OL-CRW017-2 17″ COG COF Bonding Machine | Olian Automatic
17 inch COG COF Auto Bonding Machine OL-CRW017-2 by Olian Automatic delivers micron-level precision for display IC bonding and repair.
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OL-CRW017-2 17 inch COG COF Auto Bonding Machine: Micron-Level Precision for Display IC Bonding
In display manufacturing and repair, precise COG (Chip on Glass) and COF (Chip on Film) bonding is essential. The OL-CRW017-2 17 inch COG COF Auto Bonding Machine, engineered by Olian Automatic, is a semi-automatic solution designed for high-precision IC and COF bonding.
This machine specializes in offline COG rework for medium-sized rigid glass displays. It automatically performs ACF attachment, IC alignment, pre-bonding, and main bonding. The process combines manual material loading with fully automated thermal compression.
Why Choose the OL-CRW017-2 COG COF Auto Bonding Machine?
The OL-CRW017-2 COG COF Auto Bonding Machine is built for manufacturers who demand micron-level accuracy. Its single-side multi-segment design handles up to 10 ICs per side for maximum efficiency.
- High Precision Bonding: Achieve exceptional alignment accuracy. COG main bonding precision reaches X:±5μm, Y:±5μm. COF precision reaches X:±6μm, Y:±6μm.
- Fast Cycle Times: Single IC/COF bonding completes in ≤39 seconds. Dual IC/COF takes ≤69 seconds. Triple IC/COF takes ≤98 seconds. Quad IC/COF takes ≤128 seconds.
- Exceptional Yield Rate: The stable and repeatable process guarantees a product qualification rate of ≥98%. This minimizes material waste and rework costs.
- Versatile Compatibility: Handles LCD panels from 5 to 17 inches. Supports IC sizes from 5mm to 40mm in length. COF sizes range from 18mm to 65mm.
- Multi-Segment Efficiency: Up to 10 ICs per side can be bonded in a single setup. The multi-segment design reduces cycle time significantly.
- Quick Changeover: New product setup takes ≤90 minutes. Existing product changeover takes ≤45 minutes. Supports approximately 100 different product varieties.
Advanced 2-CCD Vision Alignment System
The OL-CRW017-2 features an advanced two-camera vision system for precise alignment. The LCD correction and ACF detection camera provides 1.3MP or 1.6MP resolution with 1x magnification. Its field of view is 6.4 x 4.8mm with coaxial and LED lighting.
The pre-bond alignment uses 2 CCD cameras with 1.3MP or 1.6MP resolution and 6x magnification. The field of view is 1.07 x 0.8mm. The distance between two lenses is adjustable from 6mm to 60mm. This ensures accurate alignment for fine-pitch IC and COF products.
Intelligent Process Control
The OL-CRW017-2 streamlines the COG/COF bonding process through sophisticated automation. The entire workflow is managed by a reliable Panasonic PLC and a user-friendly Weinview touch screen interface.
The Optimized Workflow:
- Material Loading: The operator installs ICs, ACF, and Teflon tape. The operator selects the repair positions on the display.
- ACF Attachment: The platform moves to the attachment position. The machine automatically applies ACF to all selected positions.
- ACF Inspection: The vision camera inspects ACF attachment quality. If NG, the operator confirms and takes action. If OK, the process continues.
- IC Pickup and Alignment: The machine automatically picks up ICs. The vision system corrects IC positioning with micron-level accuracy.
- Pre-Bonding: The platform moves to the pre-bond position. The thermal head performs pre-bonding for all selected positions.
- Main Bonding: The platform moves to the main bonding position. Each position undergoes main bonding sequentially.
- Completion: The platform returns to the loading position. The operator removes the finished product and repeats the cycle.
For security and quality control, the machine features a two-level password system. Engineers can set parameters while operators can only run the machine.
Robust Engineering & Reliable Support
Built for durability in cleanroom environments, the OL-CRW017-2 features high-quality components from industry-leading brands.
Key Technical Specifications:
- Temperature Control (ACF Attachment): RT to 200°C with surface variance of ±5°C.
- Temperature Control (Pre-Bond): RT to 150°C with surface variance of ±5°C.
- Temperature Control (Main Bond Head): RT to 400°C with surface variance of ±5°C.
