OL-ECB800 Fully Automatic EC+COG Bonder

OL-ECB800 Fully Automatic EC+COG Bonder

The OL-ECB800 is a highly advanced fully automatic EC+COG (Chip on Glass) bonder designed to meet the precise manufacturing requirements of modern electronics production. This machine specializes in automatic wiping, ACF (Anisotropic Conductive Film) application, pre-bonding, and main bonding processes for LCD products ranging from 1″ to 10.1″ in size. Its innovative design and high-precision features make it an essential tool for manufacturers seeking efficiency, accuracy, and reliability in their production lines.

Equipment Information

• Equipment Name: Fully Automatic EC+COG Bonder
• Model: OL-ECB800
• Application: Suitable for LCD products with sizes from 1″ to 10.1″, designed for automatic wiping, ACF application, pre-bonding, and main bonding of single-sided, single-segment products.
• Compatibility: Can be integrated with other machines in a production line for seamless operation.

Working Principle

The OL-ECB800 operates through a series of coordinated mechanical and automated processes. The workflow begins with the loading of the product onto the conveyor belt or platform, either manually or via an automated upstream machine. Mechanical arm 1# picks up the product, corrects its position using the CCD (Charge-Coupled Device) system, and places it on the wiping platform. The wiping platform advances, and the wiping and plasma cleaning processes are completed across the entire wiping area.

Next, mechanical arm 2# transfers the LCD to the ACF platform. The ACF platform advances, and the bonding head descends to apply the ACF. After the ACF application, the platform retracts to the unloading position. Mechanical arm 3# then picks up the LCD, checks the ACF adhesion, and places it on the pre-bonding stage. Meanwhile, the IC is loaded, and the automatic feeding system visually corrects the IC position. After pre-alignment, the IC is moved to the bonding head position, and the bonding head picks it up for pre-bonding. Mechanical arm 4# moves the product to one of the three main bonding platforms for final bonding. Finally, mechanical arm 5# transfers the bonded LCD to the downstream conveyor or production line.

Product Specifications

LCD Specifications

• Size Range: Minimum 20mm x 15mm, Maximum 230mm x 165mm, Thickness 0.15mm to 1.1mm.
• Alignment Marks: Pitch 5-35mm between any two points on the glass, Mark size 200µm to 1000µm.

Cleaning Cloth Specifications

• Type: Roll-based (number of rolls: 2).
• Width: ≤ 10mm.
• Maximum Roll Diameter: ≤ 300mm.
• Roll Inner Hole Diameter: ≥ 24.5mm.
• Feed Length: Adjustable from 0.1mm to 99.9mm.

Cleaning Solvent

• Type: Alcohol or acetone.

IC Specifications

• Terminal Pitch: ≥ 20µm.
• Alignment Marks: Pitch 5mm to 70mm.

ACF Specifications

• Types: Roll-based, 2-layer or 3-layer.
• Application Length: 5mm to 80mm (adjustable based on bonding head length and customer requirements).
• Application Width: 0.5mm to 5.0mm.
• Reel Specifications: Inner diameter options of 18mm and 25mm, Maximum reel diameter 200mm.

Buffer Material Specifications

• ACF Section: Single-piece buffer material, manually clamped.
• Main Bonding Section: Roll-based, automatic front-to-back rotation.
• Reel Dimensions: Outer diameter ≤ 100mm, Inner hole diameter 32mm.
• Width: Adjustable from 5mm to 20mm.
• Feed Frequency: Adjustable from 1 to 999 cycles for automatic tape rotation.
• Feed Length: Single-step length adjustable from 1mm to 99mm.

Machine Performance

Water Drop Angle

• Water Drop Angle: ≤ 20 degrees (PT300 ultra-low temperature plasma), depending on actual conditions.

Production Accuracy

• ACF Application Accuracy: ±0.2mm in X-axis, ±0.15mm in Y-axis.
• IC Pre-bonding Accuracy: ±3µm in X-axis, ±3µm in Y-axis.
• IC Main Bonding Accuracy: ±5µm in X-axis, ±5µm in Y-axis.

