The OL-FPD005 by Olian Automatic is a single-station manual pulse pre-bonding machine. It is designed for COF (Chip-on-Flex) alignment and thermal pre-compression on panels up to 7 inches. The system supports both rigid glass and flexible displays.
This machine requires operators to perform all loading, alignment, and bonding steps manually. It provides precise thermal and pressure control during pre-bonding but does not include vision alignment or automatic motion.
The operator places the panel on the worktable. They press a vacuum button to secure it.
Next, they position the COF on the COF stage and align it roughly with the panel terminals. Vacuum holds the COF in place.
The operator then uses the display screen to fine-tune alignment visually.
After confirming alignment, they press the pre-bond button once—the left press head descends without heating to check contact.
Pressing the same button again lifts the head.
If alignment is acceptable, the operator presses two start buttons simultaneously with both hands. The head then lowers automatically, applies heat, and performs pulse pre-bonding.
When the set time ends, the system blows air to cool the bond area. The head retracts. The cycle is complete.
Finally, the operator removes the bonded panel manually.
All steps are manual except the controlled descent, heating, timing, cooling, and lift during the final bonding phase.
The left press head heats from room temperature to 400°C using pulse heating. Surface temperature uniformity is within ±8°C.
Heating time is adjustable from 0.1 to 99.9 seconds.
Bonding force ranges from 20 N to 300 N.
The standard press head size is 50 mm long × 0.8 mm thick, but custom sizes are available.
Only one operator is needed. All loading and unloading happen at the same position.
The machine includes a display screen for visual alignment reference.
It uses industrial-standard controls: Φ24 vacuum and start buttons, and a Φ22 emergency stop switch.
Core components include a 9.5 mm × 70 mm heating tube, a K-type thermocouple, and a custom hot press head.
Ideal for:
Note: This machine does not apply ACF, does not bond ICs, and has no automated vision system. ACF must be pre-laminated before use.
Olian Automatic offers a one-year warranty on parts and labor (excluding wear items).
On-site service is provided within 72 hours if remote support fails during warranty.
One day of training covers installation, operation, parameter setup, troubleshooting, and consumable replacement.
Lifetime technical support is available.
Model: OL-FPD005
Type: Manual Pulse Pre-Bonding Machine
Function: COF Pre-Bonding Only
Panel Size: Up to 7 inches
Substrates: Glass or Flexible Panels
Operation: Fully manual alignment; semi-automated thermal bonding
SEO Keywords:
Manual COF pre-bonding machine, OL-FPD005, Olian Automatic pulse bonder, 7-inch COF alignment press, hand-operated thermal pre-bonder, COF bonding for flexible display, single-station COF machine, pulse heating bonding system, manual LCD COF pre-compression, hot bar pre-bond equipment.
The OL-COF003 by Olian Automatic is a medium-speed semi-automatic pre-bonding machine. It bonds ICs or COFs onto ACF-pre-applied panels. The system supports both rigid glass and flexible displays up to 7 inches.
This machine is designed for high-precision alignment and thermal pre-compression. Operators load and unload panels manually. All other steps—IC/COF pickup, vision alignment, and pre-bonding—are automated.
The OL-COF003 handles two main workflows: IC pre-bonding and COF pre-bonding.
For IC bonding, the operator loads IC trays (2-inch, 3-inch, or 4-inch). The machine uses a servo motor, lead screw, and linear guide to move the IC stage. A vacuum nozzle picks up the IC. A dedicated jig corrects IC position from both sides. The head then moves down for CCD imaging of IC marks. After vision alignment with the panel mark, the machine performs pre-bonding automatically.
For COF bonding, the operator places COF on a PEEK adsorption platform. The COF stage is driven by a cylinder for left-right motion. Vacuum holds the COF in place. A quartz back-pressure unit ensures flatness during pickup. The bonding head adsorbs the COF, retracts the stage, and moves down for CCD imaging. The system then aligns the COF with the panel and completes pre-bonding.
Panel loading is manual. The operator places the panel on the stage and presses a vacuum button. The stage then moves automatically to the alignment position. After bonding, it returns to the loading position for easy removal.
Temperature control ranges from room temperature to 150°C. Surface uniformity stays within ±5°C.
Bonding time is adjustable from 0.1 to 99.0 seconds.
Pressure is precisely controlled between 20 N and 120 N.
