OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder
High-Precision Manual FOG Bonding for 65-Inch Displays
Engineered by Olian Automaic
The OL-FD065D Up-Down Alignment Constant-Temperature FOG Bonder is designed and manufactured by Olian Automaic.
It is a manual flat-panel display (FPD) bonding system, engineered for pre-bonding flexible printed circuits (FPC/COF) and film-on-glass (FOG) applications.
The equipment supports display sizes ranging from 10 inches (200×110 mm) to 65 inches (1450×810 mm), with material thicknesses between 0.1 mm and 1 mm.
Core Functionality
Features manual up-down alignment, allowing operators to precisely position the glass/film and FPC/PCB using Mark points.
After alignment, the system automatically performs the constant-temperature thermocompression bonding process.
Designed as a single-station solution, ideal for small-to-medium volume production and R&D environments.
Key Specifications
Platform Size: Compatible with displays up to 65 inches.
Display Compatibility:
Maximum: 65 inches (1450×810 mm).
Minimum: 10 inches (200×110 mm).
Thickness: 0.1–1 mm.
FPC/COF Dimensions: Length and width from 12 mm to 60 mm; thickness 0.1–1 mm.
Alignment Accuracy:
X-axis: ±0.04 mm.
Y-axis: ±0.05 mm.
Cycle Time: Approximately 8 seconds per unit (excluding manual alignment time).
Temperature Range: Room temperature to 400°C with constant-temperature heating.
Temperature Uniformity: ±5°C across the bonding surface.
Pressure Control: 25–400 N with ±5 N precision.
Technical Features
Dual Imaging System:
Equipped with two 300K-pixel CCD cameras.
Coaxial LED lighting ensures uniform illumination.
Field of view: 1.9×1.4 mm for high-precision alignment.
Adjustable Platforms:
Glass platform with ±2 mm Z-axis adjustment via micrometer.
FPC platform supports manual X/Y/Q/Z-axis adjustment (±5 mm for X/Y/Q; ±2 mm for Z).
Vacuum fixation using 1 mm holes and 1.5 mm grooves for secure substrate holding.
Tungsten Alloy Hot Press Head:
Surface flatness: ≤5 μm (55 mm standard).
Parallelism can be fine-tuned using adjustment screws.
Performance and Efficiency
Product Pass Rate: ≥98% (excluding human error and material defects).
System Failure Rate: ≤2% under normal operating conditions.
Model Changeover Time: Approximately 20 minutes for quick production switching.
Dual Access Levels:
Operator mode: No password required for daily operations.
Engineer mode: Password-protected for advanced parameter settings.
Operational Environment
Power Requirements: Single-phase AC 220V, 50/60 Hz, 1500W.
Air Supply: 0.4–0.7 MPa, 250 L/min using transparent 8 mm tubing.
Vacuum Supply: 36 L/min using yellow tubing.
Operating Conditions: Cleanroom environment with temperature 22–27°C and humidity 40–70%.
After-Sales Support
Warranty: One year (covers non-consumable parts; excludes wear items and damage caused by misuse).
On-Site Training: One-day program covering equipment operation, calibration, and basic troubleshooting.
Technical Service: 72-hour on-site response for issues arising during the warranty period.
Target Applications
Ideal for manufacturers involved in the assembly of LCD and OLED panels.
Commonly used for television displays, industrial monitors, digital signage, and automotive infotainment systems.
Suitable for both prototyping and medium-batch production lines.
OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Precision Manual FOG Bonding for 85-Inch Displays.
OL-FPD85 Single-Station FOG FOB COF Pulse Bonder
The OL-FPD85 Single-Station Dual-Sided Alignment Pulse Bonder, manufactured by Shenzhen Olian Automatic Equipment Co., Ltd., is a manual flat-panel display (FPD) bonding solution engineered for pre-bonding flexible printed circuits (FPC/COF) or film-on-board (FOB) applications. Designed for 85-inch platforms, this equipment supports display sizes from 10 inches (200×110 mm) to 85 inches (1890×1060 mm) with thicknesses of 0.1–1 mm.
OL-FPD85 Single-Station FOG FOB COF Pulse Bonder Key Specifications
Platform Size: 85-inch compatible
Display Compatibility:
Max: 85″ (1890×1060 mm)
Min: 10″ (200×110 mm)
Thickness: 0.1–1 mm
FPC/COF Dimensions: 12–60 mm (L×W), thickness 0.1–1 mm
Accuracy: ±0.040 mm (X-axis), ±0.045 mm (Y-axis)
Cycle Time: ≤25 seconds per unit (excluding manual alignment)
Temperature Range: Room temperature to 450°C (pulse heating)
Pressure Control: 30–400 N (±5 N precision)
Core Features
Manual Dual-Sided Alignment: Operators place glass/film on the platform, position FPC/PCB manually, and align using Mark points. The system automates the thermocompression bonding process.
Dual Imaging System:
OLB Unit (Lower Lens): 2× 300K-pixel CCD cameras with coaxial LED lighting (FOV: 1.9×1.4 mm).
PCB Unit (Upper Lens): 2× 300K-pixel CCD cameras with spot LED lighting (FOV: 1.9×1.4 mm).
Adjustable Platforms:
Glass platform with ±2 mm Z-axis adjustment (micrometer).
Aluminum platform with ±2 mm lifting stage adjustment.
Vacuum fixation (1 mm holes, 1.5 mm grooves).
Titanium Alloy Hot Press Head:
Surface flatness: ≤3 μm (55 mm standard).
Parallelism adjusted via screws.
Technical Advantages
High Yield: ≥98% product pass rate (excluding human/material factors).
Quick Changeover: ～20 minutes for new model setup.
Dual Access Levels: Operator (no password) and engineer (password-protected parameters).
Operational Environment
Power: Single-phase AC 220V, 50/60 Hz, 1500W.
Air Supply: 0.4–0.7 MPa, 250 L/min (transparent 8 mm tubing).
Vacuum: 36 L/min (yellow tubing).
Conditions: Cleanroom (22–27°C, 40–70% humidity).
After-Sales Support
Warranty: 1 year (excludes wear parts and human-induced damage).
Training: 1-day on-site program covering operation, calibration, and troubleshooting.
Service: 72-hour on-site response for warranty-period issues.
This bonder is ideal for manufacturers requiring precision alignment for large-format displays. Its manual flexibility and automated pressing ensure high-quality bonds for FPC/COF applications.
