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OL-FF-173 Rework FOG-FOB Bonding Machine | Olian Automatic

Rework FOG-FOB Bonding Machine OL-FF-173 by Olian Automatic delivers high-precision FOG and FOB rework bonding for displays up to 17.3 inches.

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OL-FF-173 Rework FOG-FOB Bonding Machine: Precision Rework for FOG and FOB Products

In display manufacturing, rework bonding is essential for yield optimization. The OL-FF-173 Rework FOG-FOB Bonding Machine, engineered by Olian Automatic, is a semi-automatic thermal pressing solution designed for precise FOG and FOB rework.

This machine specializes in re-bonding FPCs onto display panels (FOG) and PCBs (FOB) that have already been attached with ACF. The unique dual-mode design supports both FOG and FOB rework in one integrated unit.

Why Choose the OL-FF-173 Rework FOG-FOB Bonding Machine?

The OL-FF-173 Rework FOG-FOB Bonding Machine is built for manufacturers who need flexible rework capabilities. Its innovative design handles both FOG and FOB products with precision and speed.

  • Dual-Mode Rework: Seamlessly switch between FOG and FOB rework modes. The machine supports both product types in a single setup.
  • High Throughput: Production capacity reaches approximately 80-105 FPC/H, depending on the rework mode and product complexity.
  • Micron-Level Precision: Achieve flawless rework connections. FOG pre-bonding accuracy is X±0.025mm, Y±0.030mm. Main bonding accuracy is X±0.025mm, Y±0.040mm.
  • FOB Precision: FOB pre-bonding accuracy is X±0.030mm, Y±0.035mm. Main bonding accuracy is X±0.035mm, Y±0.045mm.
  • Versatile Compatibility: Handles products from 7 to 17.3 inches. Supports both rigid glass displays and flexible panels.
  • Multi-Segment Efficiency: Up to 6 FPC segments and 6 PCB segments per cycle. The multi-segment design reduces cycle time significantly.
  • Fine Pitch Support: Suitable for pitches as fine as 0.045mm. Ideal for high-density FPC products.

Advanced Process & Intelligent Control

The OL-FF-173 streamlines the rework process by combining simple manual setup with sophisticated automation. This approach provides the perfect balance of human oversight and machine precision.

FOG Rework Workflow:

  1. Product Placement: The operator manually places the panel on the working platform.
  2. Vacuum Activation: The operator presses the vacuum button to secure the panel.
  3. FPC Placement: The operator places the FPC on the FPC platform and activates vacuum.
  4. Alignment: The operator aligns the FPC using the monitor display.
  5. Process Start: The operator presses the dual start buttons to begin the cycle.
  6. Pre-Bonding: The thermal head descends and performs multi-segment pre-bonding.
  7. Main Bonding: The platform moves to the main bonding position. The main bonding head descends.
  8. Completion: The thermal head rises. The operator removes the finished product.

FOB Rework Workflow:

  1. Product Placement: The operator manually places the panel on the working platform.
  2. Vacuum Activation: The operator presses the vacuum button to secure the panel.
  3. PCB Placement: The operator places the PCB on the working platform and activates vacuum.
  4. Alignment: The operator aligns the PCB using the monitor display.
  5. Process Start: The operator presses the dual start buttons to begin the cycle.
  6. Pre-Bonding: The thermal head descends and performs multi-segment pre-bonding.
  7. Main Bonding: The platform moves to the main bonding position. The main bonding head descends.
  8. Completion: The thermal head rises. The operator removes the finished product.

Sequential Processing: When both FOG and FOB are set, the machine completes FOG rework first, then automatically switches to continuous FOB rework.

The entire process is managed by a reliable Panasonic PLC and a user-friendly Weinview touch screen interface. The system supports both manual and automatic modes. Engineers can set parameters while operators can only run the machine.

4-CCD Vision Alignment System

The OL-FF-173 is equipped with an advanced 4-CCD camera vision system for precise alignment. The system includes 2 CCD cameras for FOG and 2 CCD cameras for PCB. Each camera has 300K pixels for clear mark recognition.

The system provides a field of view of 3.2 x 2.4mm with 2x magnification. The distance between two lenses is adjustable from 11mm to 90mm. Coaxial and non-coaxial LED lighting ensures optimal mark visibility. This ensures accurate alignment even for fine-pitch FPC products with a minimum pitch of 0.045mm.

Robust Engineering & Reliable Support

Built for durability in a cleanroom environment, the OL-FF-173 features a robust construction with high-quality components from industry-leading brands.