Production Cycle

• Cycle Time: ≤ 4.5 seconds per piece.
• ACF Application Time: ≤ 0.5 seconds.
• Pre-bonding Time: ≤ 0.5 seconds.
• Main Bonding Time: ≤ 12 seconds.
• Variation based on product size.

Product Type

• Supported Type: Single-sided, single IC.

Model Changeover

• New Model Setup: ≤ 60 minutes.
• Existing Model Recall: ≤ 30 minutes, depending on the operator’s proficiency.

Equipment Yield

• Yield: ≥99.5% (excluding material issues).

Process Parameter Specifications

Temperature Control

• Setting Range:
  • ACF-bonding: Room Temperature (RT) to 150°C.
  • Pre-bonding: RT to 150°C.
  • Main-bonding: RT to 400°C.
• Heating Method: Constant heat.
• Control Method: Touchscreen setting with 1°C increments, PID control.
• Temperature Uniformity: ±5°C.
• Thermocouple Type: K type.

Time Setting

• Setting Range:
  • ACF-bonding: 0.1 to 9.9 seconds.
  • Pre-bonding: 0.1 to 9.9 seconds.
  • Main-bonding: 0.1 to 99.9 seconds.
• Setting Method: Configured via touchscreen interface with 0.1-second increments.

Pressure Control

• Adjustment Range:
  • ACF-bonding: 10 to 150N.
  • Pre-bonding: 10 to 150N.
  • Main-bonding: 20 to 400N.
• Control Method: Precision pressure regulator with 0.02Mpa increments.

General Machine Specifications

Dimensions and Weight

• Machine Length: Approximately 3650mm (excluding feed).
• Machine Width: Approximately 1500mm.
• Machine Height: Approximately 1800mm (excluding FFU and tri-color light).
• Working Height: 1000mm.
• Machine Weight: Approximately 3300kg.
• Color: White, with customization options available.

Environmental and Power Requirements

• Operating Environment: Class 1000 or lower cleanroom.
• Power Supply: Single-phase AC 220V±10%, 50 Hz, with a 2-meter power cord for connection to factory power (three-phase 380V available upon request).
• Power Consumption: Maximum 7KW.

Air and Vacuum Supply

• Air Supply: Clean compressed air with a minimum pressure of 0.5-0.7MPa, consumption approximately 150L/min.
• Vacuum Supply: Built-in vacuum pump (200L/min) and storage tank. Optional customer-provided vacuum source with a 12mm diameter hose connection. Vacuum level: ≥ -70Kpa (≥ 525mm Hg), flow approximately 150L/min.

Safety Features

• Emergency Stop: Equipped with anti-misoperation covers.
• Interlocked Design: Ensures machine safety during operation.
• Audible and Visual Alarms: Alerts for errors or operator attention via the touchscreen.
• Safety Labels: Warnings for electrical shock, mechanical injury, etc., in hazard areas.

Equipment Unit Specifications

Feeding and Discharging

• Feeding: Conveyor belt loading.
• Discharging: Conveyor belt unloading, direct handover to downstream machines.

Solvent Supply Unit

• Solvent Control: Dosed by peristaltic dispensing equipment.
• Solvent Drop Volume: Adjustable per drop.

Cleaning Cloth Supply Unit

• Cleaning Cloth Movement: Stepper motor + polyurethane roller.
• Cleaning Cloth Tensioning: Magnetic damping, adjustable force.
• Cleaning Cloth Recycling: Torque motor + magnetic damping, roll-based recycling.
• Cleaning Cloth Length Control: Stepper motor, adjustable length via operation interface.
• End-of-Tape Detection: Sensor detects when the cleaning cloth roll is finished.

Cleaning Air Claw Unit

• Air Claw Gap Height: Adjustable via micrometer, travel 5mm.
• Air Claw Flatness: Adjustable relative flatness of upper and lower clamping surfaces.

PLAMA Unit

• Plasma Cleaning: Low-temperature plasma, measured around 100°C.

