The OL-ECB1500A is a cutting-edge fully automatic EC+COG/COF bonding machine designed to meet the precise manufacturing requirements of modern electronics production. This advanced equipment is specifically tailored for the automatic wiping, ACF (Anisotropic Conductive Film) application, pre-bonding, and main bonding processes of single-sided, single-component LCD products ranging from 1″ to 10.1″ in size. Its innovative design and high-precision features make it an essential tool for manufacturers seeking efficiency, accuracy, and reliability in their production lines.
Application: Suitable for LCD products with sizes from 1″ to 10.1″, designed for automatic wiping, ACF application, pre-bonding, and main bonding of single-sided, single-component products.
Compatibility: Can be integrated with other machines in a production line for seamless operation.
Working Principle
The OL-ECB1500A operates through a series of coordinated mechanical and automated processes. The workflow begins with the loading of the product onto the conveyor belt or platform, either manually or via an automated upstream machine. Mechanical arm 1# picks up the product, corrects its position using the CCD (Charge-Coupled Device) system, and places it on the wiping platform. The wiping platform advances, and the wiping and plasma cleaning processes are completed across the entire wiping area.
Next, mechanical arm 2# transfers the LCD to the ACF platform. The ACF platform advances, and the bonding head descends to apply the ACF. After the ACF application, the platform retracts to the unloading position. Mechanical arm 3# then picks up the LCD, checks the ACF adhesion, and places it on the pre-bonding stage. Meanwhile, the IC/COF is loaded, and the automatic feeding system visually corrects the IC/COF position. After pre-alignment, the IC/COF is moved to the bonding head position, and the bonding head picks it up for pre-bonding. Mechanical arm 4# moves the product to one of the three main bonding platforms for final bonding. Finally, mechanical arm 5# transfers the bonded LCD to the downstream conveyor or production line.
Product Specifications
LCD Specifications
Size Range: Minimum 20mm x 20mm, Maximum 230mm x 120mm, Thickness 0.15mm to 1.1mm.
Alignment Marks: Pitch ≥ 5mm between any two points on the glass, Mark size 200µm to 800µm.
Cleaning Cloth Specifications
Type: Roll-based (number of rolls: 2).
Width: ≤ 10mm.
Maximum Roll Diameter: ≤ 300mm.
Roll Inner Hole Diameter: ≥ 24.5mm.
Feed Length: Adjustable from 0.1mm to 99.9mm.
Cleaning Solvent
Type: Alcohol or acetone.
IC/COF Specifications
Terminal Pitch: ≥ 30µm.
Alignment Marks: Pitch 5mm to 70mm.
ACF Specifications
Types: Roll-based, 2-layer or 3-layer.
Application Length: 5mm to 80mm (adjustable based on bonding head length and customer requirements).
Application Width: 0.5mm to 5.0mm.
Reel Specifications: Inner diameter options of 18mm and 25mm, Maximum reel diameter 200mm.
Feed Frequency: Adjustable from 1 to 999 cycles for automatic tape rotation.
Feed Length: Single-step length adjustable from 1mm to 99mm.
Machine Performance
Water Drop Angle
Water Drop Angle: ≤ 25 degrees, depending on actual conditions.
Production Accuracy
ACF Application Accuracy: ±0.2mm in X-axis, ±0.15mm in Y-axis.
IC/COF Pre-bonding Accuracy: ±3µm in X-axis, ±3µm in Y-axis.
IC/COF Main Bonding Accuracy: ±5µm in X-axis, ±5µm in Y-axis (related to COF material expansion coefficient).
Production Cycle
Cycle Time: ≤ 4.5-5 seconds per piece.
ACF Application Time: ≤ 0.5 seconds.
Pre-bonding Time: ≤ 0.5 seconds.
Main Bonding Time: ≤ 12 seconds.
Variation based on product size.
Product Type
Supported Type: Single-sided, single IC/COF.
Model Changeover
New Model Setup: ≤ 60 minutes.
Existing Model Recall: ≤ 30 minutes, depending on the operator’s proficiency.
Equipment Yield
Yield: ≥99.5% (excluding material issues).
Process Parameter Specifications
Temperature Control
Setting Range:
ACF-bonding: Room Temperature (RT) to 150°C.
Pre-bonding: RT to 150°C.
Main-bonding: RT to 400°C.
Heating Method: Constant heat.
Control Method: Touchscreen setting with 0.1°C increments, PID control.
Temperature Uniformity: ±5°C.
Thermocouple Type: K type.
Time Setting
Setting Range:
ACF-bonding: 0.1 to 9.9 seconds.
Pre-bonding: 0.1 to 9.9 seconds.
Main-bonding: 0.1 to 99.9 seconds.
Setting Method: Configured via touchscreen interface with 0.1-second increments.
Pressure Control
Adjustment Range:
ACF-bonding: 10 to 150N.
Pre-bonding: 10 to 150N.
Main-bonding: 20 to 400N.
Control Method:
ACF and pre-bonding: Precision pressure regulator.
Main-bonding: Proportional valve with analog control, adjustable via touchscreen with 0.002Mpa increments.
General Machine Specifications
Dimensions and Weight
Machine Length: Approximately 3210mm (including 620mm conveyor extension).
Machine Width: Approximately 1400mm.
Machine Height: Approximately 1800mm (excluding FFU and tri-color light).
Working Height: 1000mm.
Machine Weight: Approximately 3500kg.
Color: White, with customization options available.
Environmental and Power Requirements
Operating Environment: Class 1000 or lower cleanroom.
Power Supply: Single-phase, AC 220V±10%, 50 Hz, with a 2-meter external power cord for connection to factory power (other interfaces available upon request).
Circuit Breakers and Contactors: Schneider (France) / Shihlin (Taiwan).
Drag Chains: Igus (Germany).
Equipment 2D Drawing
A detailed 2D drawing of the equipment is available, providing a clear visual representation of the machine’s layout and components. This drawing serves as a valuable reference for installation, maintenance, and integration into production lines.
In summary, the OL-ECB1500A Fully Automatic EC+COG/COF Bonding Machine represents a significant advancement in the field of LCD manufacturing equipment. Its precise engineering, user-friendly design, and comprehensive support make it an ideal choice for manufacturers seeking to enhance productivity and product quality in the competitive electronics market.
