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OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine with Lower-Side Alignment。

The OL-FS003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine featuring servo-driven press control for high-precision thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Unlike pneumatic systems, its servo mechanism delivers superior pressure accuracy, repeatability, and response—ideal for sensitive or high-reliability bonding applications.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.

Alignment Method: Lower-Side Fixed Microscope

The OL-FS003 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.

This “lower-only” alignment approach offers simplicity and reliability for applications where FPC pads allow moderate placement tolerance.

Servo-Controlled Bonding Actuator

A key differentiator of the OL-FS003 is its servo motor-driven press system, replacing traditional pneumatic cylinders. Benefits include:

  • Precise pressure control with digital feedback
  • Programmable press speed and dwell time
  • Reduced mechanical vibration during bonding
  • Higher consistency across thousands of cycles

This makes the OL-FS003 suitable for demanding sectors such as automotive displays, medical devices, and aerospace HMIs.

Dual Independent Workstations

The machine includes two identical, fully independent stations arranged side by side. Each station features:

  • A vacuum-hold glass panel platform
  • A fixed upper area for FPC placement
  • A lower-view optical microscope with coaxial LED lighting
  • A servo-controlled hot press head

Operators can alternate between stations for continuous production, maximizing throughput in pilot lines or small-batch manufacturing.

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC manually, aligning using the lower microscope view.
  4. Presses both start buttons simultaneously (dual-hand safety interlock).
  5. The servo-driven press head descends with controlled force, applies heat for the set duration, then retracts.
  6. Operator removes the bonded panel.

The entire thermal and mechanical cycle is automated once initiated, ensuring repeatable results.

Performance Specifications

  • Temperature range: Up to 400°C
  • Temperature uniformity: ≤ ±5°C across the press head surface
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure controlDigitally regulated via servo system (typical range: 20–300 N, depending on configuration)
  • Standard press head size60 mm × 1.0 mm (custom sizes available)

Heating is delivered via industrial cartridge heaters, monitored by high-accuracy sensors for stable thermal profiles.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: adjustable from 1 mm to 20 mm
  • Failure alarm: If the buffer tape fails to advance, the machine triggers an audible and visual alert

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic head retraction

All critical parameters—temperature, time, pressure profile—are configured via the HMI for process traceability.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 260 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing
    (Note: Air is used for vacuum generation and auxiliary functions; the press itself is servo-electric)

Applications

Ideal for bonding:

  • High-reliability FPCs in automotive instrument clusters
  • Medical display modules requiring consistent pressure
  • Industrial HMIs with strict quality standards
  • IN-CELL touch sensor flexes

Commonly deployed in Tier-1 automotive supply chains, certified electronics manufacturers, and R&D centers.

Important Clarifications

  • No upper-lens or dual-lens vision system – alignment is lower-view only
  • Does NOT bond bare ICs or standard COF chips
  • Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts such as heating elements or buffer rollers)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering installation, servo parameter tuning, alignment technique, and maintenance
  • Lifetime technical support via phone, email, or remote assistance

Model: OL-FS003
Type: Dual-Station Servo-Controlled FOG Main Bonding Machine
Key Innovation: Servo-driven press for precision pressure control
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)

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