The machine uses industrial-grade components for reliability. It includes safety interlocks and user-friendly controls.
The unit measures 650 mm wide, 660 mm deep, and 1340 mm tall. It weighs about 230 kg.
It runs on single-phase 220V AC at 1500W.
Compressed air must be 0.5–0.7 MPa with a flow rate of 450 L/min, using 8 mm tubing.
Ideal for small-batch production, pilot lines, and R&D.
Supports:
Note: ACF must be pre-applied before use. This machine does not apply ACF.
Olian Automatic provides one year of warranty (excluding wear parts).
On-site service is available within 72 hours if phone support fails.
One day of training covers setup, operation, troubleshooting, and part replacement.
Lifetime technical support is included.
Model: OL-COF003
Type: Semi-Automatic Pre-Bonding Machine
Max Panel Size: 7 inches
Processes: IC Pre-Bonding, COF Pre-Bonding
Substrates: Rigid Glass, Flexible Displays
Operation: Manual panel load/unload; automatic alignment and bonding
Semi-automatic pre-bonding machine, OL-COF003, Olian Automatic COF bonder, 7-inch IC pre-bonder, medium-speed COG FOG pre-bond machine, vision alignment bonding system, thermal pre-compression for display, COF pickup and bond equipment, IC correction and bonding workstation, ACF pre-bond machine for rigid and flexible panels.
The OL-CBS003 by Olian Automatic is a purpose-built manual thermal bonding system designed exclusively for Chip-on-Glass (COG) assembly of rigid LCD panels up to 7 inches.
This dual-station machine integrates two critical stages of the COG process—pre-bonding and main bonding—into a single, space-efficient platform, enabling reliable attachment of bare driver ICs to glass substrates that have already been pre-laminated with anisotropic conductive film (ACF).
The OL-CBS003 assumes ACF has been applied in a prior step using a separate laminating machine. It does not perform ACF application, electrode cleaning (EC), FPC handling, or FOG bonding.
Instead, it focuses solely on precision thermal compression to ensure high-yield IC-to-glass interconnection—making it ideal for repair centers, R&D labs, pilot lines, and low-volume display production.
The machine features two independent workstations arranged side by side:
Both stations operate independently, allowing one operator to manage the entire sequence efficiently while minimizing cross-contamination and handling errors.
The OL-CBS003 is widely used in environments where precision, simplicity, and cost-effectiveness are paramount:
Olian Automatic provides comprehensive support to ensure long-term productivity:
For teams working with rigid LCD modules that require dependable COG bonding, the OL-CBS003 delivers a focused, no-frills solution. By separating pre-bonding and main bonding into dedicated stations—and eliminating unnecessary functions like ACF feeding or cleaning—it offers unmatched clarity of purpose, ease of use, and process control.
Developed by Olian Automatic, a certified national high-tech enterprise specializing in display assembly equipment. the OL-CBS003 represents a smart investment for any operation prioritizing quality, reliability, and operational simplicity in COG manufacturing.
Model: OL-CBS003
Type: Manual Dual-Station Pre-Bonding and Main Bonding Machine
Max Panel Size: 7 inches (rigid glass only)
Core Process: COG bonding of bare ICs to ACF-pre-applied LCDs
Excluded Functions: ACF lamination, electrode cleaning. FPC/FOG bonding, flexible substrate support
SEO Keywords:
Manual COG bonding machine, dual-station IC bonder, OL-CBS003 Olian Automatic pre and main bonding press, 7-inch LCD IC attachment system. thermal compression bonding machine for COG,bonder for driver IC, manual IC alignment workstation, COG assembly equipment for rigid displays, small-panel IC bonding machine.
OL-A003D 7-Inch Single-Edge Single-Stage ACF Laminating Machine – Compact, Manual Thermal Bonding System for Precision Display Assembly.
The OL-A003D by Olian Automation is a compact, semi-automatic ACF (Anisotropic Conductive Film) laminating machine designed for high-precision bonding of ACF onto LCD panels, flexible printed circuits (FPCs), or rigid PCBs. Optimized for small-format displays up to 7 inches, this manual ACF bonding machine features a 150 mm heated press head and supports both rigid glass substrates and flexible display modules, making it ideal for R&D labs, pilot lines, repair centers, and low-volume production environments.
