Compatibility: Can be used with other devices from the same company.
2. Working Principle
The process involves:
ACF Application: Anisotropic Conductive Film (ACF) is precisely applied to the glass substrate.
Tape Attachment: A tape is attached to the FPC for easier handling and alignment.
Precision Alignment: Advanced vision systems align the FPC with the glass substrate at a high – precision level.
Bonding Process: Heat and pressure are applied to activate the ACF, forming a stable connection.
3. Product Specifications
LCD Specifications: Size ranges from L 20mm * W 20mm to L 230mm * W 120mm, thickness between 0.15mm and 1.1mm.
IC/COF Specifications: Terminal pitch of at least 30um, Mark pitch of 5-70mm.
ACF Specifications: Available in reel – to – reel, 2 – layer or 3 – layer types, with specific application dimensions and material properties.
4. Machine Performance
Production Accuracy: High – precision alignment and bonding with specified tolerances for ACF application and IC/COF bonding.
Production Beat: Efficient production rates with specified time limits for each process step.
5. Process Parameters
Temperature Control: Wide temperature range for different bonding stages, with precise control methods.
Time Setting: Adjustable time ranges for each bonding stage.
Pressure Control: Variable pressure ranges for ACF application, pre-bonding, and main bonding.
6. Overall Machine Specifications
Dimensions: Machine length around 2800mm, width around 1350mm, height around 1800mm.
Weight: Approximately 3000KG.
Color: White, with customization options.
Operating Environment: Requires a cleanroom environment of 1000 – class or below.
Power Supply: Three – phase, 380V with specific power requirements.
Pneumatic and Vacuum Requirements: Detailed specifications for air pressure, consumption, and vacuum levels.
7. Unit Specifications
Detailed specifications for each unit involved in the bonding process, including material handling, alignment, bonding, and quality control.
8. Control System
Control Method: PLC control with a touch screen interface for easy operation and parameter adjustment.
Safety Features: Emergency stop buttons, interlock design, and alarm systems for safe operation.
9. Documentation and After – sales Service
Comprehensive documentation and training provided, along with after – sales service details.
10. Main Components
Information on the brands and origins of key components used in the machine, ensuring quality and reliability.
This Full – automatic COG/COF Bonder is designed for high – precision and efficient bonding processes in the electronics manufacturing industry, particularly for LCD products. It integrates multiple processes into a single machine, offering customizable solutions to meet specific production needs.
