OL-F0712 – 15.6-Inch Dual-Station FOG Bonding Machine with Top & Bottom Vision Alignment
OL-F0712 – 15.6-Inch Dual-Station FOG Bonding Machine
Ultra-High-Precision Thermal Compression System for Front & Rear COF/FOG Bonding on LCD Panels
The OL-F0712 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station FOG (Film-on-Glass) bonding machine engineered for the final thermal compression of COF (Chip-on-Film) flex circuits onto both front and rear edges of large-format rigid LCD panels up to 15.6 inches. What sets it apart is its dual-camera vision system—featuring simultaneous top-view and bottom-view alignment—enabling unparalleled registration accuracy between COF terminals and ITO pads, even on multi-layer, opaque, or high-density interconnect (HDI) panels.
Combined with dual independent workstations, the OL-F0712 delivers both micron-level precision and continuous production throughput, making it ideal for demanding applications in automotive displays, medical imaging, avionics, and premium consumer electronics.
⚠️ Note: This machine assumes that ACF has already been applied to the panel. It performs final main bonding only, not ACF lamination or pre-bonding.
🔍 Key Technical Features
✅ Dual-Vision Alignment System (Top + Bottom)
Camera Configuration:
Top Camera: Views COF from above
Bottom Camera: Images panel pads through glass substrate
Lens Magnification: 2× optical zoom (per camera)
Field of View (FOV): 1.9 mm × 1.4 mm
Lighting: Coaxial LED illumination on both sides for glare-free, shadow-free imaging
Inter-Camera Distance: Adjustable from 12 mm to 90 mm to match various COF pitches
Alignment Method: Operator manually fine-tunes X/Y/θ alignment using live split-screen view until COF and pad patterns are perfectly overlaid
This stereo alignment capability eliminates parallax and layer-shift errors—critical for panels with black matrix, touch sensors, or embedded layers.
✅ Dual-Station Continuous Workflow
Two independent vacuum platforms enable parallel operation:
While Station 1 performs bonding, the operator loads/unloads Station 2
Reduces cycle time by up to 40% compared to single-station machines
Optimized for high-mix, medium-to-high volume production
✅ Bonding Performance
Panel Compatibility:
Max Size: 350 mm × 250 mm (~15.6″ diagonal)
Thickness: 0.2 – 2.2 mm
COF Specifications:
Width: 12 – 30 mm
Length: 12 – 60 mm
Thickness: 0.02 – 0.2 mm
Bonding Force: Servo-controlled, 20–120 N (repeatability ≤ ±3 N)
Temperature Range: Up to 400°C with surface uniformity ≤ ±2°C
Industrial HMIs with high-reliability requirements
High-end laptops and tablets with narrow bezels
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