Tag Archive Manual FOG bonding machine

OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder

OL-FD065D Up-Down Alignment Constant-Temperature FOG FOB COF Bonder

High-Precision Manual FOG Bonding for 65-Inch Displays

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Engineered by Olian Automaic

• The OL-FD065D Up-Down Alignment Constant-Temperature FOG Bonder is designed and manufactured by Olian Automaic.
• It is a manual flat-panel display (FPD) bonding system, engineered for pre-bonding flexible printed circuits (FPC/COF) and film-on-glass (FOG) applications.
• The equipment supports display sizes ranging from 10 inches (200×110 mm) to 65 inches (1450×810 mm), with material thicknesses between 0.1 mm and 1 mm.

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Core Functionality

• Features manual up-down alignment, allowing operators to precisely position the glass/film and FPC/PCB using Mark points.
• After alignment, the system automatically performs the constant-temperature thermocompression bonding process.
• Designed as a single-station solution, ideal for small-to-medium volume production and R&D environments.

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Key Specifications

• Platform Size: Compatible with displays up to 65 inches.
• Display Compatibility:
  • Maximum: 65 inches (1450×810 mm).
  • Minimum: 10 inches (200×110 mm).
  • Thickness: 0.1–1 mm.
• FPC/COF Dimensions: Length and width from 12 mm to 60 mm; thickness 0.1–1 mm.
• Alignment Accuracy:
  • X-axis: ±0.04 mm.
  • Y-axis: ±0.05 mm.
• Cycle Time: Approximately 8 seconds per unit (excluding manual alignment time).
• Temperature Range: Room temperature to 400°C with constant-temperature heating.
• Temperature Uniformity: ±5°C across the bonding surface.
• Pressure Control: 25–400 N with ±5 N precision.

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Technical Features

• Dual Imaging System:
  • Equipped with two 300K-pixel CCD cameras.
  • Coaxial LED lighting ensures uniform illumination.
  • Field of view: 1.9×1.4 mm for high-precision alignment.
• Adjustable Platforms:
  • Glass platform with ±2 mm Z-axis adjustment via micrometer.
  • FPC platform supports manual X/Y/Q/Z-axis adjustment (±5 mm for X/Y/Q; ±2 mm for Z).
  • Vacuum fixation using 1 mm holes and 1.5 mm grooves for secure substrate holding.
• Tungsten Alloy Hot Press Head:
  • Surface flatness: ≤5 μm (55 mm standard).
  • Parallelism can be fine-tuned using adjustment screws.

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Performance and Efficiency

• Product Pass Rate: ≥98% (excluding human error and material defects).
• System Failure Rate: ≤2% under normal operating conditions.
• Model Changeover Time: Approximately 20 minutes for quick production switching.
• Dual Access Levels:
  • Operator mode: No password required for daily operations.
  • Engineer mode: Password-protected for advanced parameter settings.

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Operational Environment

• Power Requirements: Single-phase AC 220V, 50/60 Hz, 1500W.
• Air Supply: 0.4–0.7 MPa, 250 L/min using transparent 8 mm tubing.
• Vacuum Supply: 36 L/min using yellow tubing.
• Operating Conditions: Cleanroom environment with temperature 22–27°C and humidity 40–70%.

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After-Sales Support

• Warranty: One year (covers non-consumable parts; excludes wear items and damage caused by misuse).
• On-Site Training: One-day program covering equipment operation, calibration, and basic troubleshooting.
• Technical Service: 72-hour on-site response for issues arising during the warranty period.

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Target Applications

• Ideal for manufacturers involved in the assembly of LCD and OLED panels.
• Commonly used for television displays, industrial monitors, digital signage, and automotive infotainment systems.
• Suitable for both prototyping and medium-batch production lines.

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