OL-C012 Dual-Station Main Bonder | High-Precision IC & COF Bonding
OL-C012 Dual-Station Main Bonder from Olian Automatic, engineered for high-precision IC and COF bonding on 3-7 inch displays.
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OL-C012 Dual-Station Main Bonder: Precision & Efficiency
In the demanding field of display manufacturing, the final bonding stage is critical for product reliability and performance. The OL-C012 Dual-Station Main Bonder, engineered by Olian Automatic, is designed to deliver exceptional precision and throughput for this essential process.
This advanced machine performs the main bonding of ICs (Integrated Circuits) and COFs (Chip on Film) onto panels that have already been pre-bonded. By featuring two independent workstations, the OL-C012 allows an operator to load and unload one panel while the other is being processed, significantly boosting overall productivity. It is the ideal solution for manufacturers of TFT and OLED displays, both rigid and flexible.
🚀 Unmatched Performance for High-Volume Production
The OL-C012 Dual-Station Main Bonder is built for speed and accuracy, making it a cornerstone of efficient production lines. Its dual-station design is the key to its impressive output.
- High Throughput: Maximize your production capacity with speeds of approximately 500-800 PCS/H for glass screens and 350-600 PCS/H for flexible screens. The entire main bonding cycle is completed in under 10 seconds.
- Micron-Level Precision: Achieve flawless connections with remarkable alignment accuracy. The machine maintains a precision of ≤±0.005mm for both X and Y axes when bonding ICs, and ≤±0.006mm for COF applications.
- Exceptional Yield Rate: The stable and repeatable process ensures a product qualification rate of ≥98%, minimizing waste and ensuring consistent quality.
- Versatile Compatibility: The machine handles a wide range of products, from 3-inch to 7-inch displays, and can process fine pitches down to 18um for ICs and 20um for COFs.
⚙️ Advanced Process & Intelligent Control
The OL-C012 streamlines the main bonding process by combining manual operation with sophisticated automation. This semi-automatic approach provides the perfect balance of human oversight and machine precision.
The Optimized Workflow:
- Panel Placement: The operator places a pre-ACF attached panel onto the vacuum stage at one of the two workstations.
- Automated Bonding: With the press of two start buttons for safety, the machine automatically initiates the main bonding cycle.
- Precise Application: A servo-driven press head applies exact pressure (20-500N) and heat (RT-400℃) for a set duration (0.1-99.0s).
- Simultaneous Operation: While one station is bonding, the operator can unload the finished product and load a new one at the second station, ensuring zero downtime.
The entire process is managed by a reliable Panasonic PLC and a user-friendly touch screen interface. For security and quality control, the machine features a two-level password system, allowing engineers to set parameters while operators can only run the machine and switch between saved product profiles.
🛠️ Robust Engineering & Reliable Support
Built for durability in a cleanroom environment, the OL-C012 features a robust construction with high-quality components from industry-leading brands like Panasonic, SMC, and THK.
Key Technical Specifications:
- Temperature Control: Press head from RT to 400℃; Backup heater from RT to 100℃.
- Pressure Control: Adjustable from 20N to 500N with a precision regulator.
- Power & Air: AC 220V, 2000W; Compressed air at 0.5~0.7 Mpa.
- Dimensions: 820mm (W) x 890mm (D) x 1520mm (H)
Warranty and Service:
Olian Automatic stands behind its equipment with a 1-year warranty and lifetime technical support. We provide comprehensive on-site installation, debugging, and operator training to ensure your team can achieve optimal results from day one.
Upgrade your display assembly line with the OL-C012, the Dual-Station Main Bonder that combines speed, precision, and reliability.

