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Tag Archive Olian Automatic manual FPC bonder

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine with Lower-Side Fixed Alignment

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine
OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

The OL-F003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses lower-side visual alignment only, where operators view panel terminals from below through a single microscope while manually positioning the FPC from above.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to either the panel or the FPC. It performs main bonding only—fully curing the ACF joint under heat and pressure. It does not apply ACF, nor does it support IC or COF bonding.

Alignment Method: Lower-Side Fixed Microscope

Unlike dual-lens systems, the OL-F003 employs a single lower-view microscope. The operator places the panel on a transparent glass stage. They look through the microscope from below to see the panel’s terminal marks. Then, they manually place and adjust the FPC from above using visual estimation and experience.

This “lower-only” method is simple, cost-effective, and suitable for applications where ultra-high precision is not required or where FPC pads are large enough for manual placement tolerance.

Dual Independent Workstations

The machine features two identical, fully independent bonding stations side by side. Each station includes:

  • A vacuum-hold glass panel stage
  • A fixed upper FPC positioning area
  • A lower-view microscope with lighting
  • An automatic hot press head

Operators can work on one station while the other is idle, enabling continuous production. All loading, unloading, and alignment are performed manually at the front.

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC onto the panel by hand, aligning visually using the lower microscope.
  4. Presses both start buttons simultaneously (dual-hand safety).
  5. The hot press head descends automatically, applies heat and pressure for a preset time.
  6. After bonding, the head retracts. Operator removes the finished panel.

The entire bonding cycle is semi-automatic—alignment is manual, but pressing is controlled and repeatable.

Performance Specifications

  • Bonding temperature: Up to 400°C
  • Temperature uniformity: ≤ ±8°C across the press head
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure range20 N to 300 N, pneumatically regulated
  • Standard press head size60 mm × 1.0 mm (custom sizes available)

Heating is delivered via embedded cartridge heaters, monitored by K-type thermocouples for stable thermal control.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during bonding:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Alarm function: If the buffer tape fails to advance, the machine triggers an audible and visual alert

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical start, vacuum, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic head retraction

All critical parameters—temperature, time, pressure—are set via the HMI for consistent results.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 255 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

Compact footprint suits cleanrooms, pilot lines, and repair workshops.

Applications

Suitable for bonding:

  • FPCs to rigid TFT, IPS, or OLED panels
  • IN-CELL touch sensor flexes

Commonly used in:

  • Industrial display assembly
  • Automotive cluster manufacturing
  • Small-batch production and R&D labs

Important Clarifications

  • No upper-lens or dual-lens vision system – alignment is lower-view only
  • Does NOT bond bare ICs or standard COF modules
  • Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides complete post-sale support:

  • One-year warranty on all mechanical and electrical components (excludes wear parts like heaters or buffer rollers)
  • On-site service within 72 hours if phone support fails during warranty
  • One-day training covering:
    • Machine installation and leveling
    • Parameter setup (temp/time/pressure)
    • Manual alignment technique
    • Common fault diagnosis and易损件 replacement
  • Lifetime technical support via remote assistance

Model: OL-F003
Type: Dual-Station Manual FOG Bonding Machine
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
Core Advantage: Simple, reliable, cost-effective manual bonding with dual-station throughput

SEO Keywords:
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OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine with Dual-Lens Upper-Lower Alignment

OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine
OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine

The OL-F006 by Olian Automatic is a high-precision manual FOG (Fpc-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Featuring dual independent workstations, this system enables efficient, repeatable bonding for small-batch production, pilot lines, and display repair applications.

Unlike standard bonders, the OL-F006 integrates simultaneous upper-lower optical alignment with front-rear platform motion, allowing operators to achieve micron-level accuracy through direct visual matching of panel and FPC fiducial marks—without automated vision software.

Core Functionality

This machine performs final main bonding only. It assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the glass panel or the FPC. The OL-F006 does not apply ACF, nor does it support IC or COF bonding. Its sole purpose is the thermal curing of pre-aligned FPC-to-glass or touch-flex-to-glass assemblies.

Dual-Station Workflow

The OL-F006 features two identical, fully independent bonding stations arranged side by side. Each station includes its own:

  • Glass panel vacuum platform
  • FPC holding stage
  • Dual-lens microscope system
  • Hot press head

Operators can work on both stations alternately to maximize throughput, or two technicians can operate simultaneously. All loading, unloading, and alignment are performed manually at the front of the machine.

