OL-CBS003 7-Inch Dual-Station Manual Pre-Bonding and Main Bonding Machine for COG Assembly.
OL-CBS003 7-Inch Dual-Station Manual Pre-Bonding and Main Bonding Machine
The OL-CBS003 by Olian Automatic is a purpose-built manual thermal bonding system designed exclusively for Chip-on-Glass (COG) assembly of rigid LCD panels up to 7 inches.
This dual-station machine integrates two critical stages of the COG process—pre-bonding and main bonding—into a single, space-efficient platform, enabling reliable attachment of bare driver ICs to glass substrates that have already been pre-laminated with anisotropic conductive film (ACF).
The OL-CBS003 assumes ACF has been applied in a prior step using a separate laminating machine. It does not perform ACF application, electrode cleaning (EC), FPC handling, or FOG bonding.
Instead, it focuses solely on precision thermal compression to ensure high-yield IC-to-glass interconnection—making it ideal for repair centers, R&D labs, pilot lines, and low-volume display production.
Dual-Station Workflow for Optimal Efficiency
The machine features two independent workstations arranged side by side:
On the left station, operators manually place an ACF-pre-applied LCD panel and align a bare IC onto the terminal area using visual aids or optional microscopes.
Activating the cycle lowers the pre-bonding head—typically sized at 20 mm × 2.0 mm—to apply moderate heat and light pressure. temporarily securing the IC in position without full curing.
After pre-bonding, the operator moves the panel to the right station, where the main bonding head—standard size 40 mm × 4.0 mm—executes the final bonding cycle.
This stage uses higher temperature and pressure for a precisely controlled duration to fully cure the ACF, creating a permanent electrical and mechanical bond.
Both stations operate independently, allowing one operator to manage the entire sequence efficiently while minimizing cross-contamination and handling errors.
Key Features
Manual Alignment, Automated Bonding: Operators handle panel loading, IC placement, and visual alignment. while the machine controls all thermal and motion parameters—ensuring repeatability without sacrificing flexibility.
Customizable Bonding Heads: Standard head dimensions can be modified to match specific IC footprints and terminal layouts.
Precise Thermal Management: Equipped with multiple high-efficiency 220V cartridge heaters and K-type thermocouples for rapid warm-up, stable temperature profiles. and uniform heat distribution across the bonding area.
Industrial Safety & Ergonomics: Includes dual-hand start buttons to prevent accidental activation, an emergency stop switch. and a compact layout that supports smooth workflow in confined spaces.
Robust Construction: Built with a sturdy frame and industrial-grade components, the machine weighs approximately 430 kilograms . and occupies a footprint of 920 mm wide by 900 mm deep, with a height of 1590 mm.
Power and Air Requirements: Operates on single-phase 220V AC at 2000 watts. and requires compressed air at 0.5 to 0.7 MPa with a flow rate of 450 liters per minute through 8 mm tubing.
Target Applications
The OL-CBS003 is widely used in environments where precision, simplicity, and cost-effectiveness are paramount:
Final assembly or rework of small-format displays for smartphones, smartwatches, automotive dashboards, and industrial instrumentation
Prototyping and failure analysis in academic and corporate R&D labs
Low-volume COG production where full automation is unnecessary
Display repair facilities requiring reliable IC replacement capability
Support and Service
Olian Automatic provides comprehensive support to ensure long-term productivity:
A one-year warranty covers all mechanical and electrical components (excluding consumables and wear parts)
On-site technical service is available within 72 hours for unresolved issues during the warranty period
Customers receive one full day of hands-on training, covering installation, operation, parameter setup, troubleshooting, and routine maintenance
Lifetime remote assistance is offered via phone, email, or video call
Why Choose the OL-CBS003?
For teams working with rigid LCD modules that require dependable COG bonding, the OL-CBS003 delivers a focused, no-frills solution. By separating pre-bonding and main bonding into dedicated stations—and eliminating unnecessary functions like ACF feeding or cleaning—it offers unmatched clarity of purpose, ease of use, and process control.
Developed by Olian Automatic, a certified national high-tech enterprise specializing in display assembly equipment. the OL-CBS003 represents a smart investment for any operation prioritizing quality, reliability, and operational simplicity in COG manufacturing.
Model: OL-CBS003 Type: Manual Dual-Station Pre-Bonding and Main Bonding Machine Max Panel Size: 7 inches (rigid glass only) Core Process: COG bonding of bare ICs to ACF-pre-applied LCDs Excluded Functions: ACF lamination, electrode cleaning. FPC/FOG bonding, flexible substrate support
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