OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

The OL-FC005 by Olian Automatic is an integrated dual-station COF(chip on film) FOG (Film-on-Glass) bonding system that combines pre-bonding and main bonding in a single machine. The left station performs pulse pre-bonding to temporarily tack flexible circuits (FPC or COF) onto LCD panels, while the right station executes full main bonding to permanently cure the joint—streamlining workflow and reducing handling errors.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It does not apply ACF, nor does it support IC chip bonding.

Dual-Function Workflow

• Left Station: Manual pre-bonding using short thermal pulses to lightly fix the FPC or COF in place.
• Right Station: Manual main bonding using sustained heat and pressure for full ACF curing.

Operators first align and pre-bond the panel on the left, then transfer it directly to the right station for final bonding—enabling efficient, two-step processing without leaving the workstation.

Alignment Method: Lower-Side Microscope Only

Both stations use a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below. The COF /FPC is positioned manually from above using visual estimation.

This “lower-only” method provides a practical balance of simplicity and accuracy for mid-precision applications.

Performance Specifications

• Temperature range: Up to 400°C
• Temperature uniformity: ≤ ±8°C across the press head
• Heating/bonding time: Adjustable from 0.1 to 99.9 seconds
• Pressure range: 20 N to 300 N, pneumatically controlled
• Standard press head size: 50 mm × 0.8 mm (custom sizes available)

Both stations feature independent temperature and time settings to optimize pre-tack and main-cure profiles separately.

Buffer Material Handling

Each station includes an automatic buffer tape feed system to protect the FPC during pressing:

• Buffer roll inner diameter: ≥33 mm
• Outer diameter: ≤80 mm
• Feeding pitch: 1–20 mm
• Failure detection: If the buffer tape fails to advance, the machine triggers an audible and visual alarm

Two independent buffer systems ensure reliable protection at both pre-bond and main bond stages.

Control System & Safety

• Control unit: PLC-based logic with color touchscreen interface
• Manual controls: Physical vacuum, start, and emergency stop buttons
• Safety features: Dual-hand start requirement and emergency stop switches

All parameters—temperature, time, pressure—are set independently for each station via the HMI.

Physical Dimensions & Utilities

• Machine size: 900 mm (W) × 860 mm (D) × 1450 mm (H)
• Weight: Approximately 280 kg
• Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
• Compressed air: 0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

The compact footprint integrates seamlessly into production lines or R&D labs.

Applications

Ideal for two-stage bonding of:

• COF FPCs for automotive displays
• IN-CELL touch sensor modules
• Industrial and medical display assemblies

Commonly used where process control, reduced contamination, and workflow efficiency are critical.

Important Clarifications

• COF FPC Pre-bond + main bond only – no ACF lamination
• No upper-lens or dual-lens vision – alignment is lower-view only
• also can do IC main bonding
• Designed for rigid glass panels up to 7 inches
• Both stations are manual alignment, semi-automatic pressing

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

• One-year warranty on mechanical and electrical systems (excludes wear parts like heaters or buffer rollers)
• On-site service within 72 hours if remote support fails during warranty
• One-day hands-on training covering dual-station operation, parameter setup, alignment technique, and maintenance
• Lifetime technical support via phone or email

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Model: OL-FC005
Type: Integrated Dual-Station COF /FOG Machine (Pre-Bond + Main Bond)
Layout: Left = Pre-Bond | Right = Main Bond
Max Panel Size: 7 inches (rigid glass)
Key Advantage: Streamlined two-step bonding in one workstation

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