Alignment System: Upper-Lower Dual-Lens Microscopy

The heart of the OL-F006 is its dual optical path alignment system. Two high-resolution lenses—one viewing the panel from below, the other viewing the FPC from above—project real-time images onto a single split-screen monitor. This allows the operator to see both sets of alignment marks simultaneously.

Key optical specs:

  • Magnification: 2×
  • Field of view per lens: 1.9 mm × 1.4 mm
  • Lighting: Coaxial LED illumination for glare-free, shadowless imaging
  • Inter-lens distance: Adjustable from 12 mm to 90 mm to accommodate various panel sizes and mark positions

The operator places the panel on the lower glass stage and activates vacuum hold. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs beneath the panel stage, they shift the glass until the panel marks align perfectly with the FPC marks on screen. This “upper-lower” visual method ensures high alignment fidelity without complex software calibration.

Bonding Process

Once alignment is confirmed:

  1. The operator presses both start buttons simultaneously with two hands (safety interlock).
  2. The bonding platform automatically moves forward into the press zone.
  3. The hot press head descends and applies controlled heat, pressure, and time.
  4. After the set duration, the head retracts.
  5. The platform moves backward to the original loading position.
  6. The operator removes the bonded panel.

This front-rear motion keeps the operator’s hands safely away from the hot zone during pressing while maintaining ergonomic access during setup.

Thermal & Mechanical Performance

  • Temperature range: Room temperature to 400°C
  • Temperature uniformity: ≤ ±5°C across the press head surface
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure control25 N to 400 N, pneumatically regulated
  • Standard press head size60 mm × 1.0 mm (custom lengths available upon request)

Heating is achieved via embedded cartridge heaters, with temperature monitored by industrial-grade sensors to ensure process stability.

Buffer Material Handling

The machine includes an integrated buffer tape feeding system to protect the FPC during bonding:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: adjustable from 1 mm to 20 mm
  • Auto-alarm function: If the buffer tape fails to advance, the system triggers a visual and audible alert to prevent dry bonding

Control System & Safety

  • Control unit: Industrial PLC with color touchscreen interface
  • Manual controls: Physical start, vacuum, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic platform retraction

All critical parameters—temperature, time, pressure—are set and monitored via the HMI, ensuring consistent results across shifts and operators.

Physical Specifications & Utilities

  • Machine dimensions: 900 mm (W) × 860 mm (D) × 1450 mm (H)
  • Weight: Approximately 280 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow rate 250 L/min, supplied via Φ8 mm tubing

The compact footprint fits easily into most cleanroom or workshop environments.

Applications

Ideal for bonding:

  • FPCs to TFT, IPS, or OLED glass panels
  • ON-CELL touch sensor flexes
  • IN-CELL touch sensor flexes
  • PCB-to-flex or large-end COF-style flexes (note: not bare COF chips)

Commonly used in:

  • Automotive display assembly
  • Smartwatch and wearable module production
  • Industrial HMI panel manufacturing
  • Display R&D labs and repair centers

Important Clarifications

  • Does NOT bond bare ICs or standard COF modules
  • Does NOT apply ACF – requires pre-laminated materials
  • No automated alignment – all positioning is manual via visual feedback

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on all mechanical and electrical components (excludes consumables and wear parts such as heating elements or buffer tape rollers)
  • On-site service within 72 hours if remote troubleshooting fails during warranty period
  • One full day of hands-on training, covering:
    • Machine installation and leveling
    • Parameter setup (temp, time, pressure)
    • Alignment technique and best practices
    • Common fault diagnosis and resolution
    • Replacement of易损件 (e.g., press heads, heaters)
  • Lifetime technical support via phone, email, or video call

Model: OL-F006
Type: Dual-Station Manual FOG Main Bonding Machine
Max Panel Size: 7 inches (rigid glass)
Core Innovation: Upper-lower dual-lens visual alignment + front-rear platform motion
Operation: Manual alignment, semi-automatic bonding cycle

SEO Keywords:
Dual-station FOG bonding machine, OL-F006, Olian Automatic manual FPC bonder, 7-inch Film-on-Glass press with dual-lens alignment, upper-lower mark alignment system, front-rear motion FOG machine, manual FPC to glass bonding equipment, thermal compression bonder for touch flex, high-precision manual FOG workstation, split-screen vision FOG press.

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