OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine with Dual-Side (Upper & Lower) Vision Alignment and 150 mm Press Head

The OL-F0712 by Olian Automatic is a high-precision dual-station FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 12 inches. It features dual-side optical alignment—simultaneously viewing both the panel terminals from below and the FPC pads from above—enabling accurate manual registration for demanding display applications.

The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.

Dual-Side (Upper & Lower) Vision Alignment

Unlike lower-only systems, the OL-F0712 integrates two coaxial LED-lit microscopes:

• Lower lens: Views terminal marks on the glass panel through a transparent stage
• Upper lens: Views alignment marks on the FPC from above

Both images are visible simultaneously through a split-view optical path or dual eyepieces (as per design), allowing the operator to manually align FPC and panel with higher precision—critical for narrow-pitch or high-density connectors.

• Lens magnification: 2×
• Field of view: 1.9 mm × 1.4 mm
• Inter-lens distance: Adjustable from 11 mm to 150 mm to accommodate various panel layouts

This “top-and-bottom” alignment method significantly improves placement accuracy over single-view systems.

Extended 150 mm Press Head

The machine is equipped with a 150 mm long hot press head, ideal for:

• Bonding wide FPCs (e.g., full-edge automotive displays)
• Simultaneously pressing multiple connector zones
• Reducing repositioning during complex bonding sequences

Standard head thickness is 1.0 mm, with custom profiles available.

Dual Independent Workstations

Two fully independent stations enable continuous operation:

• Each station includes dual-side vision, vacuum hold-down, and automatic press
• Operators can load/unload one station while the other is bonding
• Ideal for medium-volume production or pilot lines requiring high uptime

Bonding Process

1. Operator places the ACF-pre-laminated panel on the transparent stage.
2. Activates vacuum to secure the panel.
3. Places the FPC and aligns it using simultaneous upper/lower microscope views.
4. Presses both start buttons (dual-hand safety).
5. The 150 mm press head descends automatically, applying heat and pressure.
6. After curing, the head retracts. Operator removes the bonded panel.

The thermal cycle is fully automated once initiated.

Performance Specifications

• Temperature range: Up to 400°C
• Temperature uniformity: ≤ ±5°C across the press head
• Bonding time: Adjustable from 0.1 to 99.0 seconds
• Pressure range: 45 N to 600 N, pneumatically regulated
• Press head size: 150 mm × 1.0 mm (standard)

Heating is delivered via industrial cartridge heaters with real-time temperature feedback.

Buffer Material Handling

Each station includes an automatic buffer tape feed system:

• Buffer roll inner diameter: ≥33 mm
• Outer diameter: ≤80 mm
• Feeding pitch: 1–20 mm
• Failure alarm: Machine alerts if buffer tape fails to advance

This protects the FPC surface during pressing and ensures consistent bond quality.

Control System & Safety

• Control unit: PLC-based logic with color touchscreen interface
• Manual controls: Physical vacuum, start, and emergency stop buttons
• Safety features: Dual-hand start interlock, emergency stop switch, and automatic head retraction

All parameters are independently configurable per station via the HMI.

Physical Dimensions & Utilities

• Machine size: 1100 mm (W) × 860 mm (D) × 1650 mm (H)
• Weight: Approximately 320 kg
• Power supply: Single-phase 220V AC, 2500W, 3-wire (1.5 mm²)
• Compressed air: 0.5–0.7 MPa, flow 250 L/min, via Φ8 mm tubing

Designed for integration into cleanrooms or controlled manufacturing environments.

Applications

Ideal for bonding:

• Large-format automotive center-stack displays
• Industrial HMIs up to 12 inches
• IN-CELL and ON-CELL touch modules
• High-reliability medical or avionics displays

Commonly used where dual-side alignment and wide bonding capability are essential.

Important Clarifications

• Does NOT apply ACF – requires pre-laminated materials
• Does NOT bond bare ICs or COF chips
• Designed for rigid glass panels only
• Alignment is manual, but enhanced by dual optical views

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

• One-year warranty on mechanical and electrical systems (excludes wear parts)
• On-site service within 72 hours if remote troubleshooting fails during warranty
• One-day hands-on training covering dual-vision alignment, parameter setup, and maintenance
• Lifetime technical support via phone, email, or remote assistance

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Model: OL-F0712
Type: Dual-Station Main Bonding Machine with Dual-Side Vision
Max Panel Size: 12 inches (rigid glass)
Key Features: Upper + lower alignment, 150 mm press head, dual independent stations

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