OL-CBD156 Single-Side Multi-Segment IC Servo Main Bonding Machine: Precision and Flexibility

In the precise world of display manufacturing, accurate main bonding is a critical step. The OL-CBD156 Single-Side Multi-Segment IC Servo Main Bonding Machine, engineered by Olian Automatic, is a semi-automatic solution designed to deliver exceptional accuracy and flexibility.

This machine specializes in main bonding ICs or COFs onto panels that have already been attached with ACF and pre-bonded. The process is streamlined for efficiency, from manual product placement to automated alignment and thermal compression.

🚀 Unmatched Performance for High-Volume Production

The OL-CBD156 Single-Side Multi-Segment IC Servo Main Bonding Machine is built for manufacturers who demand both speed and accuracy. Its semi-automatic design optimizes the workflow to maximize output without compromising on quality.

• High Throughput: The efficient design enables a production capacity of approximately 150-400 PCS/H, with a main bonding time of less than 12 seconds per position.
• Micron-Level Precision: Achieve flawless connections with remarkable alignment accuracy. The machine maintains a precision of ≤±0.005mm for ICs and ≤±0.007mm for COFs.
• Exceptional Yield Rate: The stable and repeatable process guarantees a product qualification rate of ≥98%, minimizing material waste and rework.
• Versatile Compatibility: The OL-CBD156 handles a wide range of products, including rigid glass (TFT, OLED) and flexible screens, with panel sizes up to 15.6 inches.

⚙️ Advanced Process & Intelligent Control

The OL-CBD156 streamlines the main bonding process by combining simple manual setup with sophisticated automation. This approach provides the perfect balance of human oversight and machine precision.

The Optimized Workflow:

1. Product Placement: The operator manually places the panel on the working platform.
2. Vacuum Activation: The operator presses the vacuum button to secure the product.
3. Process Start: The operator presses the dual start buttons to begin the cycle.
4. Automated Bonding: The platform moves to the bonding position, and the thermal head descends.
5. Thermal Compression: The machine automatically performs the main bonding process.
6. Multi-Segment Process: The platform automatically moves to the next position and repeats the process.
7. Completion: The platform returns to the loading position, and the operator removes the finished product.

The entire process is managed by a reliable Panasonic PLC and a user-friendly Weinview touch screen interface. For security and quality control, the machine features a two-level password system, allowing engineers to set parameters while operators can only run the machine.

🛠️ Robust Engineering & Reliable Support

Built for durability in a cleanroom environment, the OL-CBD156 features a robust construction with high-quality components from industry-leading brands like THK, HIWIN, SMC, and Airtac.

Key Technical Specifications:

• Temperature Control: RT to 400℃ with a surface variance of ≤±5℃.
• Pressure Control: Adjustable from 20N to 500N with a repeat accuracy of ≤±5N.
• Power & Air: AC 220V, 2500W; Compressed air at 0.5~0.7 Mpa.
• Dimensions: 1000mm (W) x 1100mm (D) x 1900mm (H)

Warranty and Service:
Olian Automatic stands behind its equipment with a 1-year warranty and lifetime technical support. We provide comprehensive on-site installation, debugging, and operator training to ensure your team can achieve optimal results from day one.

Upgrade your display assembly line with the OL-CBD156, the Single-Side Multi-Segment IC Servo Main Bonding Machine that combines speed, precision, and reliability.

🏷️ Product Tags

Single-Side Multi-Segment IC Servo Main Bonding Machine, Main Bonding Machine, Semi-Automatic Main Bonder, IC Main Bonding, COF Main Bonding, OL-CBD156, Precision Main Bonding, Display Manufacturing, Electronics Assembly, Main Bonding Process, Olian Automatic