OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine with Bottom Vision Alignment
OL-FP156 – 15.6-Inch Dual-Station FOG Bonding Machine
High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-FP156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. Featuring bottom-side vision alignment and dual independent workstations, this system delivers exceptional positional accuracy while enabling continuous production—ideal for high-mix, medium-volume manufacturing of automotive displays, industrial HMIs, and premium consumer electronics.
Unlike top-alignment systems, the bottom-view camera design ensures direct imaging of panel bonding pads through the glass substrate, eliminating parallax errors and enabling sub-micron-level registration between COF terminals and ITO traces—even on dark or reflective panels.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
🔍 Key Technical Features
✅ Dual-Station Continuous Workflow
Two independent vacuum platforms allow simultaneous loading/unloading and bonding
While Station 1 bonds, the operator prepares Station 2—maximizing uptime and throughput
Ideal for lean production cells requiring minimal operator idle time
✅ Bottom Vision Alignment System
Camera Type: High-resolution industrial CMOS
Lens Magnification: 2× optical zoom
Field of View (FOV): 1.9 mm × 1.4 mm
Lighting: Coaxial LED illumination for glare-free imaging of reflective pads
Inter-Camera Distance: Adjustable from 12 mm to 90 mm to accommodate various COF pitches
Alignment Method: Manual fine-tuning via joystick or micrometer knobs under live camera view
✅ Bonding Performance
Panel Compatibility:
Max Size: 350 mm × 250 mm (~15.6″ diagonal)
Thickness: 0.2 – 2.2 mm
COF Dimensions:
Width: 12 – 30 mm
Length: 12 – 60 mm
Thickness: 0.02 – 0.2 mm
Bonding Force: Servo-controlled, 20–120 N (±3 N repeatability)
Temperature Range: Up to 400°C with ±2°C uniformity
Bonding Time: 0.1 – 99.9 seconds (programmable)
✅ Buffer Tape Handling (for COF Carrier)
Buffer Tape Inner Diameter: ≥33 mm
Outer Diameter: ≤80 mm
Feed Pitch: Adjustable from 1 mm to 20 mm
Safety Feature: Machine triggers alarm if tape fails to advance, preventing missed bonds
🖥️ Control & Operation
Control Unit:
PLC-based logic controller
Color touchscreen HMI (Chinese interface)
Manual control buttons for emergency override
Operating Modes:
Manual Mode: Full operator control over alignment and bonding
Auto Mode: One-button cycle after visual alignment confirmation
Ergonomics:
Work height: 890 ± 30 mm
Clean, uncluttered layout for easy access and maintenance
📏 Machine Physical Data
Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Power Supply: AC 220V, 50/60 Hz, single-phase
Compressed Air: 0.4–0.7 MPa
Operating Environment:
Cleanroom required (ISO Class 8 or better)
Temperature: 22–27°C | Humidity: 40–70% RH
🛡️ Quality Assurance & Support
Documentation: Includes 1 Chinese-language operation manual
Target Applications: Automotive center displays, dual-driver industrial panels, medical monitors, gaming laptops
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