In the competitive landscape of display manufacturing, the transition from manual to fully automatic bonding lines is no longer optional—it’s essential. Shenzhen Olian Automatic Equipment Co., Ltd. (OLIAN) presents its flagship 0.7-7 inch Fully Automatic Bonding Line, engineered to meet the rigorous demands of modern LCM (Liquid Crystal Module) and touch panel production. Designed for “One Glass” and semi-flexible products, this line delivers unparalleled speed, precision, and yield.
OLIAN’s automatic bonding line is built for high-volume production without compromising on flexibility.
Contamination is the enemy of yield. Unlike standard machines, OLIAN integrates cleanroom-level technology directly into the workstation.
At the heart of the OLIAN bonding line is a commitment to precision and product safety.
This isn’t just a machine; it’s a complete ecosystem for display assembly. The OLIAN line integrates the following critical workstations:
OLIAN’s line is built for Industry 4.0. Every machine in the lineup—from the Automatic TFOG Bonder to the Final Attachment Machine—comes with MES communication protocols and reserved gateways. This allows for seamless data flow, real-time monitoring of yield rates—guaranteed >99.5%, and predictive maintenance.
If you are seeking a turnkey solution for 0.7-7 inch displays, OLIAN offers the complete package: Speed (3.5s TT), Cleanliness (Class 5), and Intelligence (MES Ready). With thousands of units deployed globally and partnerships with industry giants, OLIAN is the trusted partner for your high-tech manufacturing needs.
Ready to upgrade your production line? Contact OLIAN now to request a demo or download the full technical specifications for the 0.7-7 inch Fully Automatic Bonding Line.
Wechat/whatsapp: wa.me/8618025364779
In the rapidly evolving world of electronics and display manufacturing, precision bonding technologies play a crucial role in creating high-quality, reliable, and innovative products. Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our company offers a comprehensive range of bonding machines and solutions to meet your specific needs. Below is an introduction to our product offerings, covering various bonding technologies and applications.
COG (Chip on Glass) technology is a widely used method for mounting LCD driver chips directly onto the glass substrate of a display panel
. This technique is known for its simplicity, cost-effectiveness, and reliability. Our COG bonding machines are designed to provide high precision and efficiency, making them ideal for applications such as smartphone screens, LCD panels, and other display devices
. We offer both pre-bonding and main-bonding machines, ensuring accurate alignment and strong connections.
COF (Chip on Film) technology represents a significant advancement in display manufacturing. It involves mounting integrated circuits (ICs) onto flexible printed circuits (FPCs), which can then be bent and folded to fit compact spaces
. Our COF bonding machines support high-speed production and offer precise temperature and pressure control, ensuring reliable connections for applications such as flexible screens, smartwatches, and other wearable devices
. We provide both COF pre-bonding and main-bonding machines, tailored to meet the demands of modern display manufacturing
.
COP (Chip on Plastic) technology is another innovative approach, where ICs are mounted directly onto plastic substrates. This method is particularly useful for creating lightweight and flexible displays
. Our COP bonding machines are designed to handle the unique challenges of plastic substrates, offering high precision and reliability. These machines are ideal for applications such as flexible OLED displays and wearable devices
.
FOG (FPC on Glass) bonding involves attaching flexible printed circuits to glass substrates. This technique is commonly used in applications requiring flexibility and compact design, such as touch screens and wearable devices
. Our FOG bonding machines feature advanced alignment systems and precise temperature control, ensuring high-quality connections. We offer both hot press and automated bonding solutions for FOG applications
.
FOB (FPC on PCB) bonding machines are designed for attaching flexible printed circuits to printed circuit boards. These machines are essential for creating compact and reliable electronic assemblies, commonly used in smartphones, tablets, and other consumer electronics
. Our FOB bonding machines provide high precision and flexibility, supporting both manual and automated production processes
.
FOF (FPC on FPC) bonding involves connecting flexible printed circuits to each other. This technique is ideal for applications requiring extreme flexibility and compactness, such as wearable devices and flexible displays
. Our FOF bonding machines offer high precision and reliability, ensuring strong and durable connections.
ACF (Anisotropic Conductive Film) bonding is a versatile technique used in various bonding processes, including COG, COF, and FOG
. Our ACF bonding machines are designed to provide precise temperature, pressure, and alignment control, ensuring reliable and high-quality connections. We offer a range of ACF bonding solutions, including pre-bonding and main-bonding machines
.
TAB (Tape Automated Bonding) is a technique used for bonding integrated circuits to substrates using tape carriers. Our TAB bonding machines are designed for high-speed production and offer precise alignment and bonding capabilities
. These machines are ideal for applications requiring high-density interconnections and compact designs
.
FPC (Flexible Printed Circuit) bonding machines are essential for creating flexible and lightweight electronic assemblies. Our FPC bonding machines offer high precision and reliability, supporting various bonding processes and applications
. These machines are ideal for applications such as wearable devices, flexible displays, and other consumer electronics
.
In addition to the above technologies, we also offer specialized bonding machines for various applications, including:
Our bonding machines are designed with the latest innovations in mind, ensuring high precision, reliability, and efficiency. Key features of our machines include:
Whether you are producing smartphone screens, wearable devices, large TV panels, or advanced OLED displays, our comprehensive range of bonding machines is designed to meet your specific needs. With advanced features such as high precision, versatility, and automation, our machines are ideal for ensuring high-quality connections and efficient production processes. Contact us today to find the perfect bonding machine for your application.
