Single-Platform Green Picosecond Laser Glass Cutting Machine
Model: OL-GP4050S
Consumer demand for pristine mobile screens, camera cover glass and other brittle components forces suppliers to achieve higher cutting strength, minimal chipping, excellent edge verticality, high throughput and low cost. Traditional CNC machining consumes cutting fluids, delivers limited accuracy, suffers rapid tool wear and demands large floorspace and labour. The OL-GP4050S was therefore developed to give optical workshops a cleaner, faster and more economical alternative.
Product name: OL-GP4050S single-platform green picosecond laser glass cutting machine.
The system performs dry, dust-free laser ablation of flat glass at several times the speed of conventional methods. A high-precision XY linear motor stage and granite base secure micron-level accuracy and long-term stability.
Effective processing area: 300 mm × 300 mm.
Single-pass cutting depth for K9 glass: up to 3 mm.
Power supply: AC 220 V ± 5 %, single-phase with earth, total load < 4 kW.
Ambient temperature: 24 – 26 °C.
Relative humidity: 10 – 70 %, non-condensing, clean room recommended.
Overall dimensions: length 1 400 mm, width 1 050 mm, height 1 950 mm (without beacon).
Approximate weight: 1 000 kg.
Floor loading: at least 500 kg m⁻².
include optical glass, coated glass, soda-lime glass, sapphire and quartz. High-temperature cleaving is not advised for heat-sensitive coatings.
Processing principle: a 532 nm green picosecond beam creates equally spaced filamentary holes inside the material. A linear motor moves the workpiece so the filaments form a controlled micro-crack line, enabling clean separation. Pulse width < 10 ps confines energy to a tiny volume, so the process is virtually athermal and produces no melt or large HAZ.
Laser source: 50 W green picosecond laser, 50 kHz, 1 mJ pulse energy, water-cooled.
Cutting head: 3 mm depth-of-focus Bessel type for long filament and small spot.
Motion platform: X-Y-Z stages. X and Y driven by linear motors on granite; travel 300 mm × 300 mm; maximum speed 1 000 mm s⁻¹ with 1 g acceleration; positioning accuracy ≤ ±2 µm, repeatability ≤ ±1 µm. Z axis servo-driven, 50 mm travel, focus step resolution 10 µm.
Vision system: 5 MP MindVision CCD, point plus ring illuminator, automatic Mark capture, alignment accuracy ≤ ±3 µm.
Control software: proprietary Windows-based package reads DXF and DWG files; integrates high-precision motion card with PSO (position-synchronized output) for on-the-fly laser triggering. Industrial PC with Taiwan-imported motherboard, LCD monitor, wireless keyboard and mouse.
Hardware: Grade 00 granite base, vacuum chuck for workpiece fixation. Low-voltage elements by Schneider, switch-mode power supplies by Mean Well.
Use the machine only on transparent brittle materials. Do not process metals or temperature-sensitive coated products. Install the unit in a clean, well-ventilated room free of corrosive or acidic vapours.
Daily: remove dust and processing debris.
Weekly: inspect and clean protective lenses.
Monthly: replace chilled-water coolant (distilled or de-ionised water only).
Quarterly: replace coolant filter cartridge.
Photographs in the original file show typical cuts on strengthened glass, sapphire wafers and quartz substrates: edges are smooth, chips < 5 µm, no micro-cracks or discoloration.