Key Technical Specifications:

  • Temperature Control (Pre-bond): RT to 400℃ with surface variance of ≤±5℃.
  • Temperature Control (Main Bond): RT to 400℃ with surface variance of ≤±5℃.
  • Back Heating (Main Bond): RT to 150℃ for improved bonding quality.
  • Pressure Control (Pre-bond): 25N to 400N with digital pressure display.
  • Pressure Control (Main Bond): 35N to 500N with digital pressure display.
  • Bonding Time: Adjustable from 0.1 to 99.9 seconds.
  • Head Configuration: 1 pre-bond head (tungsten carbide) + 2 main bond heads (FOG and FOB).
  • Platform: Hard magnesium alloy platform with vacuum fixation.
  • Platform Repeat Accuracy: ≤5μm for consistent positioning.
  • Power & Air: AC 220V, 2500W; Compressed air at 0.5~0.7MPa, 240L/min.
  • Dimensions: 1900mm (W) x 1050mm (D) x 1680mm (H)
  • Weight: Approximately 740 kg
  • Working Table Height: 930±30mm

Product Compatibility:

  • LCD Platform Size: W: 410mm x D: 300mm
  • Panel Size: Max 17.3″ (16:9), Min 7″, thickness 0.05~1mm
  • FPC Size: Max LW: 8050mm (bonding length ≤65mm), Min LW: 1515mm (bonding length ≥13mm)
  • FPC Thickness: 0.05~1mm
  • FPC to IC/Glass Step Gap: ≥0.4mm
  • Product Variety: ≥100 different products supported
  • Changeover Time: New product setup ≤60min, Product change ≤30min

Head Specifications:

  • Pre-bond Head: Standard 55x1mm, tungsten carbide material.
  • FOG Main Bond Head: Standard 55x1mm, tungsten carbide material.
  • FOB Main Bond Head: Standard 55x2mm, tungsten carbide material.
  • Customizable heads available for special requirements.

ESD Compliance: The OL-FF-173 meets strict ESD standards. All consumables and parts are anti-static. The machine features ESD grounding at all product handling points for safe operation.

Safety Features: The machine includes interlock design with buzzer alarms and touch screen alerts. All high-temperature and mechanical hazard areas have warning labels. The EMO (emergency stop) cuts all power to servo drives. A buzzer and three-color signal tower provide visual and audible alerts.

Why Choose Olian Automatic for Your Rework Bonding Needs?

Olian Automatic is a trusted manufacturer of display assembly equipment headquartered in Shenzhen, China. With over two decades of experience, we serve display manufacturers worldwide. Our equipment is designed in ISO-certified facilities and shipped to over 30 countries across Asia, Europe, and North America.

Sustainability Commitment: The OL-FF-173 is designed for energy efficiency. Its optimized thermal management system reduces power consumption. The machine also features low-noise operation and uses environmentally friendly materials in compliance with RoHS standards.

FAQ:

Q: What is a rework FOG-FOB bonding machine used for?
A: A rework FOG-FOB bonding machine re-bonds FPCs onto display glass (FOG) and PCBs (FOB) that need repair or adjustment.

Q: What products can the OL-FF-173 handle?
A: The OL-FF-173 handles FOG and FOB products from 7 to 17.3 inches with pitches as fine as 0.045mm.

Q: Can the OL-FF-173 do both FOG and FOB rework?
A: Yes. The machine supports sequential FOG and FOB rework in a single workflow for maximum efficiency.

Q: What is the production capacity of the OL-FF-173?
A: Capacity ranges from 80 to 105 FPC/H depending on the rework mode and product configuration.

Q: How long is the warranty period?
A: Olian Automatic provides a 1-year warranty with lifetime technical support for all equipment.

Q: How long does product changeover take?
A: New product setup takes approximately 60 minutes. Product changeover takes approximately 30 minutes.

Upgrade your display repair line with the OL-FF-173, the Rework FOG-FOB Bonding Machine that combines flexibility, precision, and reliability.


Product Tags

Rework FOG-FOB Bonding Machine, FOG Rework Bonding, FOB Rework Bonding, Semi-Automatic Rework Bonder, FPC Rework Equipment, 17.3 inch FOG-FOB Bonder, Multi-Segment Bonding Machine, ACF Bonding Rework, Precision FOG Bonding, Display Manufacturing, Electronics Assembly, FOG FOB Rework, Olian Automatic

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