Robotic Arms

• Mechanical Arm 1# (from Feeding Conveyor to Wiping Platform):
  • Vacuum nozzles with adjustable numbers and configurations based on product size.
  • Digital vacuum gauge for real-time monitoring.
  • X-axis: Servo motor + rail.
  • θ-axis: Stepper motor.
  • Z-axis: Sliding table cylinder with manually adjustable position.
  • Completes product correction and transfer to the next process.
• Mechanical Arm 2# (from Wiping Stage to ACF Stage):
  • Vacuum nozzles with adjustable numbers and configurations based on product size.
  • Digital vacuum gauge for real-time monitoring.
  • X-axis: Servo motor + rail.
  • θ-axis: Stepper motor for next-process angle adjustment.
  • Z-axis: Sliding table cylinder with manually adjustable position.
• Mechanical Arm 3# (from ACF Stage to Pre-bonding Stage):
  • Vacuum nozzles with adjustable numbers and configurations based on product size.
  • Digital vacuum gauge for real-time monitoring.
  • X-axis: Linear motor + rail.
  • Z-axis: Sliding table cylinder with manually adjustable position.
• Mechanical Arm 4# (from Pre-bonding Stage to Main Bonding Platform):
  • Vacuum nozzles with adjustable numbers and configurations based on product size.
  • Digital vacuum gauge for real-time monitoring.
  • X-axis: Linear motor + rail.
  • θ-axis: Stepper motor for next-process angle adjustment.
  • Z-axis: Sliding table cylinder with manually adjustable position.
• Mechanical Arm 5# (from Main Bonding Stage to Discharge Conveyor):
  • Vacuum nozzles with adjustable numbers and configurations based on product size.
  • Digital vacuum gauge for real-time monitoring.
  • X-axis: Linear motor + rail.
  • Z-axis: Sliding table cylinder with manually adjustable position.

ACF Unit

• ACF Cutter:
  • Cutting Method: Automatic semi-cutting.
  • Depth Adjustment: Micrometer fine adjustment.
  • Blade Movement: Cylinder-driven up and down, with adjustable X-axis position.
• ACF Head:
  • Number of Bonding Heads: 1.
  • Drive Method: Cylinder + rail.
  • Pressure Control: Cylinder control with precision pressure regulator.
  • Material: SUS440C (customizable).
  • Dimensions: W 2mm × L 70mm (customizable).
  • Surface Flatness: ≤ 5µm.
• ACF Stage:
  • Y-axis Movement: Servo motor + ball screw + rail.
  • Z-axis Movement: Manual sliding table.
  • Vacuum: 1mm hole diameter, 2mm vacuum slot width.
  • Material: Aluminum with anodized hard oxidation treatment.
  • Flatness: ±0.02mm.
• ACF Backup:
  • Material: Quartz.
  • Dimensions: L100mm × W10mm × H18mm.
  • Surface Flatness: ≤ 5µm.
• ACF Inspection: CCD inspection system.
• ACF Supply:
  • Operation Method: Torque motor.
  • Reel Tensioning: Belt tensioning structure.
  • Protective Film Recovery: Vacuum吸取 to waste bin.
  • Separation Rod Movement: Cylinder-driven rod.

IC Pre-bonding Unit

• Pre-bonding Head:
  • Number of Bonding Heads: 1.
  • Z-axis Drive: Servo motor + ball screw + rail.
  • Y-axis Transmission: Servo motor + ball screw + rail.
  • Pressure Control: Cylinder control with precision pressure regulator.
  • Material: SUS 440C.
  • Dimensions: W 1.2mm × L 80mm (customizable).
  • Surface Flatness: ≤ ±3µm.
  • Vacuum: Segmentable vacuum selection with vacuum detection.
• Pre-bonding Stage:
  • X-axis Movement: Servo motor + ball screw + rail.
  • Y-axis Movement: Servo motor + ball screw + rail.
  • Z-axis Movement: Manual sliding table.
  • θ-axis: DD motor.
  • Vacuum: 1mm hole diameter, 2mm vacuum slot width.
  • Material: Aluminum with anodized hard oxidation treatment.
  • Flatness: ±0.02mm.
• Pre-bonding Backup:
  • Material: Quartz strip.
  • Dimensions: L136mm × W10mm × H12mm.
  • Surface Flatness: ≤ ±5µm.

