Advanced Flexible Display bonding dispensing production solution

Advanced Flexible Display bonding dispensing production solution

Advanced Flexible Display Bonding Dispensing Production Solution

In the rapidly evolving landscape of display technology, the production of advanced flexible OLED displays demands a highly sophisticated and versatile bonding and dispensing solution. Our Advanced Flexible Display Bonding Dispensing Production Solution is designed to meet these demands, offering a comprehensive and integrated approach to ensure high efficiency, precision, and adaptability.

Key Features of the Solution

1. Integrated Bonding Technologies
   • Unified COG/FOG, COF/FOF, COP/FOP Processes: Our solution combines three key bonding technologies—COG/FOG, COF/FOF, and COP/FOP—into a single, unified process. This allows for the production of a wide range of display modules, from flexible to rigid OLEDs, without the need to switch machines. This integrated approach is ideal for future display modules where diverse bonding processes are required.
2. Dual Handling and Bonding Mode
   • High-Speed Production: The equipment features a dual handling and dual bonding mode, achieving a tact time of 3.5 seconds. This high-speed production capability ensures maximum efficiency and throughput, making it suitable for large-scale manufacturing.
3. Comprehensive Production Line Configuration
   • Fully Integrated Line: The solution includes a complete production line configuration, featuring:
     • Automated Loading Machines: Efficiently load substrates into the production line.
     • Cleaning Machines: Ensure high-purity cleaning of substrates to remove contaminants.
     • COF/COG/COP Bonding Machines: Attach driver ICs and flexible circuits with high precision.
     • COF Cutting and IC Loading Machines: Perform COF cutting and IC loading in a single step.
     • FOF/FOG/FOP Bonding Machines: Bond flexible printed circuits (FPCs) to the glass or flexible substrates.
     • FPC Automatic Loading Machines: Automate the loading of FPCs to ensure consistent and precise placement.
     • Flip Machines: Facilitate the flipping of substrates for multi-sided processing.
     • Particle AOI Inspection Machines: Detect and remove particle contaminants to ensure high-quality bonding.
     • Impedance Testers: Verify the electrical integrity of the bonded components.
     • T-FOG and T-FOF Bonding: Perform thermal bonding for enhanced durability and reliability.
   • Seamless Integration: The entire line is designed to be seamless and efficient, with reserved material inlets for manual loading if needed, ensuring flexibility and adaptability.
4. Precision and Quality Control
   • High Precision Standards: The solution meets stringent precision standards, ensuring high-quality and reliable display modules. Key precision metrics include:
     • Droplet Angle Precision: For rigid screens, ≤20°.
     • Cleaning Effect: Minimum distance from CF edge: ≥0.2mm.
     • ACF Attachment: X: ±0.1mm, Y: ±0.1mm.
     • COG Bonding Precision: X: ±0.004mm, Y: ±0.004mm.
     • COF Bonding Precision: X: ±0.004mm, Y: ±0.005mm.
     • COP Bonding Precision: X: ±0.005mm, Y: ±0.005mm.
     • COF Cutting Precision: ±0.05mm.
     • FOG Bonding Precision: X: ±0.012mm, Y: ±0.012mm.
     • FOF Bonding Precision: X: ±0.015mm, Y: ±0.015mm.
     • FOP Bonding Precision: X: ±0.015mm, Y: ±0.015mm.
5. Product Size Range
   • Versatile Size Coverage: The solution supports a wide range of product sizes from 1″ to 8″, making it suitable for various applications, including smart wearables and flexible screen smartphones.
6. High Uptime and Reliability
   • High Uptime and Reliability: The solution ensures a high uptime of ≥98%, minimizing downtime and maximizing production efficiency.

Optional Features

• COFUSC and Velvet Cleaning: Enhanced cleaning options for OnCell cleaning and T-FOG bonding on both sides.
• Plasma Brand Specification: The solution allows for the specification of preferred plasma brands, ensuring compatibility and performance.

Advanced Flexible Display Bonding Dispensing Production Solution Conclusion

Our Advanced Flexible Display Bonding Dispensing Production Solution is designed to meet the future demands of the display industry, offering a versatile, high-precision, and efficient production process. By integrating multiple bonding technologies and ensuring high-quality standards, our solution is ideal for manufacturers looking to produce a wide range of advanced display modules. Choose our solution to stay ahead in the competitive market and deliver top-quality products.