OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine
OL-C0156 – 15.6-Inch Dual-Station IC Servo Main Bonding Machine
High-Efficiency Thermal Compression System for Continuous COG Production
The OL-C0156 by Olian Automatic Equipment Co., Ltd. is a semi-automatic dual-station main bonding machine designed for the final thermal compression of bare driver IC chips onto ACF-pre-laminated edge terminals of large-format rigid LCD panels up to 15.6 inches. Featuring two independent workstations, this system enables continuous operation: while one station is bonding, the operator can load/unload the other—dramatically improving workflow efficiency and reducing idle time.
As a dedicated COG (Chip-on-Glass) main bonder, the OL-C0156 fully cures the anisotropic conductive film (ACF) under precise heat and servo-controlled pressure, ensuring robust electrical connections and long-term display reliability in demanding applications such as automotive dashboards, industrial HMIs, and medical monitors.
⚠️ Note: This machine assumes that ACF has already been applied and the IC has been pre-aligned (e.g., via a pre-bonder). It performs single-zone, single-side bonding only and does not include vision alignment or double-side capability.
🔧 Key Technical Specifications
Substrate & Component Compatibility
Panel Size:
Max: 350 mm × 250 mm (~15.6″ diagonal)
Min: 150 mm × 80 mm (~7″)
Thickness: 0.2 – 2.2 mm
IC Dimensions:
Length: 5 – 40 mm
Width: 0.5 – 3 mm
Thickness: 0.08 – 0.5 mm
Bonding Configuration:
Single-side, single-segment per cycle
Dual independent stations for alternating operation
Bonding Performance
Heating System:
Cartridge-style heating rods (exact size not specified; standard Olian design)
Temperature Range: Room temperature to 400°C
Surface Uniformity: ≤ ±3°C across press head
Pressure Control:
Servo motor-driven actuator for ultra-stable force
HMI: Color touchscreen by Weinview / HMI brand (显控)
Operating Modes:
Manual Mode: Full control over head movement
Auto Mode: One-button cycle after panel placement
Physical Controls:
Start Button (Φ24 mm)
Vacuum Button (Φ24 mm)
Emergency Stop (Φ22 mm, red mushroom type)
Main Power Switch
Process Workflow
Operator loads Panel A onto Station 1 and activates vacuum.
Starts bonding cycle on Station 1.
While bonding occurs, operator loads Panel B onto Station 2.
Upon completion at Station 1, operator unloads Panel A and starts bonding on Station 2.
Cycle repeats—enabling near-continuous production with minimal downtime.
This dual-station layout is ideal for lean manufacturing cells where operator efficiency and throughput are critical.
📏 Machine Physical Data
Dimensions: Approx. 1420 mm (W) × 1210 mm (D) × 1912 mm (H)
Weight: ~780 kg
Work Height: Platform at 890 ± 30 mm from floor—ergonomic for standing operation
Power Supply:
Single-phase AC 220V, 50/60 Hz
Power Consumption: 2000 W
Power cable exits bottom side, ~1.5 m length
Compressed Air:
Pressure: 0.4 – 0.7 MPa
Air Consumption: ~250 L/min
Tube: Transparent Φ8 mm with quick-connect fittings
Vacuum:
Controlled via vacuum button
Flow rate: ~36 L/min
Tube: Yellow color (connected to factory vacuum system)
🛡️ Quality Assurance & Support
Documentation: Includes 1 Chinese-language operation manual
Training: 1-day on-site session covering:
Machine setup and calibration
Dual-station workflow optimization
Parameter tuning for different IC types
Common fault diagnosis and maintenance
Warranty: 12 months on mechanical and electrical systems under normal use
Exclusions: Wear parts (buttons, seals), damage from misuse, or force majeure
After-Sales Service:
Lifetime technical support
On-site engineer within 72 hours if remote troubleshooting fails during warranty
✅ Included Standard Components
Custom IC bonding head (tooling per customer drawing)
Heating elements & thermocouples (K-type)
Φ24 mm start and vacuum buttons
Φ22 mm emergency stop switch
National-standard (GB) maintenance toolkit
🔖 Model Summary
Model: OL-C0156
Function: Dual-station, single-head IC main bonder for COG process
Panel Size: Up to 15.6 inches
Core Advantage: Continuous production flow via dual workstations
Target Industries: Automotive displays, industrial automation, medical electronics, consumer displays
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