High-Coverage Thermal Compression System for Rigid PCB + FPC Assembly
The OL-FFB-156L by Olian Automatic Equipment Co., Ltd. is a semi-automatic thermal compression bonding machine designed for single-side Flexible-on-Board (FOB) assembly of large-format rigid printed circuit boards (PCBs) up to 15.6 inches in diagonal size. It bonds flexible printed circuits (FPCs)—typically pre-laminated with anisotropic conductive film (ACF)—to PCB edge terminals using a long, high-uniformity press head capable of covering extended bond zones in a single stroke.
Unlike its short-head counterpart (OL-FFB-156S), this model is optimized for applications requiring simultaneous bonding across multiple terminal rows or long continuous FPC leads, reducing cycle time and improving process consistency for high-pin-count interfaces such as display driver boards, touch controller modules, or industrial I/O panels.
⚠️ Note: This machine performs thermal compression bonding only—it does not apply ACF, nor does it support chip-on-glass (COG) or optical auto-alignment.
Bonding Principle & Operational Workflow
The OL-FFB-156L follows a manual-load, semi-automatic press workflow tailored for operator-assisted precision:
PCB Loading: The operator places the bare rigid PCB onto the vacuum-equipped worktable.
PCB Fixturing: By pressing the vacuum button (Φ24 mm), the PCB is held flat and immobile during subsequent steps.
FPC Placement: The ACF-pre-laminated FPC—often supported by a temporary glass carrier for rigidity—is manually positioned over the PCB bonding area and roughly aligned.
FPC Fixturing: Vacuum is activated to gently secure the FPC/glass assembly in place.
Manual Visual Alignment: The operator observes the terminal overlap through an external monitor (implied imaging system) and fine-tunes the FPC position by hand to ensure proper registration.
Bond Initiation: The operator presses two start buttons simultaneously (dual-hand safety interlock). The platform then:
Automatically advances forward to the designated bonding position
The long press head descends vertically
Heat and pressure are applied for the preset duration
Upon completion, the head retracts automatically
Unloading: The bonded assembly is removed manually, and the cycle repeats.
This workflow balances operator control with automated pressing—ideal for medium-volume production requiring consistent bond quality.
Key Technical Specifications
Maximum Substrate Compatibility: Supports PCBs up to 15.6-inch diagonal (exact dimensions defined by worktable)
Press Head:
Standard length: 200 mm × 2.0 mm (long profile for wide or multi-row coverage)
Customization: Available per customer drawing for non-standard layouts
Temperature Control:
Press head range: Room temperature to 400°C
Surface uniformity: ≤ ±8°C across the entire 200 mm length
Back pressure plate: RT to 150°C, uniformity ≤ ±5°C (provides counter-support to prevent PCB warpage)
Bonding Time: Adjustable from 0.1 to 99.9 seconds
Bonding Force: 55 N to 1000 N, pneumatically regulated for repeatable contact pressure
Heating System:
Cartridge heaters: Φ9.5 mm × 45 mm embedded in the head
Temperature feedback: K-type thermocouples for closed-loop PID control
Control, Safety & ESD Protection
Operator Interface: Color touchscreen HMI for setting time, temperature, and monitoring status
Start Mechanism: Dual Φ24 mm push buttons requiring simultaneous press—ensures hands are clear during actuation
Emergency Stop: Φ22 mm mushroom-type EMO switch that cuts power to motion systems and enables manual platform override
Visual/Audible Alarms:
Three-color signal tower (green = ready, yellow = running, red = fault)
Buzzer for error alerts
ESD Safeguards:
All surfaces in contact with PCB/FPC use anti-static materials
Static voltage on panel surface maintained < ±100 V
Static decay performance: 1000 V → 100 V in ≤4 seconds
Grounding resistance: ≤5 Ω
Wrist strap sockets provided at material handling stations
These measures ensure compatibility with sensitive electronic assembly environments.
Mechanical Design & Utility Requirements
Frame: Heavy-duty steel construction with precision linear guides for smooth platform motion
Motion System: Servo-driven stage for accurate front-back positioning
Power Supply: Single-phase 220V AC, typical power draw ~2.5–3.5 kW (inferred from heater count and temp range)
Compressed Air: Required for press actuation and vacuum generation (0.5–0.7 MPa, clean and dry)
Applications
Ideal for bonding:
High-pin-count FPCs on large LCD/OLED display driver PCBs
Multi-row connector interfaces in automotive infotainment systems
Industrial control panels with extended flex tails
Medical imaging device backplanes requiring full-length terminal adhesion
Particularly advantageous when uniform pressure and temperature across a long bond line are critical to reliability.
Important Clarifications
Single-side bonding only: FPC is bonded to one edge of the PCB
Manual alignment: No auto-vision or motorized X/Y correction—alignment is operator-performed under monitor guidance
ACF must be pre-applied: Machine assumes ACF is already laminated on PCB or FPC
Designed for rigid PCBs, not glass substrates (unlike FOG machines)
Long press head: Enables single-stroke bonding of extended zones but requires sufficient clearance for the 200 mm head
Training, Warranty & After-Sales Support
Olian Automatic provides end-to-end support:
Documentation: One Chinese-language operation manual included
On-Site Training: One full day covering:
Machine installation and leveling
Parameter setup (temp/time/force calibration)
Routine maintenance and heater/thermocouple replacement
Troubleshooting common alarms and errors
Warranty: 12 months on mechanical and electrical components under normal operating conditions
Exclusions: Consumables (seals, buttons), damage from misuse, or force majeure events
Service Commitment:
Remote diagnostics via phone or email
On-site engineer dispatch within 72 hours if remote resolution fails during warranty period
Lifetime technical support available post-warranty
Standard Included Components
Custom long press head (200 mm × 2.0 mm)
K-type thermocouples and Φ9.5 mm cartridge heaters
Φ24 mm vacuum and dual start buttons
Φ22 mm emergency stop switch
Set of national-standard (GB) maintenance tools
Model: OL-FFB-156L Type: Semi-Automatic Single-Side FOB Bonder with Long Press Head Substrate: Rigid PCB (up to 15.6″) + FPC with glass carrier Key Advantage: Single-stroke bonding of extended or multi-row terminal zones Operation: Manual load/align → dual-hand start → auto advance & press → manual unload
SEO Keywords: 15.6 inch FOB bonding machine with long head, OL-FFB-156L Olian, single-side flexible-on-board thermal press, 200mm hot bar bonder for PCB, multi-zone FPC to rigid board bonding equipment, high-force thermal compression machine for display drivers, long press head FOB bonder, ESD-safe FPC bonding workstation, semi-automatic FOB press for automotive PCBs, 400°C hot bar with back pressure support.