- Temperature Control (Main Bond Back): RT to 150°C for improved bonding quality.
- Pressure Control (ACF Attachment): 20N to 200N with digital display.
- Pressure Control (Pre-Bond): 20N to 100N with digital display.
- Pressure Control (Main Bond): 20N to 500N with digital display.
- Platform Size: 400mm (W) x 230mm (D).
- Platform Repeat Accuracy: ≤±2μm for consistent positioning.
- Power & Air: AC 220V, 3500W; Compressed air at 0.5~0.7MPa, 60~120L/min.
- Dimensions: 2220mm (W) x 1210mm (D) x 2100mm (H).
- Weight: Approximately 917 kg.
- Platform Height: 1000±30mm.
Product Compatibility:
- LCD Panel Size: Max 17″ (380 x 240mm), Min 5″ (112 x 65mm), thickness 0.2~2.2mm.
- IC Size: L2: 5~40mm, W2: 0.5~3mm, thickness 0.08~0.5mm.
- COF Size: L3: 18~65mm, W3: 8~45mm.
- ACF Width: 0.6~4mm. ACF attachment length: 1~90mm.
- IC to Glass Step Gap: ≥0.4mm.
- ACF Reel: Outer diameter ≤220mm, inner diameters 18~27mm.
Component Brands:
- PLC: Panasonic (Japan)
- HMI: Weinview
- Vision System: Shanghai Shimou / Beijing Boshi
- Servo Motors: Panasonic, Yaskawa, Inovance
- Linear Guides: THK, Kuroda, HIWIN
- Cylinders: SMC, Airtac, CKD
- Valves: Airtac, SMC
ESD Compliance: The OL-CRW017-2 meets strict ESD standards. All consumables and parts are anti-static. Panel surface static remains below ±100V during operation. The machine features ESD grounding at all product handling points. Ground impedance is ≤5Ω. Static dissipation reaches from 1000V to 100V within 4 seconds.
Safety Features: The machine includes interlock design with buzzer alarms and touch screen alerts. All high-temperature and mechanical hazard areas have warning labels. The EMO (emergency stop) cuts all power to servo drives. A buzzer and three-color signal tower provide visual and audible alerts.
Why Choose Olian Automatic for Your COG COF Bonding Needs?
Olian Automatic is a trusted manufacturer of display assembly equipment headquartered in Shenzhen, China. With over two decades of experience, we serve display manufacturers worldwide. Our equipment is designed in ISO-certified facilities and shipped to over 30 countries across Asia, Europe, and North America. .
Sustainability Commitment: The OL-CRW017-2 is designed for energy efficiency. Its optimized thermal management system reduces power consumption. The machine also features low-noise operation and uses environmentally friendly materials in compliance with RoHS standards.
FAQ:
Q: What is a COG COF auto bonding machine used for?
A: A COG COF auto bonding machine bonds ICs and COFs onto display glass panels using ACF adhesive and thermal compression.
Q: What products can the OL-CRW017-2 handle?
A: The OL-CRW017-2 handles rigid glass displays from 5 to 17 inches with IC and COF products.
Q: What is the bonding precision of the OL-CRW017-2?
A: COG main bonding precision is X:±5μm, Y:±5μm. COF precision is X:±6μm, Y:±6μm.
Q: What is the yield rate of the OL-CRW017-2?
A: The OL-CRW017-2 achieves a product qualification rate of ≥98% under normal operating conditions.
Q: How long is the warranty period?
A: Olian Automatic provides a 1-year warranty with lifetime technical support for all equipment.
Q: How long does product changeover take?
A: New product setup takes ≤90 minutes. Existing product changeover takes ≤45 minutes.
Upgrade your display repair line with the OL-CRW017-2, the 17 inch COG COF Auto Bonding Machine that combines precision, speed, and reliability.
Product Tags
17 inch COG COF Auto Bonding Machine, COG Bonding Machine, COF Bonding Machine, Display IC Bonding, ACF Attachment Machine, COG Rework Equipment, COF Auto Bonder, Display Repair Machine, Precision Bonding Machine, Olian Automatic, 17 inch Display Bonding, ACF Bonding Equipment, Semi-Automatic Bonding Machine, Chip on Glass, Chip on Film