Unlike complex automated systems, the OL-A003D simplifies the ACF bonding process: operators manually load and unload the panel, while the machine automatically executes the thermal compression cycle, ACF feeding, peeling, and cutting—ensuring consistent, repeatable results with minimal training.
The OL-A003D is widely used in:
Built with robust mechanical design and standard industrial components, the OL-A003D ensures long-term stability. Olian Automation provides:
For engineers seeking a cost-effective 7-inch ACF laminating machine, a compact manual ACF bonder, or a single-stage thermal bonding system for rigid and flexible displays, the OL-A003D delivers exceptional value. Its blend of simplicity, safety, and precision makes it a trusted choice across global electronics manufacturing and development sectors.
Model: OL-A003D
Type: Manual Single-Edge ACF Laminating Machine
Max Panel Size: 7 inches
Press Head Length: 150 mm (standard)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Users: Display assemblers, electronics OEMs, R&D labs, repair technicians
SEO Keywords Integrated:
ACF laminating machine, manual ACF bonding machine, 7-inch ACF bonder, single-edge ACF applicator, Olian OL-A003D, thermal compression ACF machine, LCD ACF bonding equipment, FPC to glass laminator, small display ACF贴附机, benchtop ACF bonding system, single-stage ACF laminator, anisotropic conductive film bonder, rigid and flexible display bonding, COG pre-bonding machine, compact ACF applicator.
OL-A003 Semi-Automatic 12-Inch ACF Laminating Machine – Precision Thermal Bonding for LCD, FPC, and Display Module Assembly。
The OL-A003 semi-automatic ACF laminating machine by Olian Automation is a compact, high-accuracy bonding system engineered for reliable application of anisotropic conductive film (ACF) onto LCD panels, flexible printed circuits (FPCs), and printed circuit boards (PCBs). Designed for R&D labs, pilot production lines, and small-to-medium batch manufacturing, this manual ACF bonding machine supports panel sizes from 1 inch up to 12 inches, making it ideal for applications in consumer electronics, automotive displays, medical devices, and industrial HMIs.
Unlike fully automated systems that require complex integration, the OL-A003 desktop ACF bonder strikes the perfect balance between operator control and process automation. Users manually load and unload the panel, while the machine automatically handles ACF feeding, thermal compression bonding, carrier film peeling, and precision cutting—ensuring consistent results with minimal training.
The OL-A003 is built with reliability in mind. It features:
This semi-auto ACF laminator is widely used in:
For engineers and procurement teams searching for a cost-effective 12-inch ACF bonding machine, a benchtop ACF laminating system, or a manual ACF bonder with high positional accuracy, the OL-A003 delivers exceptional value. It eliminates the complexity and cost of full automation while maintaining the precision required for modern micro-electronics assembly.
Backed by Olian Automatic—a certified national high-tech enterprise specializing in LCM automation solutions—the OL-A003 combines proven engineering, robust component selection, and user-centric design into one dependable platform.
Model: OL-A003
Type: Semi-Automatic ACF Laminating Machine
Panel Size Range: 1″ to 12″
Bonding Accuracy: ±0.2 mm (X/Y)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Industries: Display manufacturing, electronics assembly, R&D, repair
SEO Keywords Integrated:
ACF laminating machine, ACF bonding machine, manual ACF bonder, semi-automatic ACF laminator, 12-inch ACF bonding equipment, LCD ACF bonding machine, FPC to LCD laminator, anisotropic conductive film bonder, desktop ACF bonding system, benchtop ACF laminator, COG pre-bonding machine, FOG bonding equipment, Olian OL-A003, thermal compression ACF machine, small panel ACF applicator, high-precision ACF bonder, ESD-safe ACF laminator.
Green-Light Nanosecond Glass Laser Drilling Machine,
Processing Advantages
Infrared Nanosecond Glass Laser Drilling Machine
Process Application
Main Parameters
Processing Advantages
Infrared Picosecond Dual-Platform Glass Laser Cutting Machine
Cuts all hard-brittle sheet materials: ordinary glass, optical glass, quartz, sapphire, reinforced glass, optical filters, mirrors, etc. The same system also produces internal cut-outs and holes to specified dimensions.
Laser type: Infrared picosecond
Model: OL-IPC70120-D/OL-IPC90140-D
Standard platform sizes: 700 mm × 1 200 mm and 900 mm × 1 400 mm (custom sizes on request)
Thickness range: 0.03 – 8 mm
Maximum cutting speed: 1 000 mm/s
Edge chipping: ≤ 10 µm
Single-Platform Laser Processing Equipment
Engineered for cutting and drilling every kind of brittle, hard sheet: common glass, optical glass, quartz, sapphire, strengthened glass, optical filters, ceramics, etc.