IC Main Bonding Unit

• Main Bonding Head:
  • Number of Bonding Heads: 3.
  • Drive Method: Servo motor + cylinder + rail.
  • Pressure Control: Cylinder control with precision pressure regulator.
  • Material: SUS440C.
  • Dimensions: W 5.0mm × L 60mm (customizable).
  • Surface Flatness: ≤ ±2µm.
• Main Bonding Stage:
  • Y-axis Movement: Servo motor + ball screw + rail.
  • Z-axis Movement: Closed-loop stepper + cam structure.
  • Vacuum: 1mm hole diameter, 2mm vacuum slot width.
  • Material: Aluminum with anodized hard oxidation treatment.
  • Flatness: ±0.02mm.
• Main Bonding Backup:
  • Material: Quartz.
  • Dimensions: L80mm × W12mm × H18mm.
  • Surface Flatness: ≤ ±2µm.
• Buffer Material Supply:
  • Rotation Method: Stepper motor drive.
  • Rotation Direction: Automatic front-to-back rotation.
  • Width Adjustment: Manual width adjustment with limit wheel.
  • Sensor detection for tape end monitoring.

Image Processing Unit

• LCD Correction:
  • System: Bos视 image processing system.
  • CCD: 1.
  • Coaxial Light Barrel: 1.
  • Magnification: 1x.
  • Field of View: 4.8mm × 3.6mm.
  • Light Source: Coaxial light LED.
  • Z-axis Adjustable Travel: 10mm.
• Pre-bonding Alignment:
  • System: Bos视 image processing system.
  • CCD Cameras: 2.
  • Coaxial Light Barrels: 2.
  • Magnification: 4x.
  • Field of View: 1.2mm × 0.9mm.
  • Light Source: Coaxial light LED.
  • Alignment Method: Mark coincidence.
• IC Feeding:
  • System: Bos视 image processing system.
  • CCD Camera: 1.
  • Coaxial Light Barrel: 1.
  • Magnification: 1x.
  • Field of View: 4.8mm × 3.6mm.
  • Light Source: Coaxial light LED.
  • Z-axis Adjustable Travel: 10mm.
• ACF Inspection:
  • System: Bosch detection system.
  • CCD: 1.
  • Coaxial Light Barrel: 1.
  • Magnification: 0.5x.
  • Field of View: 9.6mm × 7.2mm.
  • Light Source: Coaxial light LED.

Control Unit

• Control Method: PLC control.
• Touchscreen:
  • Interface: Chinese, touch-enabled.
  • Modes: Manual and automatic.
  • Functions: Parameter display.
• Manual Control Buttons:
  • Emergency Stop Buttons: 3.
  • Main Power Switch: 1.
  • Lighting Power Switch: 1.
• Access Control: Machine pauses when doors are opened during operation.
• Operation Indicator Lights: Tri-color lights.

Documentation and After-sales Service

• Documentation: Machine operation manual included.
• Training: Covers installation, operation, calibration, maintenance, troubleshooting, and safety precautions.
• After-sales Service: One year of free service for non-human-induced faults, with lifelong technical support.

Main Component Brands

• Servo Motors: Fuji (Japan).
• Angle Motors: Huichuan (Japan).
• Linear Motors: Yakobes/Linea/Tongxin (China/China/China).
• Ball Screws: THK/Hiwin/TBI (Japan/China/China).
• Guideways: THK/Hiwin/TBI (Japan/China/China).
• Pneumatic Components: SMC/Airtac (Japan/China).
• PLC: Keyence (Japan).
• Touchscreen: Proface (Japan).
• Sensors: Panasonic/Huan (Japan/China).
• Power Supply: Mean Well (China).
• Circuit Breakers and Contactors: Schneider (China).
• Drag Chains: Igus (Germany).
• Emergency Stop and Switch Buttons: Schneider (China).
• FFU (Stainless Steel): Yunfeng (China).

In summary, the OL-ECB800 Fully Automatic EC+COG Bonder represents a significant advancement in the field of LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.