OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine

OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine

---

OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine with CCD Alignment

The OL-C012C by Olian Automatic is a dual-station manual main bonding machine with CCD vision alignment. It performs final thermal compression bonding of bare ICs onto rigid LCD panels up to 7 inches.

This system assumes that ACF has already been applied to the panel. The operator places the IC roughly by hand. The built-in CCD system then enables fine visual alignment before main bonding.

Key Features

• Dual independent workstations: left and right stations operate separately
• CCD-assisted alignment: operators view IC and panel marks on a screen for precise positioning
• Servo-controlled bonding: ensures smooth, accurate pressure application
• Manual loading/unloading: all panel handling is done by the operator

Operation Workflow

The operator loads an ACF-pre-laminated panel onto either station.
They place the IC near the terminal area by hand.
Using the CCD display, they adjust the IC position visually for alignment.
After alignment, they press both start buttons with two hands.
The servo-driven hot bar descends automatically.
It applies heat, pressure, and time to complete the main bond.
The head retracts after cooling. The operator removes the panel.

Both stations can be used alternately by one operator or simultaneously by two.

Technical Performance

Bonding temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: 0.1 to 99.0 seconds, adjustable
Pressure range: 20 N to 400 N, servo-regulated
Standard hot bar size: 40 mm × 4.0 mm (custom sizes available)

Heating elements: Φ9.5 × 70 mm cartridge heaters
Temperature sensing: K-type thermocouples

Control & Safety

Control system: PLC + touchscreen interface
Manual backup: physical start and emergency stop buttons
Safety: dual-hand start prevents accidental activation

Physical Specifications

Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approx. 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, Φ8 mm tubing

Applications

Designed exclusively for main bonding of bare driver ICs on:

• Rigid TFT, IPS, or OLED glass panels
• Panels with pre-applied ACF

Important Notes

This machine does not perform:

• ACF lamination
• Fully automatic alignment

Its role is final IC/COF/FPC curing with visual alignment aid.

Support & Warranty

• One-year warranty (excludes wear parts like heating tubes)
• On-site service within 72 hours if remote support fails during warranty
• One-day training covers setup, operation, parameter tuning, and maintenance
• Lifetime technical support provided

---

Model: OL-C012C
Type: Dual-Station Main Bonding Machine with CCD
Function: Final IC Thermal Bonding with Visual Alignment
Max Panel Size: 7 inches (rigid glass only)
Core Advantage: Combines manual flexibility with CCD-assisted precision

SEO Keywords:
CCD main bonding machine, OL-C012C, Olian Automatic IC bonder with vision, 7-inch dual-station hot bar press, servo main bonder with CCD alignment, COG final bonding equipment, thermal compression machine for LCD IC, manual IC aligner with camera, rigid display main bonding system, hot bar bonder with visual alignment.