Cutting Configuration – Infrared Picosecond
Model series: OL-IPC4050-S，
Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 8 mm.
Cutting speed: 0 – 1 000 mm/s.
Edge chipping: ≤ 10 µm.
Drilling Configuration – Green Nanosecond.
Model series: OL-GND4050-S.
Table size: 400 mm × 500 mm (custom sizes available).
Thickness range: 0.03 – 2 mm.
Drilling speed: 0 – 5 000 mm/s.
Edge chipping: ≤ 100 µm.
Processing Advantages
The machine merges modular architecture with high-density integration, re-engineers the conventional optical path and support structure, and enables on-the-fly switching between cutting and drilling on the same platform. An adaptive process controller guarantees micron-level precision across multiple materials.
Single-Platform Green Picosecond Laser Glass Cutting Machine
Model: OL-GP4050S
Consumer demand for pristine mobile screens, camera cover glass and other brittle components forces suppliers to achieve higher cutting strength, minimal chipping, excellent edge verticality, high throughput and low cost. Traditional CNC machining consumes cutting fluids, delivers limited accuracy, suffers rapid tool wear and demands large floorspace and labour. The OL-GP4050S was therefore developed to give optical workshops a cleaner, faster and more economical alternative.
Product name: OL-GP4050S single-platform green picosecond laser glass cutting machine.
The system performs dry, dust-free laser ablation of flat glass at several times the speed of conventional methods. A high-precision XY linear motor stage and granite base secure micron-level accuracy and long-term stability.
Effective processing area: 300 mm × 300 mm.
Single-pass cutting depth for K9 glass: up to 3 mm.
Power supply: AC 220 V ± 5 %, single-phase with earth, total load < 4 kW.
Ambient temperature: 24 – 26 °C.
Relative humidity: 10 – 70 %, non-condensing, clean room recommended.
Overall dimensions: length 1 400 mm, width 1 050 mm, height 1 950 mm (without beacon).
Approximate weight: 1 000 kg.
Floor loading: at least 500 kg m⁻².
include optical glass, coated glass, soda-lime glass, sapphire and quartz. High-temperature cleaving is not advised for heat-sensitive coatings.
Processing principle: a 532 nm green picosecond beam creates equally spaced filamentary holes inside the material. A linear motor moves the workpiece so the filaments form a controlled micro-crack line, enabling clean separation. Pulse width < 10 ps confines energy to a tiny volume, so the process is virtually athermal and produces no melt or large HAZ.
Laser source: 50 W green picosecond laser, 50 kHz, 1 mJ pulse energy, water-cooled.
Cutting head: 3 mm depth-of-focus Bessel type for long filament and small spot.
Motion platform: X-Y-Z stages. X and Y driven by linear motors on granite; travel 300 mm × 300 mm; maximum speed 1 000 mm s⁻¹ with 1 g acceleration; positioning accuracy ≤ ±2 µm, repeatability ≤ ±1 µm. Z axis servo-driven, 50 mm travel, focus step resolution 10 µm.
Vision system: 5 MP MindVision CCD, point plus ring illuminator, automatic Mark capture, alignment accuracy ≤ ±3 µm.
Control software: proprietary Windows-based package reads DXF and DWG files; integrates high-precision motion card with PSO (position-synchronized output) for on-the-fly laser triggering. Industrial PC with Taiwan-imported motherboard, LCD monitor, wireless keyboard and mouse.
Hardware: Grade 00 granite base, vacuum chuck for workpiece fixation. Low-voltage elements by Schneider, switch-mode power supplies by Mean Well.
Use the machine only on transparent brittle materials. Do not process metals or temperature-sensitive coated products. Install the unit in a clean, well-ventilated room free of corrosive or acidic vapours.
Daily: remove dust and processing debris.
Weekly: inspect and clean protective lenses.
Monthly: replace chilled-water coolant (distilled or de-ionised water only).
Quarterly: replace coolant filter cartridge.
Photographs in the original file show typical cuts on strengthened glass, sapphire wafers and quartz substrates: edges are smooth, chips < 5 µm, no micro-cracks or discoloration.
