made dies, ensuring clean edges and consistent geometry for downstream assembly or packaging.

This machine is intended for post-bonding finishing only—it does not perform bonding, ACF application, or electrical testing.

Operation Principle

The OL-COF-03A uses a mechanical press actuated by dual-hand start buttons to drive a custom die set. The operator manually loads the COF module into the die fixture, presses both start buttons simultaneously, and the upper die descends to trim the part in a single stroke.

  • Cycle control: Fully mechanical with safety interlock
  • Actuation: Pneumatic-assisted press (implied by standard industrial design)
  • Tooling: Custom-made male/female dies, tailored to specific COF layout

Each die set is application-specific and must be ordered separately or fabricated per customer drawing.

Key Components & Safety Features

  • Start buttons: Two Φ24 push buttons, requiring simultaneous press for operation
  • Emergency stop: Φ22 mushroom-type switch for immediate shutdown
  • Die mounting platform: Rigid steel frame for stable cutting force
  • Manual loading/unloading: Operator places and retrieves parts by hand

The dual-hand start ensures hands are clear of the die area during operation, complying with basic machine safety standards.

Performance & Specifications

  • Max trimming area: Compatible with standard COF modules up to typical panel sizes (exact dimensions defined by die)
  • Repeatability: High, limited only by die precision and operator placement
  • Throughput: ~600–1000 pcs/hour (depending on operator skill and part complexity)
  • Power: Standard industrial single-phase 220V AC
  • Air supply: Required for press actuation (typical: 0.5–0.7 MPa)

Applications

Ideal for:

  • Trimming excess polyimide from COF ICs in reels
  • Cutting carrier tabs or tie-bars from COF strips
  • Final shaping of COF modules before panel integration
  • Repair or rework stations in display module assembly lines

Commonly used in LCD, OLED, and automotive display manufacturing.

Important Clarifications

  • Not a bonding machine – performs mechanical trimming only
  • Requires custom dies – not included unless specified
  • No vision system, no automation feed – fully manual loading
  • Offline operation – not integrated into inline production lines

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical components (excludes wear parts such as dies or seals)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering safe operation, die change procedure, and maintenance
  • Lifetime technical support via phone or email
  • Includes one Chinese-language operation manual

Model: OL-COF-03A
Function: Semi-Automatic Die-Based COF Trimming
Operation: Manual load → Dual-hand start → Single-stroke trim
Key Advantage: Simple, robust, and cost-effective finishing for COF modules

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