Tag Archive 7-inch dual-station bond press

OL-FP005 – 7-Inch Dual-Station Manual Pulse Bonding Machine

OL-FP005 – 7-Inch Dual-Station Manual Pulse Bonding Machine with Dual-Lens Upper-Lower Alignment。

The OL-FP005 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for precise thermal tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system enables operators to perform high-accuracy pre-bonding—a critical step that temporarily fixes FPCs in place and final main bonding.

The machine assumes that anisotropic conductive film (ACF) has already been applied to the panel or FPC. It does not apply ACF, nor does it perform main bonding, IC attachment, or COF processing.

Core Function: FOG FOB Bonding

bonding ensures the FPC remains aligned during transfer to the main bonder. The OL-FP005 uses short-duration pulse heating to lightly cure the ACF without full compression—just enough to hold position. This is distinct from main bonding and requires lower energy and shorter time.

Dual Independent Workstations

The OL-FP005 features two identical, fully independent stations arranged side by side. Each includes:

• A vacuum-hold glass panel stage
• An upper FPC holding platform
• A dual-lens microscope alignment system
• A pulse-heated press head

Operators can alternate between stations for continuous workflow, or two technicians can work simultaneously—doubling throughput in small-batch production or R&D environments.

Upper-Lower Visual Alignment System

Alignment is achieved through a dual-optical-path microscope that provides simultaneous views of the panel terminals (from below) and FPC pads (from above) on a single split-screen monitor.

Key optical specifications:

• Magnification: 2×
• Field of view per lens: 1.9 mm × 1.4 mm
• Light source: Coaxial LED illumination for uniform, shadow-free imaging
• Inter-lens distance: Adjustable from 12 mm to 90 mm to match various mark layouts

The operator places the panel on the lower stage and activates vacuum. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs, they shift the panel until fiducial marks align perfectly on screen—ensuring micron-level accuracy before pre-bonding.

Front-Rear Platform Motion

After alignment, the operator initiates the cycle. The entire bonding platform automatically moves forward into the press zone. The heated head descends, applies a brief pulse of heat and light pressure, then retracts. The platform then returns backward to the original loading position—keeping the operator’s hands safely away from hot components during actuation.

Pulse Heating Performance

• Temperature range: Up to 400°C
• Surface uniformity: ≤ ±8°C across the press head
• Heating time: Adjustable from 0.1 to 99.9 seconds
• Bonding force: 20 N to 300 N, pneumatically controlled
• Standard press head: 50 mm long × 0.8 mm thick (custom sizes available)

Heating is delivered via high-response cartridge elements, enabling rapid thermal pulses ideal for pre-tacking ACF without over-curing.

Buffer Material Handling

The machine includes an automatic buffer tape feed system to protect the FPC during pressing:

• Buffer roll inner diameter: ≥33 mm
• Outer diameter: ≤80 mm
• Feeding pitch: 1–20 mm
• Failure detection: If the buffer tape does not advance, the system triggers an audible and visual alarm to prevent damage

Control & Safety

• Control unit: PLC-based system with color touchscreen interface
• Manual controls: Physical vacuum, start, and emergency stop buttons (Φ24/Φ22)
• Safety interlock: Dual-hand start required to initiate bonding cycle
• Core components include K-type thermocouples, industrial pneumatic valves, and custom hot press heads

Physical Specifications

• Dimensions: 900 mm (W) × 860 mm (D) × 1450 mm (H)
• Weight: Approximately 280 kg
• Power: Single-phase 220V AC, 2000W
• Compressed air: 0.5–0.7 MPa, flow 250 L/min, Φ8 mm tubing

Applications

Ideal for pre-bonding:

• FPCs for small TFT, IPS, or OLED displays
• ON-CELL and IN-CELL touch sensor flexes
• PCB-to-flex or large-end flexible connectors

Commonly used in:

• Automotive display assembly lines
• Wearable electronics manufacturing
• Industrial HMI module production
• Display repair and prototyping labs

Important Clarifications

• Does NOT bond bare ICs or standard COF chips
• Requires pre-laminated ACF – no ACF applicator included

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

• One-year warranty on mechanical and electrical systems (excludes wear parts like heaters or buffer rollers)
• On-site service within 72 hours if remote support fails during warranty
• One-day hands-on training covering:
  • Machine setup and calibration
  • Alignment technique and parameter tuning
  • Troubleshooting common alarms
  • Replacement (e.g., press heads, heating tubes)
• Lifetime technical support via phone, email, or remote assistance

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Model: OL-FP005
Function: Manual Pulse Pre-Bonding Only
Max Panel Size: 7 inches (rigid glass)
Key Innovation: Dual-lens upper-lower alignment + front-rear motion + dual stations
Operation: Manual alignment, semi-automatic pulse cycle

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